WO2014050318A1 - 光半導体素子封止用シリコーン組成物および光半導体装置 - Google Patents
光半導体素子封止用シリコーン組成物および光半導体装置 Download PDFInfo
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- WO2014050318A1 WO2014050318A1 PCT/JP2013/071321 JP2013071321W WO2014050318A1 WO 2014050318 A1 WO2014050318 A1 WO 2014050318A1 JP 2013071321 W JP2013071321 W JP 2013071321W WO 2014050318 A1 WO2014050318 A1 WO 2014050318A1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a silicone composition for encapsulating an optical semiconductor element, and in particular, the obtained cured product has both excellent light transmittance and mechanical strength, and an optical semiconductor using the cured composition.
- the present invention relates to an optical semiconductor device in which an element is sealed.
- an optical semiconductor device for example, an LED light emitting device
- an LED chip mounted on a support substrate is sealed with a transparent resin.
- a transparent resin for sealing an epoxy resin has been conventionally used.
- an epoxy resin has been conventionally used.
- due to an increase in the amount of heat generated due to the recent increase in brightness of LEDs and the shortening of the wavelength of light reliability due to cracking, yellowing, etc. The decline was a problem.
- a silicone resin having excellent heat resistance has been used as a sealing material for optical semiconductor devices.
- the thixotropy of the silicone resin used is inferior, the appropriate amount is directly applied to the LED chip on the support substrate using a dispenser, and it flows even if it is molded and cured, so that it has the desired shape. There was a problem that a molded / cured product could not be obtained. Further, as a result of insufficient thixotropy of the silicone resin, there has been a problem that a manufacturing apparatus using the silicone resin has to be expensive.
- Silica fine particles are known as those that impart thixotropy to silicone resins.
- the addition of silica fine particles has caused problems such as a decrease in transparency, such as white turbidity.
- diphenyldimethylsilicone for improving optical properties has been studied, but there is a problem in terms of transparency.
- Patent Document 1 describes a technique of blending silica fine particles into a silicone resin composition adjusted to have a refractive index equivalent to that of silica. As a result, thixotropy and transparency can be maintained at a certain level or more, but there has been a problem that mechanical properties are deteriorated as a sealing material for optical semiconductor devices.
- An object of the present invention is to provide an optical semiconductor device in which an optical semiconductor element is sealed with a silicone composition for sealing an optical semiconductor element to be obtained and a cured product thereof.
- the silicone composition for sealing an optical semiconductor element of the present invention is (A) a polyorganosiloxane represented by the following general formula (1), and (B) at least one alkenyl group in one molecule, x R 1 3 SiO 1/2 units, y pieces containing R 1 2 SiO units, and z-number of SiO 2 units (wherein, in each siloxane unit, R 1 is each independently represent a alkenyl group, or a halogen optionally substituted alkyl group.), x, y , Z when the total of z is converted to 1, resin states in which 0.3 ⁇ x ⁇ 0.5, 0 ⁇ y ⁇ 0.1, and 0.4 ⁇ z ⁇ 0.7, respectively
- the polyorganosiloxane having a structure is 100 parts by mass in total of the component (A) and the component (B), and the component (B) is 10 to 40 parts per 100 parts by mass of the total amount of the components (A) and (B).
- R 1 3 SiO 1/2 The amount of mass part, (R 1 3 SiO 1/2 ) (R 2 2 SiO) m (R 1 2 SiO) n (R 1 3 SiO 1/2 ) (1)
- R 1 independently represents an alkenyl group or an optionally substituted alkyl group
- R 2 independently represents an aryl group
- at least two of R 1 are alkenyl groups. Yes, 0.01 ⁇ m / (m + n) ⁇ 0.10.
- C A polyorganohydrogensiloxane having a hydrogen atom bonded to at least two silicon atoms in one molecule, based on 1 mol of the total amount of alkenyl groups each of the component (A) and the component (B).
