TWI853921B - 多層陶瓷電容及其形成方法 - Google Patents
多層陶瓷電容及其形成方法 Download PDFInfo
- Publication number
- TWI853921B TWI853921B TW109113741A TW109113741A TWI853921B TW I853921 B TWI853921 B TW I853921B TW 109113741 A TW109113741 A TW 109113741A TW 109113741 A TW109113741 A TW 109113741A TW I853921 B TWI853921 B TW I853921B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- electrodes
- monolith
- ceramic capacitor
- external termination
- Prior art date
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims description 35
- 239000000203 mixture Substances 0.000 claims abstract description 24
- 239000003990 capacitor Substances 0.000 claims description 52
- 229920001940 conductive polymer Polymers 0.000 claims description 22
- 238000009713 electroplating Methods 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000007667 floating Methods 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 26
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 15
- 229910052759 nickel Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 230000004913 activation Effects 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000003213 activating effect Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- -1 glycidyl ester Chemical class 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962838406P | 2019-04-25 | 2019-04-25 | |
| US62/838,406 | 2019-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202109576A TW202109576A (zh) | 2021-03-01 |
| TWI853921B true TWI853921B (zh) | 2024-09-01 |
Family
ID=72917256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109113741A TWI853921B (zh) | 2019-04-25 | 2020-04-24 | 多層陶瓷電容及其形成方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11705280B2 (https=) |
| JP (2) | JP2022541365A (https=) |
| KR (1) | KR20210146447A (https=) |
| CN (2) | CN113678216A (https=) |
| DE (1) | DE112020002053T5 (https=) |
| TW (1) | TWI853921B (https=) |
| WO (1) | WO2020219354A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11495406B2 (en) | 2019-01-28 | 2022-11-08 | KYOCERA AVX Components Corporation | Multilayer ceramic capacitor having ultra-broadband performance |
| JP7446318B2 (ja) | 2019-01-28 | 2024-03-08 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | 超広帯域性能を有する積層セラミックコンデンサ |
| US11361907B2 (en) | 2019-01-28 | 2022-06-14 | KYOCERA AVX Components Corporation | Multilayer ceramic capacitor having ultra-broadband performance |
| US11211201B2 (en) | 2019-01-28 | 2021-12-28 | Avx Corporation | Multilayer ceramic capacitor having ultra-broadband performance |
| US11270842B2 (en) | 2019-01-28 | 2022-03-08 | KYOCERA AVX Components Corporation | Multilayer ceramic capacitor having ultra-broadband performance |
| DE112022000957T5 (de) | 2021-02-01 | 2023-11-16 | KYOCERA AVX Components Corporation | Varistor mit flexiblen Anschlüssen |
| CN112820544A (zh) * | 2021-02-09 | 2021-05-18 | 福建欧中电子有限公司 | 一种高可靠多层陶瓷穿芯电容及其制作方法 |
| CN116724365A (zh) * | 2021-03-11 | 2023-09-08 | 京瓷Avx元器件公司 | 包括匹配变阻器的变阻器阵列 |
| US12198858B2 (en) | 2021-12-31 | 2025-01-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component |
| CN118765463A (zh) * | 2022-03-29 | 2024-10-11 | 株式会社村田制作所 | 固体电池以及电子器件 |
| KR20240126246A (ko) | 2023-02-13 | 2024-08-20 | 삼성전기주식회사 | 적층형 커패시터 및 이의 제조 방법 |
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| TW201626407A (zh) * | 2014-11-11 | 2016-07-16 | 柯達公司 | 提供具有導電金屬連接件之導電物件 |
| US20160227650A1 (en) * | 2015-01-31 | 2016-08-04 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor, mounting structure of multilayer ceramic capacitor, and taped electronic component array |
