KR20220029400A - 워크피스 지지 장치 및 워크피스 지지 방법 - Google Patents

워크피스 지지 장치 및 워크피스 지지 방법 Download PDF

Info

Publication number
KR20220029400A
KR20220029400A KR1020210109315A KR20210109315A KR20220029400A KR 20220029400 A KR20220029400 A KR 20220029400A KR 1020210109315 A KR1020210109315 A KR 1020210109315A KR 20210109315 A KR20210109315 A KR 20210109315A KR 20220029400 A KR20220029400 A KR 20220029400A
Authority
KR
South Korea
Prior art keywords
bernoulli chuck
liquid
workpiece
gas
liquid discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020210109315A
Other languages
English (en)
Korean (ko)
Inventor
마코토 가시와기
마오 이자와
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20220029400A publication Critical patent/KR20220029400A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/20—Accessories for controlling or adjusting the tracking or the tension of the grinding belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H01L21/67046—
    • H01L21/6838—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020210109315A 2020-08-28 2021-08-19 워크피스 지지 장치 및 워크피스 지지 방법 Pending KR20220029400A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2020-144540 2020-08-28
JP2020144540A JP7592434B2 (ja) 2020-08-28 2020-08-28 ワークピース支持装置およびワークピース支持方法

Publications (1)

Publication Number Publication Date
KR20220029400A true KR20220029400A (ko) 2022-03-08

Family

ID=77398420

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210109315A Pending KR20220029400A (ko) 2020-08-28 2021-08-19 워크피스 지지 장치 및 워크피스 지지 방법

Country Status (6)

Country Link
US (1) US11804398B2 (https=)
EP (1) EP3961683B1 (https=)
JP (1) JP7592434B2 (https=)
KR (1) KR20220029400A (https=)
CN (1) CN114102370A (https=)
TW (1) TWI899310B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025173591A1 (ja) * 2024-02-16 2025-08-21 東京エレクトロン株式会社 基板処理装置、及び基板処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018111146A (ja) 2017-01-10 2018-07-19 東京エレクトロン株式会社 基板処理システムおよび基板処理方法
JP2019077003A (ja) 2017-10-25 2019-05-23 株式会社荏原製作所 研磨装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343428U (https=) * 1986-09-05 1988-03-23
JPS6384026A (ja) * 1986-09-29 1988-04-14 Hitachi Ltd 半導体基板のベ−キング装置
JPH08330398A (ja) * 1995-05-30 1996-12-13 Sony Corp ウエハ処理方法および装置
JP4018958B2 (ja) * 2001-10-30 2007-12-05 大日本スクリーン製造株式会社 基板処理装置
US6848625B2 (en) * 2002-03-19 2005-02-01 Tokyo Electron Limited Process liquid supply mechanism and process liquid supply method
JP4299111B2 (ja) * 2003-11-18 2009-07-22 株式会社ディスコ 研削装置
JP4359885B2 (ja) * 2004-05-27 2009-11-11 信越半導体株式会社 ベルヌーイチャック
JP2007067054A (ja) * 2005-08-30 2007-03-15 Fluoro Mechanic Kk ベルヌーイチャック
JP2007214529A (ja) * 2006-01-13 2007-08-23 Fluoro Mechanic Kk ベルヌーイチャック
KR100820190B1 (ko) * 2006-11-21 2008-04-07 (주)이노맥스 스핀 척 장치
KR100885180B1 (ko) * 2006-12-27 2009-02-23 세메스 주식회사 기판 지지유닛, 그리고 상기 기판 지지유닛을 구비하는기판처리장치 및 방법
JP2009032744A (ja) * 2007-07-24 2009-02-12 Fluoro Mechanic Kk ベルヌーイチャック
JP5012651B2 (ja) * 2008-05-14 2012-08-29 東京エレクトロン株式会社 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP2010082489A (ja) * 2008-09-29 2010-04-15 Seiko Epson Corp フラッシング受容装置およびこれを備えた液滴吐出装置
DE102010022333B4 (de) * 2010-06-01 2013-11-14 Festo Ag & Co. Kg Bernoulli-Sauggreifer
US8945341B2 (en) * 2011-08-22 2015-02-03 Lam Research Ag Method and device for wet treatment of plate-like articles
JP2013089892A (ja) * 2011-10-21 2013-05-13 Ihi Corp チャック装置
JP2014003237A (ja) * 2012-06-20 2014-01-09 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP6317106B2 (ja) * 2013-12-27 2018-04-25 芝浦メカトロニクス株式会社 基板保持装置及び基板保持方法
TWI556878B (zh) * 2014-02-26 2016-11-11 辛耘企業股份有限公司 流體加速裝置
JP6568773B2 (ja) * 2015-11-10 2019-08-28 東京エレクトロン株式会社 基板搬送装置及び剥離システム
JP2017112255A (ja) * 2015-12-17 2017-06-22 株式会社ディスコ 搬送装置
US10770335B2 (en) * 2016-07-06 2020-09-08 Acm Research (Shanghai) Inc. Substrate supporting apparatus
CN118343498A (zh) * 2018-03-01 2024-07-16 杭州孚亚科技有限公司 吸紧装置
JP7394534B2 (ja) * 2019-03-26 2023-12-08 株式会社東京精密 ウエハ搬送装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018111146A (ja) 2017-01-10 2018-07-19 東京エレクトロン株式会社 基板処理システムおよび基板処理方法
JP2019077003A (ja) 2017-10-25 2019-05-23 株式会社荏原製作所 研磨装置

Also Published As

Publication number Publication date
US11804398B2 (en) 2023-10-31
JP7592434B2 (ja) 2024-12-02
EP3961683B1 (en) 2023-07-26
JP2022039487A (ja) 2022-03-10
CN114102370A (zh) 2022-03-01
TW202213593A (zh) 2022-04-01
TWI899310B (zh) 2025-10-01
EP3961683A1 (en) 2022-03-02
US20220068695A1 (en) 2022-03-03

Similar Documents

Publication Publication Date Title
TWI733849B (zh) 研磨裝置
TWI616239B (zh) 擦洗器
CN107887313B (zh) 加工装置
TW201442092A (zh) 研磨裝置及研磨方法
JP6129022B2 (ja) 研削装置の加工室洗浄方法
JP5996382B2 (ja) 切削装置のチャックテーブル
TWI765125B (zh) 基板處理裝置、基板處理方法、及儲存有程式之儲存媒介
KR20150106833A (ko) 웨이퍼 처리 장치 및 웨이퍼 처리 방법
JP2022036416A (ja) 基板保持回転機構、基板処理装置
KR20220029400A (ko) 워크피스 지지 장치 및 워크피스 지지 방법
US20160052104A1 (en) Polishing apparatus
JP2020184581A (ja) 基板処理装置および基板処理方法
JP2007005661A (ja) ベベル研磨方法及びベベル研磨装置
JP2017174940A (ja) 研磨装置および研磨方法
JP7542360B2 (ja) 切削装置
JP2023108931A (ja) チャックテーブル及び研削装置
JP7733453B2 (ja) ワークピース処理装置およびワークピース処理方法
JP4963411B2 (ja) 半導体装置または半導体ウェハの製造方法
US20230182262A1 (en) Substrate cleaning device and substrate polishing device
JP2017112255A (ja) 搬送装置
JP7483369B2 (ja) 切削装置
CN120380580A (zh) 基板处理装置和基板处理方法
CN118119478A (zh) 基板处理装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000