CN114102370A - 工件支承装置、工件处理装置、工件输送装置、工件支承方法及工件处理方法 - Google Patents

工件支承装置、工件处理装置、工件输送装置、工件支承方法及工件处理方法 Download PDF

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Publication number
CN114102370A
CN114102370A CN202110984857.1A CN202110984857A CN114102370A CN 114102370 A CN114102370 A CN 114102370A CN 202110984857 A CN202110984857 A CN 202110984857A CN 114102370 A CN114102370 A CN 114102370A
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CN
China
Prior art keywords
workpiece
bernoulli chuck
gas
liquid
liquid discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110984857.1A
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English (en)
Chinese (zh)
Inventor
柏木诚
伊泽真于
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN114102370A publication Critical patent/CN114102370A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/20—Accessories for controlling or adjusting the tracking or the tension of the grinding belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202110984857.1A 2020-08-28 2021-08-25 工件支承装置、工件处理装置、工件输送装置、工件支承方法及工件处理方法 Pending CN114102370A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-144540 2020-08-28
JP2020144540A JP7592434B2 (ja) 2020-08-28 2020-08-28 ワークピース支持装置およびワークピース支持方法

Publications (1)

Publication Number Publication Date
CN114102370A true CN114102370A (zh) 2022-03-01

Family

ID=77398420

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110984857.1A Pending CN114102370A (zh) 2020-08-28 2021-08-25 工件支承装置、工件处理装置、工件输送装置、工件支承方法及工件处理方法

Country Status (6)

Country Link
US (1) US11804398B2 (https=)
EP (1) EP3961683B1 (https=)
JP (1) JP7592434B2 (https=)
KR (1) KR20220029400A (https=)
CN (1) CN114102370A (https=)
TW (1) TWI899310B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025173591A1 (ja) * 2024-02-16 2025-08-21 東京エレクトロン株式会社 基板処理装置、及び基板処理方法

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343428U (https=) * 1986-09-05 1988-03-23
JPH08330398A (ja) * 1995-05-30 1996-12-13 Sony Corp ウエハ処理方法および装置
JP2005150528A (ja) * 2003-11-18 2005-06-09 Disco Abrasive Syst Ltd 研削装置
JP2005340522A (ja) * 2004-05-27 2005-12-08 Shin Etsu Handotai Co Ltd ベルヌーイチャック
JP2007067054A (ja) * 2005-08-30 2007-03-15 Fluoro Mechanic Kk ベルヌーイチャック
JP2007214529A (ja) * 2006-01-13 2007-08-23 Fluoro Mechanic Kk ベルヌーイチャック
JP2009032744A (ja) * 2007-07-24 2009-02-12 Fluoro Mechanic Kk ベルヌーイチャック
US20090285991A1 (en) * 2008-05-14 2009-11-19 Tokyo Electron Limited Coating apparatus and method
JP2010082489A (ja) * 2008-09-29 2010-04-15 Seiko Epson Corp フラッシング受容装置およびこれを備えた液滴吐出装置
DE102010022333A1 (de) * 2010-06-01 2011-12-01 Festo Ag & Co. Kg Bernoulli-Sauggreifer
US20130048607A1 (en) * 2011-08-22 2013-02-28 Lam Research Ag Method and device for wet treatment of plate-like articles
JP2013089892A (ja) * 2011-10-21 2013-05-13 Ihi Corp チャック装置
JP2017092228A (ja) * 2015-11-10 2017-05-25 東京エレクトロン株式会社 基板搬送装置及び剥離システム
JP2017112255A (ja) * 2015-12-17 2017-06-22 株式会社ディスコ 搬送装置
JP2018111146A (ja) * 2017-01-10 2018-07-19 東京エレクトロン株式会社 基板処理システムおよび基板処理方法

