TW202210664A - 基板之化學及/或電解表面處理之電化學沈積系統 - Google Patents

基板之化學及/或電解表面處理之電化學沈積系統 Download PDF

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Publication number
TW202210664A
TW202210664A TW110115810A TW110115810A TW202210664A TW 202210664 A TW202210664 A TW 202210664A TW 110115810 A TW110115810 A TW 110115810A TW 110115810 A TW110115810 A TW 110115810A TW 202210664 A TW202210664 A TW 202210664A
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TW
Taiwan
Prior art keywords
anode
deposition system
electrolyte
substrate
electrochemical deposition
Prior art date
Application number
TW110115810A
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English (en)
Chinese (zh)
Inventor
赫伯特 奧茲林格
羅斯 庫爾澤
法蘭斯 馬庫特
安德魯斯 格雷斯尼爾
Original Assignee
奧地利商勝思科技有限公司
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Publication date
Application filed by 奧地利商勝思科技有限公司 filed Critical 奧地利商勝思科技有限公司
Publication of TW202210664A publication Critical patent/TW202210664A/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
TW110115810A 2020-02-19 2021-04-30 基板之化學及/或電解表面處理之電化學沈積系統 TW202210664A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20158350.7A EP3868923A1 (en) 2020-02-19 2020-02-19 Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate
PCT/EP2020/074266 WO2021164894A1 (en) 2020-02-19 2020-09-01 Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate
WOPCT/EP2020/074266 2020-09-01

Publications (1)

Publication Number Publication Date
TW202210664A true TW202210664A (zh) 2022-03-16

Family

ID=69723803

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115810A TW202210664A (zh) 2020-02-19 2021-04-30 基板之化學及/或電解表面處理之電化學沈積系統

Country Status (7)

Country Link
US (1) US20230056444A1 (ja)
EP (1) EP3868923A1 (ja)
JP (1) JP2023501797A (ja)
KR (1) KR20220061219A (ja)
CN (1) CN114630927A (ja)
TW (1) TW202210664A (ja)
WO (1) WO2021164894A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4219799A1 (en) * 2022-01-27 2023-08-02 Semsysco GmbH System for a chemical and/or electrolytic surface treatment of a substrate
CN118497865A (zh) * 2023-02-14 2024-08-16 盛美半导体设备(上海)股份有限公司 电镀装置
CN117737812A (zh) * 2024-02-07 2024-03-22 苏州智程半导体科技股份有限公司 一种改善阳极极化的半导体晶圆电化学沉积设备

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2013468C1 (ru) * 1990-12-10 1994-05-30 Белорусский комитет действия "Эхо Чернобыля" Электролизер
CA2109708C (fr) * 1991-05-30 1999-09-28 Hans Joseph May Electrode pour cellule electrolytique, son utilisation et procede l'utilisant
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
JP2002097598A (ja) * 2000-09-25 2002-04-02 Mitsubishi Electric Corp 電解メッキ装置
US6964792B1 (en) * 2000-11-03 2005-11-15 Novellus Systems, Inc. Methods and apparatus for controlling electrolyte flow for uniform plating
WO2004020704A1 (en) * 2001-08-31 2004-03-11 Semitool, Inc. Apparatus and method for deposition of an electrophoretic emulsion
TW590989B (en) * 2002-08-14 2004-06-11 Applied Materials Inc An electrochemical plating apparatus and de-bubble method thereof
TW539780B (en) * 2002-08-14 2003-07-01 Applied Materials Inc An electrochemical plating apparatus having a filter membrane in a shape of cone
US20060163058A1 (en) * 2005-01-26 2006-07-27 Kiyonori Watanabe Apparatus for plating a semiconductor wafer and plating solution bath used therein
JP2006316337A (ja) * 2005-05-16 2006-11-24 Hitachi Maxell Ltd 電気泳動堆積用の電解槽と、高分子・無機微粒子複合堆積体の製造方法
JP4822858B2 (ja) * 2005-11-22 2011-11-24 日本エレクトロプレイテイング・エンジニヤース株式会社 めっき装置
JP2007197788A (ja) * 2006-01-27 2007-08-09 Toppan Printing Co Ltd 金属平板の電着塗装方法
JP2009179821A (ja) * 2008-01-29 2009-08-13 Panasonic Corp 半導体装置の製造方法及びその製造装置
AU2013224676B2 (en) * 2011-02-28 2015-12-10 Vito Nv Novel separator, an electrochemical cell therewith and use thereof therein
JP6321028B2 (ja) * 2012-12-05 2018-05-09 メルク パテント ゲーエムベーハー 酸素イオンポンプを備えた電子装置
US10190232B2 (en) * 2013-08-06 2019-01-29 Lam Research Corporation Apparatuses and methods for maintaining pH in nickel electroplating baths
US9677190B2 (en) * 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
US9567685B2 (en) * 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
US20190100855A1 (en) * 2016-03-21 2019-04-04 Atomospherix, LLC Electrochemical method and apparatus for consuming gases
JP6696462B2 (ja) * 2017-03-09 2020-05-20 トヨタ自動車株式会社 金属皮膜の成膜装置
US11001934B2 (en) * 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
CN107869613B (zh) * 2017-11-03 2021-07-16 微粒云科技（北京）有限公司 一种电解膜阀及其制造方法
PT3872236T (pt) * 2020-02-28 2022-03-30 Semsysco Gmbh Sistema de distribuição de um fluido de processo para tratamento químico e/ou eletrolítico da superfície de um substrato

Also Published As

Publication number Publication date
WO2021164894A1 (en) 2021-08-26
US20230056444A1 (en) 2023-02-23
KR20220061219A (ko) 2022-05-12
EP3868923A1 (en) 2021-08-25
JP2023501797A (ja) 2023-01-19
CN114630927A (zh) 2022-06-14

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