KR20200062045A - 흡습성 실리콘 수지 조성물, 유기 el용 투명 밀봉재, 유기 el용 투명 건조재, 및 그의 사용 방법 - Google Patents

흡습성 실리콘 수지 조성물, 유기 el용 투명 밀봉재, 유기 el용 투명 건조재, 및 그의 사용 방법 Download PDF

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KR20200062045A
KR20200062045A KR1020190150066A KR20190150066A KR20200062045A KR 20200062045 A KR20200062045 A KR 20200062045A KR 1020190150066 A KR1020190150066 A KR 1020190150066A KR 20190150066 A KR20190150066 A KR 20190150066A KR 20200062045 A KR20200062045 A KR 20200062045A
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South Korea
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organic
fine particles
silica fine
silicone resin
group
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KR1020190150066A
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Korean (ko)
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히로토 오와다
도시유키 오자이
가즈유키 마츠무라
요시테루 사카츠메
츠토무 나카무라
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신에쓰 가가꾸 고교 가부시끼가이샤
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Publication of KR20200062045A publication Critical patent/KR20200062045A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5445—Silicon-containing compounds containing nitrogen containing at least one Si-N bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • H01L51/5259—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020190150066A 2018-11-26 2019-11-21 흡습성 실리콘 수지 조성물, 유기 el용 투명 밀봉재, 유기 el용 투명 건조재, 및 그의 사용 방법 KR20200062045A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018220321A JP6973360B2 (ja) 2018-11-26 2018-11-26 吸湿性シリコーン樹脂組成物、有機ｅｌ用透明封止材、有機ｅｌ用透明乾燥材、及びその使用方法
JPJP-P-2018-220321 2018-11-26

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KR20200062045A true KR20200062045A (ko) 2020-06-03

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JP (1) JP6973360B2 (ja)
KR (1) KR20200062045A (ja)
CN (1) CN111218204B (ja)
TW (1) TWI775015B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013176751A (ja) 2012-01-31 2013-09-09 Futaba Corp 乾燥剤及びこれを用いた有機ｅｌ素子
JP2017183191A (ja) 2016-03-31 2017-10-05 Ｌｕｍｉｏｔｅｃ株式会社 有機ｅｌパネル及びその製造方法

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JP3751618B2 (ja) * 2002-08-28 2006-03-01 山一電機株式会社 不織布、吸湿部材、不織布の製造方法、不織布の製造装置および有機ｅｌ表示装置
US8563112B2 (en) * 2008-05-12 2013-10-22 Yamagata Promotional Organization For Industrial Technology Organic EL light-emitting device and method for manufacturing the organic EL light-emitting device
ITMI20100080U1 (it) * 2010-03-22 2011-09-23 Getters Spa Composizione per la protezione di dispositivi sensibili alla presenza di h2o.
JP5640476B2 (ja) * 2010-06-08 2014-12-17 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び発光装置
KR20120021436A (ko) * 2010-07-30 2012-03-09 제일모직주식회사 흡습입자, 이를 포함하는 유기 ｅｌ 게터용 조성물 및 이를 이용한 유기 ｅｌ 소자
CN103068884B (zh) * 2010-08-13 2015-06-17 旭化成电子材料株式会社 感光性有机硅树脂组合物
CN103328382A (zh) * 2011-01-21 2013-09-25 Dic株式会社 多孔质二氧化硅颗粒的制造方法、防反射膜用树脂组合物、具有防反射膜的物品以及防反射薄膜
US9972757B2 (en) * 2012-03-09 2018-05-15 Sumitomo Osaka Cement Co., Ltd Surface-modified-metal-oxide-particle material, composition for sealing optical semiconductor element, and optical semiconductor device
JP6536821B2 (ja) * 2013-06-10 2019-07-03 日産化学株式会社 シリカ含有樹脂組成物及びその製造方法並びにシリカ含有樹脂組成物の成形品
JP2015166075A (ja) * 2014-03-04 2015-09-24 凸版印刷株式会社 吸湿剤、乾燥剤、有機ｅｌシート、及び吸湿剤の製造方法
WO2015145966A1 (ja) * 2014-03-24 2015-10-01 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネル、有機ｅｌ表示パネルの製造方法及び有機ｅｌ素子の封止方法
JP6389145B2 (ja) * 2015-06-05 2018-09-12 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、及び半導体装置
WO2017057607A1 (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 吸湿材料及びその製造方法、包装材料並びに包装物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013176751A (ja) 2012-01-31 2013-09-09 Futaba Corp 乾燥剤及びこれを用いた有機ｅｌ素子
JP2017183191A (ja) 2016-03-31 2017-10-05 Ｌｕｍｉｏｔｅｃ株式会社 有機ｅｌパネル及びその製造方法

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Publication number Publication date
JP2020084028A (ja) 2020-06-04
TWI775015B (zh) 2022-08-21
CN111218204A (zh) 2020-06-02
CN111218204B (zh) 2022-12-30
JP6973360B2 (ja) 2021-11-24
TW202031772A (zh) 2020-09-01

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