KR20220061219A - 기판의 화학적 및/또는 전해 표면 처리를 위한 전기화학 증착 시스템 - Google Patents
기판의 화학적 및/또는 전해 표면 처리를 위한 전기화학 증착 시스템 Download PDFInfo
- Publication number
- KR20220061219A KR20220061219A KR1020227012156A KR20227012156A KR20220061219A KR 20220061219 A KR20220061219 A KR 20220061219A KR 1020227012156 A KR1020227012156 A KR 1020227012156A KR 20227012156 A KR20227012156 A KR 20227012156A KR 20220061219 A KR20220061219 A KR 20220061219A
- Authority
- KR
- South Korea
- Prior art keywords
- anode
- electrochemical deposition
- electrolyte
- deposition system
- enclosure
- Prior art date
Links
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 70
- 239000000758 substrate Substances 0.000 title claims abstract description 55
- 239000000126 substance Substances 0.000 title claims abstract description 32
- 238000004381 surface treatment Methods 0.000 title claims abstract description 26
- 239000003792 electrolyte Substances 0.000 claims abstract description 79
- 239000012528 membrane Substances 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 38
- 239000012530 fluid Substances 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000001465 metallisation Methods 0.000 claims abstract description 9
- 238000000151 deposition Methods 0.000 claims description 28
- 230000008021 deposition Effects 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 239000007789 gas Substances 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 13
- 238000009826 distribution Methods 0.000 claims description 9
- 230000002457 bidirectional effect Effects 0.000 claims description 8
- 230000009977 dual effect Effects 0.000 claims description 8
- 239000004743 Polypropylene Substances 0.000 claims description 3
- -1 polypropylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 18
- 239000006259 organic additive Substances 0.000 description 12
- 150000002500 ions Chemical class 0.000 description 9
- 230000006870 function Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 5
- 230000001419 dependent effect Effects 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20158350.7 | 2020-02-19 | ||
| EP20158350.7A EP3868923A1 (en) | 2020-02-19 | 2020-02-19 | Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate |
| PCT/EP2020/074266 WO2021164894A1 (en) | 2020-02-19 | 2020-09-01 | Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20220061219A true KR20220061219A (ko) | 2022-05-12 |
Family
ID=69723803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227012156A KR20220061219A (ko) | 2020-02-19 | 2020-09-01 | 기판의 화학적 및/또는 전해 표면 처리를 위한 전기화학 증착 시스템 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230056444A1 (ja) |
| EP (1) | EP3868923A1 (ja) |
| JP (1) | JP2023501797A (ja) |
| KR (1) | KR20220061219A (ja) |
| CN (1) | CN114630927A (ja) |
| TW (1) | TW202210664A (ja) |
| WO (1) | WO2021164894A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4219799A1 (en) * | 2022-01-27 | 2023-08-02 | Semsysco GmbH | System for a chemical and/or electrolytic surface treatment of a substrate |
| CN117737812A (zh) * | 2024-02-07 | 2024-03-22 | 苏州智程半导体科技股份有限公司 | 一种改善阳极极化的半导体晶圆电化学沉积设备 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2013468C1 (ru) * | 1990-12-10 | 1994-05-30 | Белорусский комитет действия "Эхо Чернобыля" | Электролизер |
| ATE125310T1 (de) * | 1991-05-30 | 1995-08-15 | Sikel Nv | Elektrode für eine elektrolytische zelle, deren gebrauch und verfahren. |
| US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
| US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| JP2002097598A (ja) * | 2000-09-25 | 2002-04-02 | Mitsubishi Electric Corp | 電解メッキ装置 |
| US6964792B1 (en) * | 2000-11-03 | 2005-11-15 | Novellus Systems, Inc. | Methods and apparatus for controlling electrolyte flow for uniform plating |
| EP1563119A4 (en) * | 2001-08-31 | 2006-03-22 | Semitool Inc | APPARATUS AND METHOD FOR DISPERSING AN ELECTROPHORETIC EMULSION |
| TW590989B (en) * | 2002-08-14 | 2004-06-11 | Applied Materials Inc | An electrochemical plating apparatus and de-bubble method thereof |
| TW539780B (en) * | 2002-08-14 | 2003-07-01 | Applied Materials Inc | An electrochemical plating apparatus having a filter membrane in a shape of cone |
| US20060163058A1 (en) * | 2005-01-26 | 2006-07-27 | Kiyonori Watanabe | Apparatus for plating a semiconductor wafer and plating solution bath used therein |
| JP2006316337A (ja) * | 2005-05-16 | 2006-11-24 | Hitachi Maxell Ltd | 電気泳動堆積用の電解槽と、高分子・無機微粒子複合堆積体の製造方法 |
| JP4822858B2 (ja) * | 2005-11-22 | 2011-11-24 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | めっき装置 |
| JP2007197788A (ja) * | 2006-01-27 | 2007-08-09 | Toppan Printing Co Ltd | 金属平板の電着塗装方法 |
| JP2009179821A (ja) * | 2008-01-29 | 2009-08-13 | Panasonic Corp | 半導体装置の製造方法及びその製造装置 |
| AU2013224676B2 (en) * | 2011-02-28 | 2015-12-10 | Vito Nv | Novel separator, an electrochemical cell therewith and use thereof therein |
| CN104798221B (zh) * | 2012-12-05 | 2017-04-12 | 默克专利有限公司 | 具有氧离子泵的电子装置 |
| US10190232B2 (en) * | 2013-08-06 | 2019-01-29 | Lam Research Corporation | Apparatuses and methods for maintaining pH in nickel electroplating baths |
| US9677190B2 (en) * | 2013-11-01 | 2017-06-13 | Lam Research Corporation | Membrane design for reducing defects in electroplating systems |
| US9567685B2 (en) * | 2015-01-22 | 2017-02-14 | Lam Research Corporation | Apparatus and method for dynamic control of plated uniformity with the use of remote electric current |
| US20190100855A1 (en) * | 2016-03-21 | 2019-04-04 | Atomospherix, LLC | Electrochemical method and apparatus for consuming gases |
| JP6696462B2 (ja) * | 2017-03-09 | 2020-05-20 | トヨタ自動車株式会社 | 金属皮膜の成膜装置 |
| US11001934B2 (en) * | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| CN107869613B (zh) * | 2017-11-03 | 2021-07-16 | 微粒云科技（北京）有限公司 | 一种电解膜阀及其制造方法 |
| PT3872236T (pt) * | 2020-02-28 | 2022-03-30 | Semsysco Gmbh | Sistema de distribuição de um fluido de processo para tratamento químico e/ou eletrolítico da superfície de um substrato |
-
2020
- 2020-02-19 EP EP20158350.7A patent/EP3868923A1/en not_active Withdrawn
- 2020-09-01 JP JP2022528317A patent/JP2023501797A/ja active Pending
- 2020-09-01 US US17/797,589 patent/US20230056444A1/en not_active Abandoned
- 2020-09-01 WO PCT/EP2020/074266 patent/WO2021164894A1/en active Application Filing
- 2020-09-01 KR KR1020227012156A patent/KR20220061219A/ko not_active Application Discontinuation
- 2020-09-01 CN CN202080076217.4A patent/CN114630927A/zh active Pending
-
2021
- 2021-04-30 TW TW110115810A patent/TW202210664A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021164894A1 (en) | 2021-08-26 |
| TW202210664A (zh) | 2022-03-16 |
| CN114630927A (zh) | 2022-06-14 |
| JP2023501797A (ja) | 2023-01-19 |
| US20230056444A1 (en) | 2023-02-23 |
| EP3868923A1 (en) | 2021-08-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal |