KR20210146447A - 개방 모드 전극 구성 및 가요성 종단들을 갖는 적층 커패시터 - Google Patents

개방 모드 전극 구성 및 가요성 종단들을 갖는 적층 커패시터 Download PDF

Info

Publication number
KR20210146447A
KR20210146447A KR1020217038225A KR20217038225A KR20210146447A KR 20210146447 A KR20210146447 A KR 20210146447A KR 1020217038225 A KR1020217038225 A KR 1020217038225A KR 20217038225 A KR20217038225 A KR 20217038225A KR 20210146447 A KR20210146447 A KR 20210146447A
Authority
KR
South Korea
Prior art keywords
multilayer ceramic
forming
electrodes
monolithic body
polymer composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020217038225A
Other languages
English (en)
Korean (ko)
Inventor
프랭크 호지킨슨
엘라인 보일
Original Assignee
에이브이엑스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이브이엑스 코포레이션 filed Critical 에이브이엑스 코포레이션
Publication of KR20210146447A publication Critical patent/KR20210146447A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020217038225A 2019-04-25 2020-04-17 개방 모드 전극 구성 및 가요성 종단들을 갖는 적층 커패시터 Ceased KR20210146447A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962838406P 2019-04-25 2019-04-25
US62/838,406 2019-04-25
PCT/US2020/028737 WO2020219354A1 (en) 2019-04-25 2020-04-17 Multilayer capacitor having open mode electrode configuration and flexible terminations

Publications (1)

Publication Number Publication Date
KR20210146447A true KR20210146447A (ko) 2021-12-03

Family

ID=72917256

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217038225A Ceased KR20210146447A (ko) 2019-04-25 2020-04-17 개방 모드 전극 구성 및 가요성 종단들을 갖는 적층 커패시터

Country Status (7)

Country Link
US (1) US11705280B2 (https=)
JP (2) JP2022541365A (https=)
KR (1) KR20210146447A (https=)
CN (2) CN113678216A (https=)
DE (1) DE112020002053T5 (https=)
TW (1) TWI853921B (https=)
WO (1) WO2020219354A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12525401B2 (en) 2023-02-13 2026-01-13 Samsung Electro-Mechanics Co., Ltd. Multilayered capacitor and manufacturing method thereof

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11495406B2 (en) 2019-01-28 2022-11-08 KYOCERA AVX Components Corporation Multilayer ceramic capacitor having ultra-broadband performance
JP7446318B2 (ja) 2019-01-28 2024-03-08 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 超広帯域性能を有する積層セラミックコンデンサ
US11361907B2 (en) 2019-01-28 2022-06-14 KYOCERA AVX Components Corporation Multilayer ceramic capacitor having ultra-broadband performance
US11211201B2 (en) 2019-01-28 2021-12-28 Avx Corporation Multilayer ceramic capacitor having ultra-broadband performance
US11270842B2 (en) 2019-01-28 2022-03-08 KYOCERA AVX Components Corporation Multilayer ceramic capacitor having ultra-broadband performance
DE112022000957T5 (de) 2021-02-01 2023-11-16 KYOCERA AVX Components Corporation Varistor mit flexiblen Anschlüssen
CN112820544A (zh) * 2021-02-09 2021-05-18 福建欧中电子有限公司 一种高可靠多层陶瓷穿芯电容及其制作方法
CN116724365A (zh) * 2021-03-11 2023-09-08 京瓷Avx元器件公司 包括匹配变阻器的变阻器阵列
US12198858B2 (en) 2021-12-31 2025-01-14 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component
CN118765463A (zh) * 2022-03-29 2024-10-11 株式会社村田制作所 固体电池以及电子器件

Family Cites Families (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2852372B2 (ja) 1989-07-07 1999-02-03 株式会社村田製作所 積層セラミックコンデンサ
JP2890985B2 (ja) 1992-06-16 1999-05-17 株式会社村田製作所 バンドパスフィルタ
DE69432060T2 (de) 1993-08-24 2003-11-20 Matsushita Electric Industrial Co., Ltd. Geschichtete dielektrische Antennenweiche
JPH09120932A (ja) * 1995-08-18 1997-05-06 Tdk Corp 積層電子部品
JPH09190950A (ja) * 1996-01-09 1997-07-22 Mitsubishi Materials Corp 電子部品の外部電極
JP3201466B2 (ja) 1997-03-31 2001-08-20 日本電気株式会社 導電性高分子端子および固体電解コンデンサ
US6191933B1 (en) 1998-01-07 2001-02-20 Tdk Corporation Ceramic capacitor
JP2002343677A (ja) 2001-05-14 2002-11-29 Murata Mfg Co Ltd コンデンサ内蔵型積層電子部品
JP3885938B2 (ja) 2002-03-07 2007-02-28 Ｔｄｋ株式会社 セラミック電子部品、ペースト塗布方法及びペースト塗布装置
US7177137B2 (en) 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US7463474B2 (en) 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US6816356B2 (en) 2002-05-17 2004-11-09 Daniel Devoe Integrated broadband ceramic capacitor array
US6587327B1 (en) 2002-05-17 2003-07-01 Daniel Devoe Integrated broadband ceramic capacitor array
US6900708B2 (en) 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
WO2005065097A2 (en) 2003-12-22 2005-07-21 X2Y Attenuators, Llc Internally shielded energy conditioner
JP2005243944A (ja) * 2004-02-26 2005-09-08 Kyocera Corp セラミック電子部品
US20050248908A1 (en) 2004-05-06 2005-11-10 Gunther Dreezen Termination coating
US7334981B2 (en) 2004-10-29 2008-02-26 General Electric Company Counter-rotating gas turbine engine and method of assembling same
TWI277988B (en) 2004-11-18 2007-04-01 Tdk Corp Multilayer capacitor
JP4462194B2 (ja) 2006-01-17 2010-05-12 Ｔｄｋ株式会社 積層型貫通コンデンサアレイ
US7336475B2 (en) 2006-02-22 2008-02-26 Vishay Vitramon, Inc. High voltage capacitors
US8238075B2 (en) 2006-02-22 2012-08-07 Vishay Sprague, Inc. High voltage capacitors
JP4374041B2 (ja) 2007-07-09 2009-12-02 Ｔｄｋ株式会社 積層コンデンサ
WO2009066507A1 (ja) 2007-11-22 2009-05-28 Murata Manufacturing Co., Ltd. 積層セラミック電子部品
US8446705B2 (en) 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
US8449273B2 (en) * 2008-08-26 2013-05-28 Panasonic Corporation Fluid transporting device using conductive polymer
US8885319B2 (en) 2009-07-01 2014-11-11 Kemet Electronics Corporation High capacitance multilayer with high voltage capability
US9299476B2 (en) * 2010-10-22 2016-03-29 Newsouth Innovations Pty Limited Polymeric material
KR20120068622A (ko) 2010-12-17 2012-06-27 삼성전기주식회사 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
JP5267548B2 (ja) 2010-12-24 2013-08-21 Ｔｄｋ株式会社 積層コンデンサ
JP5353911B2 (ja) 2011-01-28 2013-11-27 株式会社村田製作所 電子部品及び基板モジュール
JP2013021300A (ja) * 2011-06-16 2013-01-31 Murata Mfg Co Ltd 積層セラミック電子部品
JP2013051392A (ja) * 2011-08-02 2013-03-14 Murata Mfg Co Ltd 積層セラミック電子部品
KR20130042924A (ko) 2011-10-19 2013-04-29 삼성전기주식회사 적층 세라믹 전자 부품
US20130107419A1 (en) 2011-10-28 2013-05-02 Kemet Electronics Corporation Multilayered ceramic capacitor with improved lead frame attachment
KR101761936B1 (ko) * 2012-03-13 2017-07-26 삼성전기주식회사 적층 세라믹 전자 부품
WO2013148567A1 (en) 2012-03-26 2013-10-03 Kemet Electronics Corporation Asymmetric high voltage capacitor
KR101525652B1 (ko) * 2012-05-04 2015-06-03 삼성전기주식회사 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
KR101462754B1 (ko) * 2013-01-24 2014-11-17 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법.
JP2014187304A (ja) * 2013-03-25 2014-10-02 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法
KR101462798B1 (ko) * 2013-07-16 2014-11-20 삼성전기주식회사 외부 전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자 부품
JP2015070144A (ja) 2013-09-30 2015-04-13 京セラ株式会社 積層コンデンサおよび閃光発光装置
KR102089694B1 (ko) 2014-04-30 2020-03-16 삼성전기주식회사 적층 세라믹 전자부품
KR102089700B1 (ko) 2014-05-28 2020-04-14 삼성전기주식회사 적층 세라믹 커패시터, 적층 세라믹 커패시터의 제조 방법 및 적층 세라믹 커패시터의 실장 기판
US9997295B2 (en) 2014-09-26 2018-06-12 Murata Manufacturing Co., Ltd. Electronic component
US10083795B2 (en) 2014-09-30 2018-09-25 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor and mounted structure with multilayer ceramic capacitor
US9443656B2 (en) 2014-09-30 2016-09-13 Murata Manufacturing Co., Ltd. Tensile stress resistant multilayer ceramic capacitor
KR102029497B1 (ko) 2014-11-04 2019-11-08 삼성전기주식회사 적층 칩 전자부품 및 그 실장 기판
KR102048098B1 (ko) 2014-11-04 2019-11-22 삼성전기주식회사 적층 칩 전자부품 및 그 실장 기판
CN105592627B (zh) * 2014-11-11 2019-08-23 柯达公司 导电物件及提供所述导电物件的方法
US10117333B2 (en) * 2015-01-31 2018-10-30 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor, mounting structure of multilayer ceramic capacitor, and taped electronic component array
JP2016146469A (ja) * 2015-01-31 2016-08-12 株式会社村田製作所 積層セラミックコンデンサ、積層セラミックコンデンサの実装構造およびテーピング電子部品連
US9847173B2 (en) 2015-06-26 2017-12-19 Murata Manufacturing Co., Ltd. Mounting substrate
JP6860995B2 (ja) 2016-08-29 2021-04-21 太陽誘電株式会社 積層セラミックコンデンサ
JP6822155B2 (ja) 2017-01-12 2021-01-27 株式会社村田製作所 積層セラミックコンデンサおよびその実装構造体
US20180374646A1 (en) 2017-06-26 2018-12-27 Vishay Israel Ltd. Wideband coupling capacitor
JP2019040943A (ja) * 2017-08-23 2019-03-14 株式会社村田製作所 積層セラミックコンデンサ
KR102463330B1 (ko) * 2017-10-17 2022-11-04 삼성전기주식회사 코일 전자 부품
JP7307084B2 (ja) 2018-03-06 2023-07-11 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 超広帯域性能を有する積層セラミックコンデンサ
JP7369703B2 (ja) 2018-03-06 2023-10-26 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 超広帯域性能を有する積層セラミックコンデンサ
JP6780673B2 (ja) * 2018-03-30 2020-11-04 株式会社村田製作所 積層セラミックコンデンサおよびその実装構造
US11270842B2 (en) 2019-01-28 2022-03-08 KYOCERA AVX Components Corporation Multilayer ceramic capacitor having ultra-broadband performance
JP7446318B2 (ja) 2019-01-28 2024-03-08 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 超広帯域性能を有する積層セラミックコンデンサ
US11361907B2 (en) 2019-01-28 2022-06-14 KYOCERA AVX Components Corporation Multilayer ceramic capacitor having ultra-broadband performance
US11211201B2 (en) 2019-01-28 2021-12-28 Avx Corporation Multilayer ceramic capacitor having ultra-broadband performance
US11495406B2 (en) 2019-01-28 2022-11-08 KYOCERA AVX Components Corporation Multilayer ceramic capacitor having ultra-broadband performance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12525401B2 (en) 2023-02-13 2026-01-13 Samsung Electro-Mechanics Co., Ltd. Multilayered capacitor and manufacturing method thereof

Also Published As

Publication number Publication date
JP2022541365A (ja) 2022-09-26
CN118942905A (zh) 2024-11-12
CN113678216A (zh) 2021-11-19
DE112020002053T5 (de) 2022-01-27
TW202109576A (zh) 2021-03-01
JP2024069253A (ja) 2024-05-21
US20200343046A1 (en) 2020-10-29
US11705280B2 (en) 2023-07-18
WO2020219354A1 (en) 2020-10-29
TWI853921B (zh) 2024-09-01

Similar Documents

Publication Publication Date Title
US11705280B2 (en) Multilayer capacitor having open mode electrode configuration and flexible terminations
US7576968B2 (en) Plated terminations and method of forming using electrolytic plating
JP4996036B2 (ja) めっき端子
US10347426B2 (en) Chip-shaped electronic component
US20140204502A1 (en) Multilayer ceramic capacitor and method of manufacturing the same
JP7706505B2 (ja) 接続性を改善した多層電子デバイス、およびそれを作製する方法
TWI853894B (zh) 包括導電通路之多層陶瓷電容器及相關之電路板及通信裝置
JP2004312023A (ja) めっきターミネーション
CN117153563A (zh) 多层电容器和包括其的电路板
JP2009224802A (ja) 無電解めっきターミネーションを形成する方法
JPWO2018159023A1 (ja) フレキシブルプリント配線板、接続体の製造方法及び接続体
HK40118054A (zh) 具有打开模式电极配置和柔性终端的多层电容器
HK40064651A (en) Multilayer capacitor having open mode electrode configuration and flexible terminations
CN120113024A (zh) 多层电容器
CN117981022A (zh) 多层陶瓷电容器
US12131848B2 (en) Varistor having flexible terminations
HK40108129A (zh) 具有改善的连接性的多层电子设备及其制造方法
HK40061030B (en) Multilayer ceramic capacitor including conductive vias
HK40098295A (zh) 具有柔性端子的压敏电阻器
HK40029069A (en) Multilayer electronic device having improved connectivity and method for making the same
HK40014032A (en) Multilayer capacitor and circuit board containing the same

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

B15 Application refused following examination

Free format text: ST27 STATUS EVENT CODE: N-2-6-B10-B15-EXM-PE0601 (AS PROVIDED BY THE NATIONAL OFFICE)

P12 Request for amendment of application rejected

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P12-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P12-X000 Request for amendment of application rejected

St.27 status event code: A-2-2-P10-P12-nap-X000

PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11 Administrative time limit extension requested

Free format text: ST27 STATUS EVENT CODE: U-3-3-T10-T11-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T13 Administrative time limit extension granted

Free format text: ST27 STATUS EVENT CODE: U-3-3-T10-T13-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

T13-X000 Administrative time limit extension granted

St.27 status event code: U-3-3-T10-T13-oth-X000

T11 Administrative time limit extension requested

Free format text: ST27 STATUS EVENT CODE: U-3-3-T10-T11-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T13 Administrative time limit extension granted

Free format text: ST27 STATUS EVENT CODE: U-3-3-T10-T13-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

T13-X000 Administrative time limit extension granted

St.27 status event code: U-3-3-T10-T13-oth-X000

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000