- the amount of hydrogen atoms bonded to silicon atoms is 1 to 3 moles, (D) 5 to 20 parts by mass of silica powder, and (E) a catalytic amount of a hydrosilylation reaction catalyst, Each having a refractive index (25 ° C., D line) of 1.41 to 1.44.
- the optical semiconductor device of the present invention is characterized in that the optical semiconductor element is sealed with a cured product of the silicone composition for sealing an optical semiconductor element of the present invention.
- a silicone cured product obtained using the same is used as a sealing material for an optical semiconductor element
- a silicone composition for optical semiconductor element sealing that can achieve both sufficient light transmittance and mechanical strength.
- an optical semiconductor device encapsulated with a cured silicone having sufficient light transmittance and mechanical strength.
- the silicone composition for sealing an optical semiconductor element of the present invention comprises (A) a linear polyorganosiloxane having at least two alkenyl groups in one molecule represented by the general formula (1), and (B ) Having at least one alkenyl group in one molecule and containing x R 1 3 SiO 1/2 units, y R 1 2 SiO units, and z SiO 2 units, provided that each In the siloxane unit, each R 1 independently represents an alkenyl group or an alkyl group which may be substituted with halogen.) X, y, z when the total of x, y, z is converted to 1 is 0, respectively.
- a polyorganosiloxane having a resinous structure is 100 in total of the component (A) and the component (B).
- polyorganohydrogensiloxane having an amount of 10 to 40 parts by mass of component (B) and (C) a hydrogen atom bonded to at least two silicon atoms in one molecule is combined with component (A) and ( B)
- the amount of hydrogen atoms bonded to silicon atoms is 1 to 3 moles, (D) 5 to 20 parts by weight of silica powder, and (E) hydrosilyl
- the amount of the catalyst of the chemical reaction catalyst is contained, and the refractive index (25 ° C., D line) is 1.41 to 1.44.
- each component will be described.
- the component (A) is an alkenyl group-containing polyorganosiloxane that becomes the base polymer of the composition of the present invention together with the component (B) described below.
- the component (A) is a linear polyorganosiloxane having at least two alkenyl groups in one molecule represented by the following general formula (1).
- the polyorganosiloxane represented by the general formula (1) may be referred to as polyorganosiloxane (1).
- R 1 independently represents an alkenyl group or an optionally substituted alkyl group
- R 2 independently represents an aryl group
- at least two of R 1 are alkenyl groups. Yes, 0.01 ⁇ m / (m + n) ⁇ 0.10.
- the general formula (1) does not necessarily mean a block copolymer. That is, m indicating the number of intermediate units —R 2 2 SiO— and n indicating the number of —R 1 2 SiO— do not indicate the number in the block, and each intermediate unit exists in the whole molecule. The total number to be shown is shown respectively. That is, the polyorganosiloxane (1) may be a random copolymer.
- the average degree of polymerization of the polyorganosiloxane (1) is represented by n + m + 2 in which n and m are added to the number of terminal groups 2 in the general formula (1), and is in the range of 100 to 500 It is preferable.
- the average degree of polymerization is more preferably from 150 to 450, particularly preferably from 200 to 400.
- the viscosity (25 ° C.) of the polyorganosiloxane (1) is preferably 500 to 10000 mPa ⁇ s, particularly preferably 1000 to 5000 mPa ⁇ s.
- the viscosity of the polyorganosiloxane (1) is within this range, the workability of the resulting composition is good and the physical properties of the cured silicone product obtained from this composition are good.
- a viscosity means the viscosity measured at 25 degreeC with the rotational viscometer unless there is particular notice.
- conditions such as the number of rotations at the time of measurement are appropriately adjusted according to the viscosity of the specimen and the measuring apparatus used.
- each R 1 independently represents an alkenyl group or an alkyl group which may be halogen-substituted.
- the alkenyl group that the polyorganosiloxane (1) has include a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group, etc., having 2 to 8 carbon atoms, more preferably 2 to 4 carbon atoms. Things.
