KR20230010619A - 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품 - Google Patents

광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품 Download PDF

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KR20230010619A
KR20230010619A KR1020227029113A KR20227029113A KR20230010619A KR 20230010619 A KR20230010619 A KR 20230010619A KR 1020227029113 A KR1020227029113 A KR 1020227029113A KR 20227029113 A KR20227029113 A KR 20227029113A KR 20230010619 A KR20230010619 A KR 20230010619A
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South Korea
Prior art keywords
moisture
meth
resin composition
curable resin
acrylate
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KR1020227029113A
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English (en)
Korean (ko)
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료마 이시다테
모토미 시오지마
신지 가와다
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세키스이가가쿠 고교가부시키가이샤
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Publication of KR20230010619A publication Critical patent/KR20230010619A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/048—Joining glass to metal by means of an interlayer consisting of an adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/302—Water
    • C08G18/307—Atmospheric humidity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
KR1020227029113A 2020-05-15 2021-05-14 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품 KR20230010619A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020086327 2020-05-15
JPJP-P-2020-086327 2020-05-15
PCT/JP2021/018498 WO2021230373A1 (ja) 2020-05-15 2021-05-14 光湿気硬化型樹脂組成物、電子部品用接着剤、硬化体、及び電子部品

Publications (1)

Publication Number Publication Date
KR20230010619A true KR20230010619A (ko) 2023-01-19

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ID=78525180

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Application Number Title Priority Date Filing Date
KR1020227029113A KR20230010619A (ko) 2020-05-15 2021-05-14 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품
KR1020227028022A KR20230013015A (ko) 2020-05-15 2021-05-14 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품
KR1020227028021A KR20230013014A (ko) 2020-05-15 2021-05-14 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품

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KR1020227028022A KR20230013015A (ko) 2020-05-15 2021-05-14 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품
KR1020227028021A KR20230013014A (ko) 2020-05-15 2021-05-14 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품

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JP (3) JPWO2021230372A1 (zh)
KR (3) KR20230010619A (zh)
CN (3) CN115175945A (zh)
TW (3) TW202208448A (zh)
WO (3) WO2021230372A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023112873A1 (ja) * 2021-12-13 2023-06-22 積水化学工業株式会社 接着剤組成物、電子部品用接着剤及び携帯電子機器用接着剤
WO2023153514A1 (ja) * 2022-02-14 2023-08-17 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤及び表示素子用接着剤

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016074781A (ja) 2014-10-03 2016-05-12 積水化学工業株式会社 光湿気硬化型樹脂組成物
JP2019006854A (ja) 2017-06-21 2019-01-17 日立化成株式会社 反応性ホットメルト接着剤組成物及び被着体の接着方法

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Publication number Priority date Publication date Assignee Title
JPH05171128A (ja) * 1991-12-25 1993-07-09 Sekisui Chem Co Ltd 湿気硬化型ホットメルト接着剤組成物
CN1524104A (zh) * 2001-04-09 2004-08-25 积水化学工业株式会社 光反应性组合物
JP5834606B2 (ja) * 2011-08-05 2015-12-24 Dic株式会社 紫外線硬化型粘着剤用樹脂組成物、粘着剤及び積層体
CN103450817B (zh) * 2012-06-01 2017-07-04 汉高股份有限公司 粘合剂组合物
WO2015056478A1 (ja) * 2013-10-15 2015-04-23 Dic株式会社 樹脂組成物
JP2016074891A (ja) * 2014-10-03 2016-05-12 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
JP2016147969A (ja) * 2015-02-12 2016-08-18 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
WO2017127469A1 (en) * 2016-01-22 2017-07-27 Henkel IP & Holding GmbH Dual curing optically transparent adhesive compositions
JP2020045403A (ja) * 2018-09-18 2020-03-26 積水化学工業株式会社 硬化性樹脂組成物、硬化体、電子部品及び組立部品
WO2020085284A1 (ja) * 2018-10-23 2020-04-30 積水化学工業株式会社 硬化性樹脂組成物、及び硬化体
CN113302249B (zh) * 2019-01-18 2023-07-07 积水化学工业株式会社 光湿固化性树脂组合物及固化体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016074781A (ja) 2014-10-03 2016-05-12 積水化学工業株式会社 光湿気硬化型樹脂組成物
JP2019006854A (ja) 2017-06-21 2019-01-17 日立化成株式会社 反応性ホットメルト接着剤組成物及び被着体の接着方法

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JPWO2021230371A1 (zh) 2021-11-18
KR20230013014A (ko) 2023-01-26
TW202208582A (zh) 2022-03-01
JPWO2021230372A1 (zh) 2021-11-18
CN115151578A (zh) 2022-10-04
TW202208449A (zh) 2022-03-01
WO2021230372A1 (ja) 2021-11-18
CN115175945A (zh) 2022-10-11
WO2021230373A1 (ja) 2021-11-18
CN115135676A (zh) 2022-09-30
KR20230013015A (ko) 2023-01-26
WO2021230371A1 (ja) 2021-11-18
CN115151578B (zh) 2024-04-23
TW202208448A (zh) 2022-03-01
JPWO2021230373A1 (zh) 2021-11-18

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