KR20230044981A - 유기 el 표시 소자용 봉지제 - Google Patents

유기 el 표시 소자용 봉지제 Download PDF

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Publication number
KR20230044981A
KR20230044981A KR1020227028289A KR20227028289A KR20230044981A KR 20230044981 A KR20230044981 A KR 20230044981A KR 1020227028289 A KR1020227028289 A KR 1020227028289A KR 20227028289 A KR20227028289 A KR 20227028289A KR 20230044981 A KR20230044981 A KR 20230044981A
Authority
KR
South Korea
Prior art keywords
organic
display elements
epoxy compound
polymerization initiator
sealing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227028289A
Other languages
English (en)
Korean (ko)
Inventor
마리코 아베
다카키 고바야시
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20230044981A publication Critical patent/KR20230044981A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020227028289A 2020-07-27 2021-07-19 유기 el 표시 소자용 봉지제 Pending KR20230044981A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-126269 2020-07-27
JP2020126269 2020-07-27
PCT/JP2021/026968 WO2022024839A1 (ja) 2020-07-27 2021-07-19 有機ｅｌ表示素子用封止剤

Publications (1)

Publication Number Publication Date
KR20230044981A true KR20230044981A (ko) 2023-04-04

Family

ID=80036656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227028289A Pending KR20230044981A (ko) 2020-07-27 2021-07-19 유기 el 표시 소자용 봉지제

Country Status (4)

Country Link
JP (1) JP7784305B2 (https=)
KR (1) KR20230044981A (https=)
CN (1) CN115024023B (https=)
WO (1) WO2022024839A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024134951A1 (ja) * 2022-12-23 2024-06-27 ナミックス株式会社 エポキシ樹脂組成物、硬化物、及び半導体装置
CN117389085A (zh) * 2023-12-13 2024-01-12 江苏繁华应材科技股份有限公司 电致变色防眩镜及其制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067598A (ja) 2012-09-26 2014-04-17 Toppan Printing Co Ltd 有機エレクトロルミネッセンスパネル及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009019077A (ja) * 2007-07-10 2009-01-29 Kyocera Chemical Corp 硬化性組成物、表示素子用接着剤及び接着方法
JP2016166279A (ja) * 2015-03-09 2016-09-15 三菱化学株式会社 熱硬化性樹脂組成物およびその成形体
CN106459374B (zh) * 2015-02-13 2020-10-13 积水化学工业株式会社 有机电致发光显示元件用密封剂
JP6200591B2 (ja) * 2015-04-17 2017-09-20 積水化学工業株式会社 インクジェット塗布用電子デバイス用封止剤及び電子デバイスの製造方法
CN108781489B (zh) * 2016-09-16 2023-02-07 积水化学工业株式会社 有机电致发光显示元件用密封剂
JP2018095679A (ja) * 2016-12-08 2018-06-21 三井化学株式会社 シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
KR102058827B1 (ko) * 2016-12-28 2019-12-24 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 적층판, 금속박 피복 적층판, 프린트 배선판, 및 다층 프린트 배선판
CN110603899B (zh) * 2017-06-02 2023-04-04 积水化学工业株式会社 有机el显示元件用密封剂
CN111492029B (zh) * 2017-12-18 2023-12-22 株式会社Lg化学 封装组合物
WO2020116267A1 (ja) * 2018-12-07 2020-06-11 積水化学工業株式会社 表示素子用シール剤、硬化物、上下導通材料、及び、表示素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067598A (ja) 2012-09-26 2014-04-17 Toppan Printing Co Ltd 有機エレクトロルミネッセンスパネル及びその製造方法

Also Published As

Publication number Publication date
JP7784305B2 (ja) 2025-12-11
WO2022024839A1 (ja) 2022-02-03
JPWO2022024839A1 (https=) 2022-02-03
CN115024023A (zh) 2022-09-06
CN115024023B (zh) 2026-03-06

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