- the alkenyl group possessed by the polyorganosiloxane (1) may contain two or more types, but is preferably composed of only one type. As the alkenyl group, a vinyl group and an allyl group are more preferable, and a vinyl group is particularly preferable.
- the alkenyl group content in the general formula (1) is 2 or more. Moreover, it is preferable that the content number of the alkenyl group in the said General formula (1) is 40 or less.
- R 1 are alkenyl groups, and these alkenyl groups are bonded to a silicon atom at the molecular chain end as in R 1 represented by (R 1 3 SiO 1/2 ). It may be bonded to a silicon atom at an intermediate portion of the molecular chain as R 1 represented by (R 1 2 SiO). Further, both of the two R 1 groups in (R 1 2 SiO) may be an alkenyl group, or one of them may be an alkenyl group.
- the alkenyl group may be bonded to the silicon atom only at one of the terminal and intermediate part of the molecular chain, but may be bonded to the silicon atom at both the terminal and intermediate part of the molecular chain.
- R 1 which is not an alkenyl group represents an alkyl group which may be halogen-substituted.
- alkyl group include linear, branched or cyclic alkyl groups having 1 to 10 carbon atoms. A more preferable number of carbon atoms is 1-6. Specific examples include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a cyclohexyl group, and a heptyl group.
- the halogen atom in the halogen substitution is preferably a chlorine atom or a fluorine atom.
- halogen-substituted alkyl group examples include a chloromethyl group, a 3-chloropropyl group, and a 3,3,3-trifluoropropyl group.
- the alkyl group which may be substituted by halogen in the polyorganosiloxane (1) may contain two or more types, but is preferably composed of only one type.
- R 1 which is not an alkenyl group that is, an alkyl group which may be halogen-substituted, a methyl group, an ethyl group, or a 3,3,3-trifluoropropyl group is more preferable, and a methyl group is particularly preferable.
- R 2 represents an aryl group.
- the aryl group include aryl groups having 6 to 14 carbon atoms. Specifically, a phenyl group, a tolyl group, a xylyl group, a naphthyl group, etc. are mentioned.
- the aryl group which polyorganosiloxane (1) has may contain 2 or more types, it is preferable to comprise only 1 type.
- a phenyl group is particularly preferable.
- the relation of the number n of D units in which two optionally substituted alkyl groups are bonded is a relation satisfying 0.01 ⁇ m / (m + n) ⁇ 0.10, and preferably 0.04 ⁇ m /(M+n) ⁇ 0.07. If m / (m + n) is within the above range, sufficient transparency and mechanical strength can be achieved in the obtained silicone cured product. When m / (m + n) is 0.01 or less, the transparency of the composition is lowered, and when it is 0.1 or more, mechanical strength such as tensile strength and elongation is lowered.
- one type of polyorganosiloxane (1) may be used alone, or two or more types may be used in combination.
- viscosity (25 degreeC) of each polyorganosiloxane (1) it is not necessarily in the said range, and viscosity (25 degreeC) as (A) component which mixed these Is preferably in the above range.
- the average degree of polymerization and viscosity (25 ° C.) are within the above ranges for each polyorganosiloxane (1) constituting component (A). Is more preferable.
- Component (B) has at least one alkenyl group in one molecule and contains x R 1 3 SiO 1/2 units, y R 1 2 SiO units, and z SiO 2 units. (However, in each siloxane unit, R 1 independently represents an alkenyl group or an alkyl group which may be substituted with a halogen.)
- Each z is a resinous structure in which 0.3 ⁇ x ⁇ 0.5, 0 ⁇ y ⁇ 0.1, and 0.4 ⁇ z ⁇ 0.7, in other words, a polyorganosiloxane having a three-dimensional network structure.
- polyorganosiloxane (2) the polyorganosiloxane (2).
- the polyorganosiloxane (2) is an R 1 SiO 3/2 unit (provided that R 1 is the same as in the case of the other siloxane units described above) as long as the effects of the present invention are not impaired, if necessary.