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Publication number Priority date Publication date Assignee Title
JPS6384026A (ja) * 1986-09-29 1988-04-14 Hitachi Ltd 半導体基板のベ−キング装置
JP4018958B2 (ja) * 2001-10-30 2007-12-05 大日本スクリーン製造株式会社 基板処理装置
US6848625B2 (en) * 2002-03-19 2005-02-01 Tokyo Electron Limited Process liquid supply mechanism and process liquid supply method
KR100820190B1 (ko) * 2006-11-21 2008-04-07 (주)이노맥스 스핀 척 장치
KR100885180B1 (ko) * 2006-12-27 2009-02-23 세메스 주식회사 기판 지지유닛, 그리고 상기 기판 지지유닛을 구비하는기판처리장치 및 방법
JP2014003237A (ja) * 2012-06-20 2014-01-09 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP6317106B2 (ja) * 2013-12-27 2018-04-25 芝浦メカトロニクス株式会社 基板保持装置及び基板保持方法
TWI556878B (zh) * 2014-02-26 2016-11-11 辛耘企業股份有限公司 流體加速裝置
US10770335B2 (en) * 2016-07-06 2020-09-08 Acm Research (Shanghai) Inc. Substrate supporting apparatus
JP6908496B2 (ja) * 2017-10-25 2021-07-28 株式会社荏原製作所 研磨装置
CN118343498A (zh) * 2018-03-01 2024-07-16 杭州孚亚科技有限公司 吸紧装置
JP7394534B2 (ja) * 2019-03-26 2023-12-08 株式会社東京精密 ウエハ搬送装置

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343428U (https=) * 1986-09-05 1988-03-23
JPH08330398A (ja) * 1995-05-30 1996-12-13 Sony Corp ウエハ処理方法および装置
JP2005150528A (ja) * 2003-11-18 2005-06-09 Disco Abrasive Syst Ltd 研削装置
JP2005340522A (ja) * 2004-05-27 2005-12-08 Shin Etsu Handotai Co Ltd ベルヌーイチャック
JP2007067054A (ja) * 2005-08-30 2007-03-15 Fluoro Mechanic Kk ベルヌーイチャック
JP2007214529A (ja) * 2006-01-13 2007-08-23 Fluoro Mechanic Kk ベルヌーイチャック
JP2009032744A (ja) * 2007-07-24 2009-02-12 Fluoro Mechanic Kk ベルヌーイチャック
US20090285991A1 (en) * 2008-05-14 2009-11-19 Tokyo Electron Limited Coating apparatus and method
JP2009277870A (ja) * 2008-05-14 2009-11-26 Tokyo Electron Ltd 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP2010082489A (ja) * 2008-09-29 2010-04-15 Seiko Epson Corp フラッシング受容装置およびこれを備えた液滴吐出装置
DE102010022333A1 (de) * 2010-06-01 2011-12-01 Festo Ag & Co. Kg Bernoulli-Sauggreifer
US20130048607A1 (en) * 2011-08-22 2013-02-28 Lam Research Ag Method and device for wet treatment of plate-like articles
JP2013089892A (ja) * 2011-10-21 2013-05-13 Ihi Corp チャック装置
JP2017092228A (ja) * 2015-11-10 2017-05-25 東京エレクトロン株式会社 基板搬送装置及び剥離システム
JP2017112255A (ja) * 2015-12-17 2017-06-22 株式会社ディスコ 搬送装置
JP2018111146A (ja) * 2017-01-10 2018-07-19 東京エレクトロン株式会社 基板処理システムおよび基板処理方法

Non-Patent Citations (1)

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Title
阮晓东;郭丽媛;傅新;邹俊;: "旋涡式非接触硅片夹持装置的流动计算及试验研究", 机械工程学报, no. 16, 20 August 2010 (2010-08-20), pages 189 - 194 *

Also Published As

Publication number Publication date
US11804398B2 (en) 2023-10-31
JP7592434B2 (ja) 2024-12-02
EP3961683B1 (en) 2023-07-26
JP2022039487A (ja) 2022-03-10
TW202213593A (zh) 2022-04-01
TWI899310B (zh) 2025-10-01
EP3961683A1 (en) 2022-03-02
US20220068695A1 (en) 2022-03-03
KR20220029400A (ko) 2022-03-08

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