JPWO2022255420A1 - - Google Patents
Info
- Publication number
- JPWO2022255420A1 JPWO2022255420A1 JP2023525897A JP2023525897A JPWO2022255420A1 JP WO2022255420 A1 JPWO2022255420 A1 JP WO2022255420A1 JP 2023525897 A JP2023525897 A JP 2023525897A JP 2023525897 A JP2023525897 A JP 2023525897A JP WO2022255420 A1 JPWO2022255420 A1 JP WO2022255420A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021093517 | 2021-06-03 | ||
PCT/JP2022/022386 WO2022255420A1 (ja) | 2021-06-03 | 2022-06-01 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022255420A1 true JPWO2022255420A1 (zh) | 2022-12-08 |
Family
ID=84324121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023525897A Pending JPWO2022255420A1 (zh) | 2021-06-03 | 2022-06-01 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022255420A1 (zh) |
KR (1) | KR20240017840A (zh) |
CN (1) | CN117480282A (zh) |
TW (1) | TWI818566B (zh) |
WO (1) | WO2022255420A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023182176A1 (ja) * | 2022-03-24 | 2023-09-28 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
WO2023182177A1 (ja) * | 2022-03-24 | 2023-09-28 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
WO2023182174A1 (ja) * | 2022-03-24 | 2023-09-28 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
WO2023182175A1 (ja) * | 2022-03-24 | 2023-09-28 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
WO2024070248A1 (ja) * | 2022-09-28 | 2024-04-04 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2024070247A1 (ja) * | 2022-09-28 | 2024-04-04 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2024070245A1 (ja) * | 2022-09-28 | 2024-04-04 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5758035B2 (ja) | 2013-08-20 | 2015-08-05 | Jx日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
JP6945523B2 (ja) * | 2016-04-14 | 2021-10-06 | 三井金属鉱業株式会社 | 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法 |
JP7356209B2 (ja) | 2017-03-31 | 2023-10-04 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
WO2020105289A1 (ja) * | 2018-11-19 | 2020-05-28 | 三井金属鉱業株式会社 | 表面処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
JP7114500B2 (ja) * | 2019-01-30 | 2022-08-08 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
JP7114499B2 (ja) * | 2019-01-30 | 2022-08-08 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
-
2022
- 2022-06-01 KR KR1020237043494A patent/KR20240017840A/ko unknown
- 2022-06-01 CN CN202280039574.2A patent/CN117480282A/zh active Pending
- 2022-06-01 JP JP2023525897A patent/JPWO2022255420A1/ja active Pending
- 2022-06-01 WO PCT/JP2022/022386 patent/WO2022255420A1/ja active Application Filing
- 2022-06-02 TW TW111120636A patent/TWI818566B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN117480282A (zh) | 2024-01-30 |
TWI818566B (zh) | 2023-10-11 |
WO2022255420A1 (ja) | 2022-12-08 |
KR20240017840A (ko) | 2024-02-08 |
TW202248462A (zh) | 2022-12-16 |