JPWO2021193916A1 - - Google Patents
Info
- Publication number
- JPWO2021193916A1 JPWO2021193916A1 JP2022510735A JP2022510735A JPWO2021193916A1 JP WO2021193916 A1 JPWO2021193916 A1 JP WO2021193916A1 JP 2022510735 A JP2022510735 A JP 2022510735A JP 2022510735 A JP2022510735 A JP 2022510735A JP WO2021193916 A1 JPWO2021193916 A1 JP WO2021193916A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
- C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C08L31/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020058734 | 2020-03-27 | ||
PCT/JP2021/012844 WO2021193916A1 (ja) | 2020-03-27 | 2021-03-26 | 半導体装置製造用シートの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021193916A1 true JPWO2021193916A1 (ja) | 2021-09-30 |
Family
ID=77890338
Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022510754A Pending JPWO2021193942A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510751A Pending JPWO2021193936A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510732A Pending JPWO2021193913A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510730A Pending JPWO2021193910A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510749A Pending JPWO2021193934A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510741A Pending JPWO2021193923A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510750A Pending JPWO2021193935A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510735A Pending JPWO2021193916A1 (ja) | 2020-03-27 | 2021-03-26 |
Family Applications Before (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022510754A Pending JPWO2021193942A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510751A Pending JPWO2021193936A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510732A Pending JPWO2021193913A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510730A Pending JPWO2021193910A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510749A Pending JPWO2021193934A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510741A Pending JPWO2021193923A1 (ja) | 2020-03-27 | 2021-03-26 | |
JP2022510750A Pending JPWO2021193935A1 (ja) | 2020-03-27 | 2021-03-26 |
Country Status (5)
Country | Link |
---|---|
JP (8) | JPWO2021193942A1 (ja) |
KR (8) | KR20220156511A (ja) |
CN (8) | CN115380363A (ja) |
TW (8) | TW202141603A (ja) |
WO (8) | WO2021193910A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114284460B (zh) * | 2021-12-14 | 2024-04-16 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
WO2023136057A1 (ja) * | 2022-01-11 | 2023-07-20 | 株式会社レゾナック | ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005248018A (ja) * | 2004-03-04 | 2005-09-15 | Furukawa Electric Co Ltd:The | 半導体ウェハー固定用粘着テープ |
JP4975564B2 (ja) | 2007-08-31 | 2012-07-11 | 日東電工株式会社 | 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 |
JP2011018669A (ja) * | 2009-07-07 | 2011-01-27 | Nitto Denko Corp | 半導体ウェハダイシング用粘着シート及び該粘着シートを用いる半導体ウェハのダイシング方法 |
JP6045773B2 (ja) * | 2009-11-26 | 2016-12-14 | 日立化成株式会社 | 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置 |
