KR20210090608A - 표면 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 - Google Patents

표면 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 Download PDF

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Publication number
KR20210090608A
KR20210090608A KR1020217008111A KR20217008111A KR20210090608A KR 20210090608 A KR20210090608 A KR 20210090608A KR 1020217008111 A KR1020217008111 A KR 1020217008111A KR 20217008111 A KR20217008111 A KR 20217008111A KR 20210090608 A KR20210090608 A KR 20210090608A
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KR
South Korea
Prior art keywords
copper foil
treated
resin
carrier
treated copper
Prior art date
Application number
KR1020217008111A
Other languages
English (en)
Korean (ko)
Inventor
즈바사 가토
미츠요시 마츠다
Original Assignee
미쓰이금속광업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이금속광업주식회사 filed Critical 미쓰이금속광업주식회사
Publication of KR20210090608A publication Critical patent/KR20210090608A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020217008111A 2018-11-19 2019-10-02 표면 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 KR20210090608A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-216720 2018-11-19
JP2018216720 2018-11-19
PCT/JP2019/038866 WO2020105289A1 (ja) 2018-11-19 2019-10-02 表面処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
KR20210090608A true KR20210090608A (ko) 2021-07-20

Family

ID=70773985

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217008111A KR20210090608A (ko) 2018-11-19 2019-10-02 표면 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP7453154B2 (zh)
KR (1) KR20210090608A (zh)
CN (1) CN112969824A (zh)
TW (1) TWI740231B (zh)
WO (1) WO2020105289A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022255420A1 (zh) * 2021-06-03 2022-12-08
US11540389B1 (en) 2021-07-06 2022-12-27 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
US20230019067A1 (en) 2021-07-06 2023-01-19 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
TWI756155B (zh) * 2021-07-19 2022-02-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板
JPWO2023042614A1 (zh) * 2021-09-14 2023-03-23
CN113943954B (zh) * 2021-12-01 2023-06-30 青海诺德新材料有限公司 一种2-3微米无针孔载体电解铜箔的制备方法
WO2024070248A1 (ja) * 2022-09-28 2024-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6293365B2 (ja) 2015-03-31 2018-03-14 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4538375B2 (ja) * 2005-05-31 2010-09-08 日鉱金属株式会社 プリント配線基板用金属材料
WO2014038716A1 (ja) 2012-09-10 2014-03-13 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
TWI515342B (zh) 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 表面處理銅箔、使用該表面處理銅箔所得之貼銅積層板以及印刷配線板
JP6497881B2 (ja) * 2013-10-04 2019-04-10 Ｊｘ金属株式会社 圧延銅箔、それを用いた銅張積層板、プリント配線板、電子機器、回路接続部材の製造方法及び回路接続部材
JP5819569B1 (ja) * 2013-12-10 2015-11-24 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法
CN107614760B (zh) 2015-07-03 2018-07-13 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板和印刷电路板
KR102338103B1 (ko) 2016-04-14 2021-12-10 미쓰이금속광업주식회사 표면 처리 동박, 캐리어를 구비하는 동박, 그리고 그것들을 사용한 동장 적층판 및 프린트 배선판의 제조 방법
CN108696987B (zh) * 2017-03-31 2021-11-30 Ｊｘ金属株式会社 表面处理铜箔、附有载体的铜箔、积层体、印刷布线板的制造方法及电子机器的制造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6293365B2 (ja) 2015-03-31 2018-03-14 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
JP7453154B2 (ja) 2024-03-19
TWI740231B (zh) 2021-09-21
CN112969824A (zh) 2021-06-15
JPWO2020105289A1 (ja) 2021-09-30
TW202020233A (zh) 2020-06-01
WO2020105289A1 (ja) 2020-05-28

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