KR20220159984A - 반도체 장치 제조용 시트 - Google Patents
반도체 장치 제조용 시트 Download PDFInfo
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- KR20220159984A KR20220159984A KR1020227032634A KR20227032634A KR20220159984A KR 20220159984 A KR20220159984 A KR 20220159984A KR 1020227032634 A KR1020227032634 A KR 1020227032634A KR 20227032634 A KR20227032634 A KR 20227032634A KR 20220159984 A KR20220159984 A KR 20220159984A
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- adhesive
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- film adhesive
- sheet
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Images
Classifications
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- B32B27/00—Layered products comprising a layer of synthetic resin
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Landscapes
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CN114284460B (zh) * | 2021-12-14 | 2024-04-16 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
WO2023136057A1 (ja) * | 2022-01-11 | 2023-07-20 | 株式会社レゾナック | ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法 |
CN118163254A (zh) * | 2024-05-14 | 2024-06-11 | 成都希桦科技有限公司 | 一种晶圆划片刀及划片装置及划片方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009059917A (ja) | 2007-08-31 | 2009-03-19 | Nitto Denko Corp | 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 |
JP2012080023A (ja) | 2010-10-06 | 2012-04-19 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ及びその製造方法 |
WO2020179897A1 (ja) | 2019-03-07 | 2020-09-10 | リンテック株式会社 | ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005248018A (ja) * | 2004-03-04 | 2005-09-15 | Furukawa Electric Co Ltd:The | 半導体ウェハー固定用粘着テープ |
JP2011018669A (ja) * | 2009-07-07 | 2011-01-27 | Nitto Denko Corp | 半導体ウェハダイシング用粘着シート及び該粘着シートを用いる半導体ウェハのダイシング方法 |
JP6045773B2 (ja) * | 2009-11-26 | 2016-12-14 | 日立化成株式会社 | 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置 |
JP5503342B2 (ja) * | 2010-03-10 | 2014-05-28 | 古河電気工業株式会社 | ダイシング・ダイボンディングテープ |
JP2011199015A (ja) * | 2010-03-19 | 2011-10-06 | Sekisui Chem Co Ltd | ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法 |
JP4976532B2 (ja) | 2010-09-06 | 2012-07-18 | 日東電工株式会社 | 半導体装置用フィルム |
JP2012119395A (ja) * | 2010-11-29 | 2012-06-21 | Furukawa Electric Co Ltd:The | 半導体デバイスダイシング用粘着テープ及び半導体デバイスチップの製造方法 |
JP5023225B1 (ja) * | 2011-03-10 | 2012-09-12 | 日東電工株式会社 | 半導体装置用フィルムの製造方法 |
JP5370416B2 (ja) * | 2011-06-06 | 2013-12-18 | 日立化成株式会社 | 接着シート |
JP5976326B2 (ja) * | 2012-01-25 | 2016-08-23 | 日東電工株式会社 | 半導体装置の製造方法、及び、当該半導体装置の製造方法に用いられる接着フィルム |
JP6009188B2 (ja) * | 2012-03-23 | 2016-10-19 | リンテック株式会社 | ワーク加工用シート基材およびワーク加工用シート |
JP5912772B2 (ja) * | 2012-03-30 | 2016-04-27 | リンテック株式会社 | 基材レス両面粘着テープおよびその製造方法、ならびに粘着ロールおよびその製造方法 |
JP6110136B2 (ja) * | 2012-12-28 | 2017-04-05 | 株式会社ディスコ | ウエーハのレーザー加工方法およびレーザー加工装置 |
US10030174B2 (en) * | 2013-03-27 | 2018-07-24 | Lintec Corporation | Composite sheet for forming protective film |
JP6312472B2 (ja) * | 2014-03-18 | 2018-04-18 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP6273542B2 (ja) * | 2015-11-04 | 2018-02-07 | リンテック株式会社 | 硬化性樹脂フィルム及び第1保護膜形成用シート |
JP2017092365A (ja) * | 2015-11-16 | 2017-05-25 | 日東電工株式会社 | ダイシングテープ一体型接着シート、及び、半導体装置の製造方法 |
JP6829960B2 (ja) * | 2015-11-27 | 2021-02-17 | 日東電工株式会社 | 粘着シートおよび剥離フィルム付き粘着シート |
CN108713241B (zh) * | 2016-03-10 | 2023-04-11 | 琳得科株式会社 | 切割芯片接合片、半导体芯片的制造方法及半导体装置的制造方法 |
JP6791701B2 (ja) | 2016-09-28 | 2020-11-25 | 日東電工株式会社 | ダイシングダイボンディングテープおよび半導体装置の製造方法 |
WO2018083982A1 (ja) * | 2016-11-01 | 2018-05-11 | リンテック株式会社 | ダイシングダイボンディングシート、及び半導体チップの製造方法 |
JP6217872B2 (ja) * | 2017-01-12 | 2017-10-25 | 日立化成株式会社 | ダイシング・ダイボンディング一体型テープ用ダイシングテープ |
CN109789666B (zh) * | 2017-03-30 | 2024-06-04 | 琳得科株式会社 | 保护膜形成用复合片 |
JP6998154B2 (ja) * | 2017-08-29 | 2022-01-18 | リンテック株式会社 | ダイボンディングシート |
WO2019181447A1 (ja) * | 2018-03-20 | 2019-09-26 | リンテック株式会社 | 加工品の製造方法及び粘着性積層体 |
KR102519799B1 (ko) * | 2018-03-30 | 2023-04-10 | 린텍 가부시키가이샤 | 지지 시트 및 보호막 형성용 복합 시트 |
JP7033004B2 (ja) * | 2018-05-24 | 2022-03-09 | 日東電工株式会社 | ダイシングダイボンドフィルムおよび半導体装置製造方法 |
JP7159633B2 (ja) * | 2018-06-15 | 2022-10-25 | 昭和電工マテリアルズ株式会社 | ダイシング・ダイボンディング一体型フィルム及びこれに用いる粘着フィルム |
CN112154536A (zh) * | 2018-09-11 | 2020-12-29 | 琳得科株式会社 | 保护膜形成用膜、保护膜形成用复合片、检查方法及识别方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009059917A (ja) | 2007-08-31 | 2009-03-19 | Nitto Denko Corp | 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 |
JP2012080023A (ja) | 2010-10-06 | 2012-04-19 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ及びその製造方法 |
WO2020179897A1 (ja) | 2019-03-07 | 2020-09-10 | リンテック株式会社 | ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法 |
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