KR20200140718A - 적층 기판, 전자 디바이스의 제조 방법 및 적층 기판의 제조 방법 - Google Patents

적층 기판, 전자 디바이스의 제조 방법 및 적층 기판의 제조 방법 Download PDF

Info

Publication number
KR20200140718A
KR20200140718A KR1020200064847A KR20200064847A KR20200140718A KR 20200140718 A KR20200140718 A KR 20200140718A KR 1020200064847 A KR1020200064847 A KR 1020200064847A KR 20200064847 A KR20200064847 A KR 20200064847A KR 20200140718 A KR20200140718 A KR 20200140718A
Authority
KR
South Korea
Prior art keywords
resin layer
polyimide resin
less
laminated substrate
substrate
Prior art date
Application number
KR1020200064847A
Other languages
English (en)
Korean (ko)
Inventor
슈마 가와사키
요우헤이 나가오
Original Assignee
에이지씨 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이지씨 가부시키가이샤 filed Critical 에이지씨 가부시키가이샤
Publication of KR20200140718A publication Critical patent/KR20200140718A/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Ceramic Capacitors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020200064847A 2019-06-06 2020-05-29 적층 기판, 전자 디바이스의 제조 방법 및 적층 기판의 제조 방법 KR20200140718A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019106248 2019-06-06
JPJP-P-2019-106248 2019-06-06

Publications (1)

Publication Number Publication Date
KR20200140718A true KR20200140718A (ko) 2020-12-16

Family

ID=73609422

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200064847A KR20200140718A (ko) 2019-06-06 2020-05-29 적층 기판, 전자 디바이스의 제조 방법 및 적층 기판의 제조 방법

Country Status (4)

Country Link
JP (1) JP7115511B2 (ja)
KR (1) KR20200140718A (ja)
CN (1) CN112046100B (ja)
TW (1) TWI813882B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022224933A1 (ja) * 2021-04-22 2022-10-27 Ａｇｃ株式会社 積層基板、積層体、積層体の製造方法、電子デバイス用部材付き積層体、電子デバイスの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015104843A (ja) 2013-11-29 2015-06-08 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 積層体とその製造方法、及び該積層体を用いた電子デバイスの製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009220386A (ja) * 2008-03-17 2009-10-01 Nippon Mining & Metals Co Ltd ２層銅張積層板及びその製造方法
KR101723254B1 (ko) * 2009-09-08 2017-04-04 도요보 가부시키가이샤 유리/수지 적층체 및 그것을 사용한 전자 디바이스
JP2011195937A (ja) * 2010-03-23 2011-10-06 Sumitomo Metal Mining Co Ltd 銅被覆ポリイミドフィルム基板の製造方法
JP2013056977A (ja) * 2011-09-07 2013-03-28 Sumitomo Metal Mining Co Ltd 銅被覆ポリイミドフィルム基板の製造方法
CN103875309A (zh) * 2011-10-12 2014-06-18 旭硝子株式会社 带密合性树脂层的电子器件的制造方法
JP5924344B2 (ja) * 2011-10-18 2016-05-25 旭硝子株式会社 積層体、積層体の製造方法、および、電子デバイス用部材付きガラス基板の製造方法
JP6457168B2 (ja) * 2012-06-19 2019-01-23 日鉄ケミカル＆マテリアル株式会社 表示装置支持基材用ポリイミドフィルム、及びその積層体、並びその製造方法
KR20160102172A (ko) * 2013-12-26 2016-08-29 아사히 가라스 가부시키가이샤 유리 적층체 및 전자 디바이스의 제조 방법
KR20160102429A (ko) * 2013-12-27 2016-08-30 아사히 가라스 가부시키가이샤 유리 적층체 및 그 제조 방법
JP6361440B2 (ja) * 2014-05-30 2018-07-25 Ａｇｃ株式会社 ガラス積層体およびその製造方法、電子デバイスの製造方法
JP2016035832A (ja) * 2014-08-01 2016-03-17 旭硝子株式会社 電子デバイスの製造方法、ガラス積層体の製造方法
TWI709481B (zh) * 2014-08-25 2020-11-11 日商東洋紡股份有限公司 矽烷偶合劑層疊層高分子膜及其製造方法、疊層體及其製造方法、可撓性電子器件之製造方法
JP6471643B2 (ja) * 2015-08-06 2019-02-20 Ａｇｃ株式会社 ガラス積層体およびその製造方法
WO2017099183A1 (ja) * 2015-12-11 2017-06-15 東レ株式会社 樹脂組成物、樹脂の製造方法、樹脂膜の製造方法および電子デバイスの製造方法
JP6688450B2 (ja) * 2016-01-15 2020-04-28 東洋紡株式会社 積層体、電子デバイス、及びフレキシブル電子デバイスの製造方法
TWI666239B (zh) * 2016-07-15 2019-07-21 日商宇部興產股份有限公司 聚醯亞胺積層體之製造方法及可撓性電路基板之製造方法
JP6946901B2 (ja) * 2016-12-28 2021-10-13 Ａｇｃ株式会社 積層体、シリコーン樹脂層付き支持基材、シリコーン樹脂層付き樹脂基板、電子デバイスの製造方法
JP2018130837A (ja) * 2017-02-13 2018-08-23 東洋紡株式会社 多層フィルムロール、および多層フィルムロールを製造する方法
JP7322410B2 (ja) * 2019-01-23 2023-08-08 東洋紡株式会社 ポリアミド酸組成物、ポリアミド酸組成物の製造方法およびポリイミドの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015104843A (ja) 2013-11-29 2015-06-08 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 積層体とその製造方法、及び該積層体を用いた電子デバイスの製造方法

