CN115024023B - 有机el显示元件用密封剂 - Google Patents

有机el显示元件用密封剂

Info

Publication number
CN115024023B
CN115024023B CN202180011165.7A CN202180011165A CN115024023B CN 115024023 B CN115024023 B CN 115024023B CN 202180011165 A CN202180011165 A CN 202180011165A CN 115024023 B CN115024023 B CN 115024023B
Authority
CN
China
Prior art keywords
organic
epoxy compound
sealant
display element
polymerization initiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180011165.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN115024023A (zh
Inventor
安部真理子
小林崇希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN115024023A publication Critical patent/CN115024023A/zh
Application granted granted Critical
Publication of CN115024023B publication Critical patent/CN115024023B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CN202180011165.7A 2020-07-27 2021-07-19 有机el显示元件用密封剂 Active CN115024023B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-126269 2020-07-27
JP2020126269 2020-07-27
PCT/JP2021/026968 WO2022024839A1 (ja) 2020-07-27 2021-07-19 有機ｅｌ表示素子用封止剤

Publications (2)

Publication Number Publication Date
CN115024023A CN115024023A (zh) 2022-09-06
CN115024023B true CN115024023B (zh) 2026-03-06

Family

ID=80036656

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180011165.7A Active CN115024023B (zh) 2020-07-27 2021-07-19 有机el显示元件用密封剂

Country Status (4)

Country Link
JP (1) JP7784305B2 (https=)
KR (1) KR20230044981A (https=)
CN (1) CN115024023B (https=)
WO (1) WO2022024839A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024134951A1 (ja) * 2022-12-23 2024-06-27 ナミックス株式会社 エポキシ樹脂組成物、硬化物、及び半導体装置
CN117389085A (zh) * 2023-12-13 2024-01-12 江苏繁华应材科技股份有限公司 电致变色防眩镜及其制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018095679A (ja) * 2016-12-08 2018-06-21 三井化学株式会社 シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
WO2019124924A1 (ko) * 2017-12-18 2019-06-27 주식회사 엘지화학 봉지용 조성물

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009019077A (ja) * 2007-07-10 2009-01-29 Kyocera Chemical Corp 硬化性組成物、表示素子用接着剤及び接着方法
JP6098091B2 (ja) 2012-09-26 2017-03-22 凸版印刷株式会社 有機エレクトロルミネッセンスパネルの製造方法
JP2016166279A (ja) * 2015-03-09 2016-09-15 三菱化学株式会社 熱硬化性樹脂組成物およびその成形体
CN106459374B (zh) * 2015-02-13 2020-10-13 积水化学工业株式会社 有机电致发光显示元件用密封剂
JP6200591B2 (ja) * 2015-04-17 2017-09-20 積水化学工業株式会社 インクジェット塗布用電子デバイス用封止剤及び電子デバイスの製造方法
CN108781489B (zh) * 2016-09-16 2023-02-07 积水化学工业株式会社 有机电致发光显示元件用密封剂
KR102058827B1 (ko) * 2016-12-28 2019-12-24 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 적층판, 금속박 피복 적층판, 프린트 배선판, 및 다층 프린트 배선판
CN110603899B (zh) * 2017-06-02 2023-04-04 积水化学工业株式会社 有机el显示元件用密封剂
WO2020116267A1 (ja) * 2018-12-07 2020-06-11 積水化学工業株式会社 表示素子用シール剤、硬化物、上下導通材料、及び、表示素子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018095679A (ja) * 2016-12-08 2018-06-21 三井化学株式会社 シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
WO2019124924A1 (ko) * 2017-12-18 2019-06-27 주식회사 엘지화학 봉지용 조성물

Also Published As

Publication number Publication date
JP7784305B2 (ja) 2025-12-11
WO2022024839A1 (ja) 2022-02-03
JPWO2022024839A1 (https=) 2022-02-03
CN115024023A (zh) 2022-09-06
KR20230044981A (ko) 2023-04-04

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