JP5503342B2 (ja) * | 2010-03-10 | 2014-05-28 | 古河電気工業株式会社 | ダイシング・ダイボンディングテープ |
JP2011199015A (ja) * | 2010-03-19 | 2011-10-06 | Sekisui Chem Co Ltd | ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法 |
JP4976532B2 (ja) | 2010-09-06 | 2012-07-18 | 日東電工株式会社 | 半導体装置用フィルム |
JP5408571B2 (ja) | 2010-10-06 | 2014-02-05 | 古河電気工業株式会社 | ウエハ加工用テープ及びその製造方法 |
JP2012119395A (ja) * | 2010-11-29 | 2012-06-21 | Furukawa Electric Co Ltd:The | 半導体デバイスダイシング用粘着テープ及び半導体デバイスチップの製造方法 |
JP5023225B1 (ja) * | 2011-03-10 | 2012-09-12 | 日東電工株式会社 | 半導体装置用フィルムの製造方法 |
JP5370416B2 (ja) * | 2011-06-06 | 2013-12-18 | 日立化成株式会社 | 接着シート |
JP5976326B2 (ja) * | 2012-01-25 | 2016-08-23 | 日東電工株式会社 | 半導体装置の製造方法、及び、当該半導体装置の製造方法に用いられる接着フィルム |
JP6009188B2 (ja) * | 2012-03-23 | 2016-10-19 | リンテック株式会社 | ワーク加工用シート基材およびワーク加工用シート |
JP5912772B2 (ja) * | 2012-03-30 | 2016-04-27 | リンテック株式会社 | 基材レス両面粘着テープおよびその製造方法、ならびに粘着ロールおよびその製造方法 |
JP6110136B2 (ja) * | 2012-12-28 | 2017-04-05 | 株式会社ディスコ | ウエーハのレーザー加工方法およびレーザー加工装置 |
US10030174B2 (en) * | 2013-03-27 | 2018-07-24 | Lintec Corporation | Composite sheet for forming protective film |
JP6312472B2 (ja) * | 2014-03-18 | 2018-04-18 | リンテック株式会社 | シート貼付装置および貼付方法 |
KR102538766B1 (ko) * | 2015-11-04 | 2023-05-31 | 린텍 가부시키가이샤 | 경화성 수지 필름 및 제1 보호막 형성용 시트 |
JP2017092365A (ja) * | 2015-11-16 | 2017-05-25 | 日東電工株式会社 | ダイシングテープ一体型接着シート、及び、半導体装置の製造方法 |
JP6829960B2 (ja) * | 2015-11-27 | 2021-02-17 | 日東電工株式会社 | 粘着シートおよび剥離フィルム付き粘着シート |
JP6805233B2 (ja) * | 2016-03-10 | 2020-12-23 | リンテック株式会社 | ダイシングダイボンディングシート、半導体チップの製造方法及び半導体装置の製造方法 |
JP6791701B2 (ja) | 2016-09-28 | 2020-11-25 | 日東電工株式会社 | ダイシングダイボンディングテープおよび半導体装置の製造方法 |
WO2018083982A1 (ja) * | 2016-11-01 | 2018-05-11 | リンテック株式会社 | ダイシングダイボンディングシート、及び半導体チップの製造方法 |
JP6217872B2 (ja) * | 2017-01-12 | 2017-10-25 | 日立化成株式会社 | ダイシング・ダイボンディング一体型テープ用ダイシングテープ |
KR102445532B1 (ko) * | 2017-03-30 | 2022-09-20 | 린텍 가부시키가이샤 | 보호막 형성용 복합 시트 |
JP6998154B2 (ja) * | 2017-08-29 | 2022-01-18 | リンテック株式会社 | ダイボンディングシート |
KR20200133209A (ko) * | 2018-03-20 | 2020-11-26 | 린텍 가부시키가이샤 | 가공품의 제조 방법 및 점착성 적층체 |
WO2019186990A1 (ja) * | 2018-03-30 | 2019-10-03 | リンテック株式会社 | 支持シート及び保護膜形成用複合シート |
JP7033004B2 (ja) * | 2018-05-24 | 2022-03-09 | 日東電工株式会社 | ダイシングダイボンドフィルムおよび半導体装置製造方法 |
JP7159633B2 (ja) * | 2018-06-15 | 2022-10-25 | 昭和電工マテリアルズ株式会社 | ダイシング・ダイボンディング一体型フィルム及びこれに用いる粘着フィルム |
SG11202012966XA (en) * | 2018-09-11 | 2021-02-25 | Lintec Corp | Film for protective film formation, composite sheet for protective film formation, test method, and identification method |
WO2020179897A1 (ja) | 2019-03-07 | 2020-09-10 | リンテック株式会社 | ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法 |
-
2021
- 2021-03-26 TW TW110110982A patent/TW202141603A/zh unknown
- 2021-03-26 KR KR1020227011817A patent/KR20220156511A/ko active Search and Examination
- 2021-03-26 TW TW110110974A patent/TW202142652A/zh unknown
- 2021-03-26 JP JP2022510754A patent/JPWO2021193942A1/ja active Pending
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