KR20210088551A - 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스 - Google Patents

폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스 Download PDF

Info

Publication number
KR20210088551A
KR20210088551A KR1020217012151A KR20217012151A KR20210088551A KR 20210088551 A KR20210088551 A KR 20210088551A KR 1020217012151 A KR1020217012151 A KR 1020217012151A KR 20217012151 A KR20217012151 A KR 20217012151A KR 20210088551 A KR20210088551 A KR 20210088551A
Authority
KR
South Korea
Prior art keywords
polyimide
general formula
group
resin film
less
Prior art date
Application number
KR1020217012151A
Other languages
English (en)
Korean (ko)
Inventor
아키노리 사에키
다쿠야 미야우치
다이치 미야자키
Original Assignee
도레이 카부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도레이 카부시키가이샤 filed Critical 도레이 카부시키가이샤
Publication of KR20210088551A publication Critical patent/KR20210088551A/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/385—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing halogens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020217012151A 2018-11-09 2019-10-24 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스 KR20210088551A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-211149 2018-11-09
JP2018211149 2018-11-09
PCT/JP2019/041645 WO2020095693A1 (ja) 2018-11-09 2019-10-24 ポリイミド前駆体、ポリイミド、ポリイミド樹脂膜、およびフレキシブルデバイス

Publications (1)

Publication Number Publication Date
KR20210088551A true KR20210088551A (ko) 2021-07-14

Family

ID=70612009

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217012151A KR20210088551A (ko) 2018-11-09 2019-10-24 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스

Country Status (5)

Country Link
JP (1) JP7384037B2 (ja)
KR (1) KR20210088551A (ja)
CN (1) CN113166409B (ja)
TW (1) TW202030226A (ja)
WO (1) WO2020095693A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111704719B (zh) * 2020-06-24 2021-07-20 中国科学院化学研究所 一种热固性聚酰亚胺树脂、预聚物、制备方法与应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013024849A1 (ja) 2011-08-18 2013-02-21 東レ株式会社 ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板
WO2018084067A1 (ja) 2016-11-01 2018-05-11 東レ株式会社 タッチパネル、タッチパネルの製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2760520B2 (ja) * 1988-09-29 1998-06-04 新日鐵化学株式会社 ポリイミド共重合体及びその製造方法
JP2597215B2 (ja) * 1990-06-01 1997-04-02 宇部興産株式会社 ポリイミドシロキサン組成物および固化膜
KR20070099676A (ko) * 2005-02-01 2007-10-09 국립대학법인 나고야공업대학 실록산 변성 다분기 폴리이미드
JP5296493B2 (ja) 2008-10-29 2013-09-25 三菱電線工業株式会社 絶縁部材
JP5256018B2 (ja) * 2008-12-26 2013-08-07 旭化成イーマテリアルズ株式会社 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器
JP2010254947A (ja) 2009-03-31 2010-11-11 Jsr Corp ポリイミド系材料、フィルム及び組成物、並びにその製造方法
KR101946092B1 (ko) * 2011-09-29 2019-02-08 제이에스알 가부시끼가이샤 수지 조성물 및 그것을 이용한 막 형성 방법
JP5891693B2 (ja) 2011-10-05 2016-03-23 Jsr株式会社 基板の製造方法および基板
KR101896271B1 (ko) 2013-03-18 2018-09-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법
JP5733355B2 (ja) 2013-07-26 2015-06-10 東レ株式会社 ポリイミド系樹脂水溶液
WO2015046019A1 (ja) * 2013-09-27 2015-04-02 東レ株式会社 ポリイミド前駆体、それから得られるポリイミド樹脂膜、ならびにそれを含む表示素子、光学素子、受光素子、タッチパネル、回路基板、有機ｅｌディスプレイ、および、有機ｅｌ素子ならびにカラーフィルタの製造方法
JP6462983B2 (ja) 2014-01-28 2019-01-30 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
JP6420064B2 (ja) 2014-06-03 2018-11-07 旭化成株式会社 ポリイミド前駆体組成物及びポリイミドフィルム
JP6599620B2 (ja) 2015-03-05 2019-10-30 旭化成株式会社 ポリイミドを貼り合わせ接着層とする光学部材
CN105461923B (zh) 2015-12-25 2018-01-05 南京理工大学 一种聚酰亚胺薄膜及其制备方法
JP6292351B1 (ja) 2016-06-24 2018-03-14 東レ株式会社 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法
JP6458099B2 (ja) 2016-09-16 2019-01-23 旭化成株式会社 ポリイミド前駆体、樹脂組成物、樹脂フィルム及びその製造方法
JP6944784B2 (ja) 2017-02-03 2021-10-06 東京応化工業株式会社 積層体、フレキシブルデバイスおよび積層体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013024849A1 (ja) 2011-08-18 2013-02-21 東レ株式会社 ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板
WO2018084067A1 (ja) 2016-11-01 2018-05-11 東レ株式会社 タッチパネル、タッチパネルの製造方法

Also Published As

Publication number Publication date
TW202030226A (zh) 2020-08-16
WO2020095693A1 (ja) 2020-05-14
JP7384037B2 (ja) 2023-11-21
JPWO2020095693A1 (ja) 2021-09-30
CN113166409A (zh) 2021-07-23
CN113166409B (zh) 2023-07-28

Similar Documents

Publication Publication Date Title
JP6883640B2 (ja) 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法
JP7033171B2 (ja) 空隙を有するポリイミドフィルム及びその製造方法
KR101946092B1 (ko) 수지 조성물 및 그것을 이용한 막 형성 방법
JP7367699B2 (ja) ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
JP7363142B2 (ja) ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物およびその膜状物、それを含む積層体、ならびにフレキシブルデバイス
JPWO2019065164A1 (ja) ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物、ポリイミド樹脂膜、積層体の製造方法、カラーフィルタの製造方法、液晶素子の製造方法および有機ｅｌ素子の製造方法
JP7384037B2 (ja) ポリイミド前駆体、ポリイミド、ポリイミド樹脂膜、およびフレキシブルデバイス
WO2021106627A1 (ja) ポリイミド、ポリイミド樹脂膜、積層体およびフレキシブルデバイス