JPWO2022024839A1 - - Google Patents

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Publication number
JPWO2022024839A1
JPWO2022024839A1 JP2021544385A JP2021544385A JPWO2022024839A1 JP WO2022024839 A1 JPWO2022024839 A1 JP WO2022024839A1 JP 2021544385 A JP2021544385 A JP 2021544385A JP 2021544385 A JP2021544385 A JP 2021544385A JP WO2022024839 A1 JPWO2022024839 A1 JP WO2022024839A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021544385A
Other languages
Japanese (ja)
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JP7784305B2 (ja
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Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022024839A1 publication Critical patent/JPWO2022024839A1/ja
Application granted granted Critical
Publication of JP7784305B2 publication Critical patent/JP7784305B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
JP2021544385A 2020-07-27 2021-07-19 有機ｅｌ表示素子用封止剤 Active JP7784305B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020126269 2020-07-27
JP2020126269 2020-07-27
PCT/JP2021/026968 WO2022024839A1 (ja) 2020-07-27 2021-07-19 有機ｅｌ表示素子用封止剤

Publications (2)

Publication Number Publication Date
JPWO2022024839A1 true JPWO2022024839A1 (https=) 2022-02-03
JP7784305B2 JP7784305B2 (ja) 2025-12-11

Family

ID=80036656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021544385A Active JP7784305B2 (ja) 2020-07-27 2021-07-19 有機ｅｌ表示素子用封止剤

Country Status (4)

Country Link
JP (1) JP7784305B2 (https=)
KR (1) KR20230044981A (https=)
CN (1) CN115024023B (https=)
WO (1) WO2022024839A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024134951A1 (ja) * 2022-12-23 2024-06-27 ナミックス株式会社 エポキシ樹脂組成物、硬化物、及び半導体装置
CN117389085A (zh) * 2023-12-13 2024-01-12 江苏繁华应材科技股份有限公司 电致变色防眩镜及其制作方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009019077A (ja) * 2007-07-10 2009-01-29 Kyocera Chemical Corp 硬化性組成物、表示素子用接着剤及び接着方法
WO2016129472A1 (ja) * 2015-02-13 2016-08-18 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP2016166279A (ja) * 2015-03-09 2016-09-15 三菱化学株式会社 熱硬化性樹脂組成物およびその成形体
WO2016167347A1 (ja) * 2015-04-17 2016-10-20 積水化学工業株式会社 電子デバイス用封止剤及び電子デバイスの製造方法
JP2018095679A (ja) * 2016-12-08 2018-06-21 三井化学株式会社 シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
WO2018124169A1 (ja) * 2016-12-28 2018-07-05 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板
WO2019124924A1 (ko) * 2017-12-18 2019-06-27 주식회사 엘지화학 봉지용 조성물
WO2020116267A1 (ja) * 2018-12-07 2020-06-11 積水化学工業株式会社 表示素子用シール剤、硬化物、上下導通材料、及び、表示素子

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6098091B2 (ja) 2012-09-26 2017-03-22 凸版印刷株式会社 有機エレクトロルミネッセンスパネルの製造方法
CN108781489B (zh) * 2016-09-16 2023-02-07 积水化学工业株式会社 有机电致发光显示元件用密封剂
CN110603899B (zh) * 2017-06-02 2023-04-04 积水化学工业株式会社 有机el显示元件用密封剂

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009019077A (ja) * 2007-07-10 2009-01-29 Kyocera Chemical Corp 硬化性組成物、表示素子用接着剤及び接着方法
WO2016129472A1 (ja) * 2015-02-13 2016-08-18 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP2016166279A (ja) * 2015-03-09 2016-09-15 三菱化学株式会社 熱硬化性樹脂組成物およびその成形体
WO2016167347A1 (ja) * 2015-04-17 2016-10-20 積水化学工業株式会社 電子デバイス用封止剤及び電子デバイスの製造方法
JP2018095679A (ja) * 2016-12-08 2018-06-21 三井化学株式会社 シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
WO2018124169A1 (ja) * 2016-12-28 2018-07-05 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板
WO2019124924A1 (ko) * 2017-12-18 2019-06-27 주식회사 엘지화학 봉지용 조성물
WO2020116267A1 (ja) * 2018-12-07 2020-06-11 積水化学工業株式会社 表示素子用シール剤、硬化物、上下導通材料、及び、表示素子

Also Published As

Publication number Publication date
JP7784305B2 (ja) 2025-12-11
WO2022024839A1 (ja) 2022-02-03
CN115024023A (zh) 2022-09-06
KR20230044981A (ko) 2023-04-04
CN115024023B (zh) 2026-03-06

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