| JP2018113367A (ja) * | 2017-01-12 | 2018-07-19 | 株式会社村田製作所 | 積層セラミックコンデンサおよびその実装構造体 |
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| JP2016146469A (ja) * | 2015-01-31 | 2016-08-12 | 株式会社村田製作所 | 積層セラミックコンデンサ、積層セラミックコンデンサの実装構造およびテーピング電子部品連 |
| US9847173B2 (en) | 2015-06-26 | 2017-12-19 | Murata Manufacturing Co., Ltd. | Mounting substrate |
| JP6860995B2 (ja) | 2016-08-29 | 2021-04-21 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| US20180374646A1 (en) | 2017-06-26 | 2018-12-27 | Vishay Israel Ltd. | Wideband coupling capacitor |
| JP2019040943A (ja) * | 2017-08-23 | 2019-03-14 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| KR102463330B1 (ko) * | 2017-10-17 | 2022-11-04 | 삼성전기주식회사 | 코일 전자 부품 |
| JP7307084B2 (ja) | 2018-03-06 | 2023-07-11 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | 超広帯域性能を有する積層セラミックコンデンサ |
| JP7369703B2 (ja) | 2018-03-06 | 2023-10-26 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | 超広帯域性能を有する積層セラミックコンデンサ |
| JP6780673B2 (ja) * | 2018-03-30 | 2020-11-04 | 株式会社村田製作所 | 積層セラミックコンデンサおよびその実装構造 |
| US11270842B2 (en) | 2019-01-28 | 2022-03-08 | KYOCERA AVX Components Corporation | Multilayer ceramic capacitor having ultra-broadband performance |
| JP7446318B2 (ja) | 2019-01-28 | 2024-03-08 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | 超広帯域性能を有する積層セラミックコンデンサ |
| US11361907B2 (en) | 2019-01-28 | 2022-06-14 | KYOCERA AVX Components Corporation | Multilayer ceramic capacitor having ultra-broadband performance |
| US11211201B2 (en) | 2019-01-28 | 2021-12-28 | Avx Corporation | Multilayer ceramic capacitor having ultra-broadband performance |
| US11495406B2 (en) | 2019-01-28 | 2022-11-08 | KYOCERA AVX Components Corporation | Multilayer ceramic capacitor having ultra-broadband performance |
-
2020
- 2020-04-16 US US16/850,132 patent/US11705280B2/en active Active
- 2020-04-17 JP JP2021562984A patent/JP2022541365A/ja active Pending
- 2020-04-17 DE DE112020002053.3T patent/DE112020002053T5/de active Pending
- 2020-04-17 KR KR1020217038225A patent/KR20210146447A/ko not_active Ceased
- 2020-04-17 CN CN202080028169.1A patent/CN113678216A/zh active Pending
- 2020-04-17 CN CN202411065744.1A patent/CN118942905A/zh active Pending
- 2020-04-17 WO PCT/US2020/028737 patent/WO2020219354A1/en not_active Ceased
- 2020-04-24 TW TW109113741A patent/TWI853921B/zh active
-
2024
- 2024-02-26 JP JP2024026722A patent/JP2024069253A/ja active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104299677A (zh) * | 2013-07-16 | 2015-01-21 | 三星电机株式会社 | 用于外部电极的导电胶组合物和多层陶瓷电子组件 |
| TW201626407A (zh) * | 2014-11-11 | 2016-07-16 | 柯達公司 | 提供具有導電金屬連接件之導電物件 |
| US20160227650A1 (en) * | 2015-01-31 | 2016-08-04 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor, mounting structure of multilayer ceramic capacitor, and taped electronic component array |
| JP2018113367A (ja) * | 2017-01-12 | 2018-07-19 | 株式会社村田製作所 | 積層セラミックコンデンサおよびその実装構造体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022541365A (ja) | 2022-09-26 |
| CN118942905A (zh) | 2024-11-12 |
| CN113678216A (zh) | 2021-11-19 |
| DE112020002053T5 (de) | 2022-01-27 |
| TW202109576A (zh) | 2021-03-01 |
| JP2024069253A (ja) | 2024-05-21 |
| US20200343046A1 (en) | 2020-10-29 |
| KR20210146447A (ko) | 2021-12-03 |
| US11705280B2 (en) | 2023-07-18 |
| WO2020219354A1 (en) | 2020-10-29 |
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