KR20220062091A - 점착제 조성물, 점착 시트 및 광학 부재 - Google Patents
점착제 조성물, 점착 시트 및 광학 부재 Download PDFInfo
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- KR20220062091A KR20220062091A KR1020227012308A KR20227012308A KR20220062091A KR 20220062091 A KR20220062091 A KR 20220062091A KR 1020227012308 A KR1020227012308 A KR 1020227012308A KR 20227012308 A KR20227012308 A KR 20227012308A KR 20220062091 A KR20220062091 A KR 20220062091A
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- KR
- South Korea
- Prior art keywords
- meth
- pressure
- sensitive adhesive
- copolymer
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 claims abstract description 53
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- 239000003431 cross linking reagent Substances 0.000 claims abstract description 29
- 125000003277 amino group Chemical group 0.000 claims abstract description 20
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- IKHOZNOYZQPPCK-UHFFFAOYSA-K aluminum;4,4-diethyl-3-oxohexanoate Chemical compound [Al+3].CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O IKHOZNOYZQPPCK-UHFFFAOYSA-K 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
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- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
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- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
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- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- KHMYONNPZWOTKW-UHFFFAOYSA-N pent-1-enylbenzene Chemical compound CCCC=CC1=CC=CC=C1 KHMYONNPZWOTKW-UHFFFAOYSA-N 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
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| JP2019195109 | 2019-10-28 | ||
| JPJP-P-2019-195109 | 2019-10-28 | ||
| PCT/JP2020/038756 WO2021085136A1 (ja) | 2019-10-28 | 2020-10-14 | 粘着剤組成物、粘着シートおよび光学部材 |
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| KR20220062091A true KR20220062091A (ko) | 2022-05-13 |
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| JP (1) | JPWO2021085136A1 (enrdf_load_stackoverflow) |
| KR (1) | KR20220062091A (enrdf_load_stackoverflow) |
| CN (1) | CN114599756A (enrdf_load_stackoverflow) |
| TW (1) | TW202122543A (enrdf_load_stackoverflow) |
| WO (1) | WO2021085136A1 (enrdf_load_stackoverflow) |
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| CN116056864A (zh) * | 2020-09-23 | 2023-05-02 | 综研化学株式会社 | 加饰膜用粘接剂组合物及其用途 |
| TW202313908A (zh) * | 2021-09-29 | 2023-04-01 | 日商綜研化學股份有限公司 | 黏合劑組成物及包含它的層疊體 |
| JP2023073163A (ja) * | 2021-11-15 | 2023-05-25 | 日東電工株式会社 | タッチセンシング機能を内蔵する画像表示パネル及び画像表示装置 |
| JP2023073162A (ja) * | 2021-11-15 | 2023-05-25 | 日東電工株式会社 | 光学積層体、画像表示パネル及び画像表示装置 |
| CN116004157A (zh) * | 2022-08-15 | 2023-04-25 | 苏州柯燚半导体材料科技有限公司 | 一种丙烯酸酯分散液及其在压敏胶上的应用 |
Citations (2)
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| JP2014005387A (ja) | 2012-06-26 | 2014-01-16 | Toagosei Co Ltd | 粘着付与剤及び粘着剤組成物、並びにその用途 |
| JP2018001615A (ja) | 2016-07-01 | 2018-01-11 | 東亞合成株式会社 | 粘着剤組成物及び粘着剤層を備える積層体 |
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| JP4788937B2 (ja) * | 2001-05-07 | 2011-10-05 | 綜研化学株式会社 | 粘着剤組成物及び該組成物を用いたディスプレイ用粘着シート |
| JP2013018163A (ja) * | 2011-07-08 | 2013-01-31 | Nitto Denko Corp | 接合体および接合体の製造方法 |
| JP2013107971A (ja) * | 2011-11-21 | 2013-06-06 | Toyo Ink Sc Holdings Co Ltd | 光学用粘着剤およびそれを用いてなる光学積層体 |
| JP6574109B2 (ja) * | 2015-06-23 | 2019-09-11 | スリーエム イノベイティブ プロパティズ カンパニー | 装飾フィルム |
| JP5920519B1 (ja) * | 2015-11-25 | 2016-05-18 | 東洋インキＳｃホールディングス株式会社 | 粘着剤および粘着テープ |
| JP6921572B2 (ja) * | 2017-03-23 | 2021-08-18 | 綜研化学株式会社 | 粘着シート |
| JP6921571B2 (ja) * | 2017-03-23 | 2021-08-18 | 綜研化学株式会社 | 粘着剤組成物および粘着シート |
| JP7007100B2 (ja) * | 2017-04-10 | 2022-02-10 | 綜研化学株式会社 | 粘着剤組成物および粘着シート |
| JP7089346B2 (ja) * | 2017-06-08 | 2022-06-22 | 綜研化学株式会社 | 画像表示装置 |
| KR102603519B1 (ko) * | 2017-08-10 | 2023-11-17 | 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 | 적층체 및 터치패널 |
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- 2020-10-14 CN CN202080073345.3A patent/CN114599756A/zh active Pending
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014005387A (ja) | 2012-06-26 | 2014-01-16 | Toagosei Co Ltd | 粘着付与剤及び粘着剤組成物、並びにその用途 |
| JP2018001615A (ja) | 2016-07-01 | 2018-01-11 | 東亞合成株式会社 | 粘着剤組成物及び粘着剤層を備える積層体 |
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| CN114599756A (zh) | 2022-06-07 |
| WO2021085136A1 (ja) | 2021-05-06 |
| TW202122543A (zh) | 2021-06-16 |
| JPWO2021085136A1 (enrdf_load_stackoverflow) | 2021-05-06 |
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