Also Published As

Publication number Publication date
JP7115511B2 (ja) 2022-08-09
TWI813882B (zh) 2023-09-01
TW202106509A (zh) 2021-02-16
CN112046100B (zh) 2023-05-30
JP2020199767A (ja) 2020-12-17
CN112046100A (zh) 2020-12-08

Similar Documents

Publication Publication Date Title
JP6172362B2 (ja) ガラス積層体および電子デバイスの製造方法
TWI645979B (zh) Glass laminate and method of manufacturing electronic device
JP6136909B2 (ja) 樹脂層付き支持基板の製造方法、ガラス積層体の製造方法、電子デバイスの製造方法
JP6119567B2 (ja) ガラス積層体の製造方法および電子デバイスの製造方法
JP2013184346A (ja) ガラス積層体、電子デバイスの製造方法
JP7136275B2 (ja) 積層体、電子デバイスの製造方法、積層体の製造方法
US20170282500A1 (en) Glass laminate, method for producing electronic device, method for producing glass laminate, and glass plate package
JP7070425B2 (ja) 積層基板および電子デバイスの製造方法
TWI820384B (zh) 積層基板、積層體之製造方法、積層體、附電子裝置用構件之積層體、電子裝置之製造方法
KR20150100688A (ko) 유리 적층체 및 그 제조 방법 및, 실리콘 수지층이 장착된 지지 기재
KR102526047B1 (ko) 유리 적층체 및 그의 제조 방법
KR20150073976A (ko) 유리 적층체 및 그 제조 방법, 및 실리콘 수지층 부착 지지 기재
KR20200140718A (ko) 적층 기판, 전자 디바이스의 제조 방법 및 적층 기판의 제조 방법
KR102510793B1 (ko) 적층 기판, 적층체의 제조 방법, 적층체, 전자 디바이스용 부재 구비 적층체, 전자 디바이스의 제조 방법
JP7103163B2 (ja) 積層体、導通チェック方法、および、電子デバイスの製造方法
JP2017164903A (ja) ガラス積層体、無機層付き支持基板、電子デバイスの製造方法、無機層付き支持基板の製造方法

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E601 Decision to refuse application