- the mass average molecular weight of the polyorganosiloxane (2) measured by gel permeation chromatography is preferably in the range of 1000 to 10,000, and more preferably 3000 to 6000. When the mass average molecular weight of the polyorganosiloxane (2) is within the above range, there is no problem in operation due to remarkably high viscosity of the composition, and the mechanical strength after curing is good.
- the polyorganosiloxane (2) has a relatively high viscosity even if it is solid at room temperature (25 ° C.) as long as the composition of the siloxane unit is within the above range, for example, 200 Pa ⁇ s or more. It may be liquid.
- the alkenyl group represented by R 1 or the alkyl group optionally substituted by halogen and the preferred embodiments thereof are the alkenyl group represented by R 1 in the general formula (1) or The same as the alkyl group which may be halogen-substituted.
- Polyorganosiloxane (2) has at least one alkenyl group in one molecule.
- the polyorganosiloxane (2) preferably has two or more alkenyl groups.
- the number of alkenyl groups in the polyorganosiloxane (2) is preferably 10 or less.
- the R 1 3 SiO 1/2 unit contained in the molecule of the polyorganosiloxane (2) is an M unit siloxane unit (hereinafter sometimes referred to as “Mb unit”) in which three R 1 atoms are bonded to a silicon atom.
- Mb unit M unit siloxane unit
- R 1 2 SiO units of D units R 1 has two silicon-bonded siloxane units is (hereinafter, sometimes referred to as "Db unit”.), SiO 2 units wherein R 1 is bonded to a silicon atom
- the alkenyl group that the polyorganosiloxane (2) has at least one per molecule may be in the Mb unit or in the Db unit.
- a plurality of alkenyl groups may be present in the Mb unit, may be present in the Db unit, or may be present in each of the Mb unit and the Db unit.
- the relationship among the number x of Mb units, the number y of Db units, and the number z of Q units z in the molecule of the polyorganosiloxane (2) is x, y when the total of x, y, z is converted to 1.
- Z are in a relationship of 0.3 ⁇ x ⁇ 0.5, 0 ⁇ y ⁇ 0.1, and 0.4 ⁇ z ⁇ 0.7, respectively.
- y is more preferably 0.04 to 0.09.
- x is more preferably 0.36 to 0.44
- z is more preferably 0.45 to 0.60.
- a cure rate can be made appropriate so that the shape at the time of supplying this composition can be maintained.
- the relationship between x, y, and z is the above relationship, the dome shape when the composition is supplied Curing can be completed while maintaining.
- the component (B) one type of polyorganosiloxane (2) may be used alone, or two or more types may be used in combination.
- the component (A) and the component (B) are alkenyl group-containing polyorganosiloxanes serving as a base polymer and contain 100 parts by mass in total.
- the content ratio of the component (A) and the component (B) is such that the component (B) is 10 to 40 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B).
- the amount is preferably 15 to 35 parts by mass.
- Component (C) The polyorganohydrogensiloxane having hydrogen atoms bonded to at least two silicon atoms in one molecule as the component (C) acts as a crosslinking component that reacts with the components (A) and (B).
- component (C) component There is no restriction
- various polyorgano hydrogen siloxanes such as linear, cyclic, branched, and three-dimensional network structure (resin-like structure), can be used.
- the (C) component polyorganohydrogensiloxane has 2 or more, preferably 3 or more, hydrogen atoms bonded to silicon atoms in one molecule, that is, hydrosilyl groups (Si—H groups).
- Si—H groups hydrosilyl groups
- the average number (average polymerization degree) of silicon atoms in one molecule of component (C) is preferably about 2 to 1,000, more preferably about 3 to 100.
- the viscosity (25 ° C.) of the component (C) is preferably 500 mPa ⁇ s or less, particularly preferably in the range of 10 to 100 mPa ⁇ s. When the viscosity of component (C) is within this range, the workability of the resulting composition is good, and the physical properties of the silicone cured product obtained from this composition are good.
- R 3 for example, polyorganohydrogensiloxane represented by the following average composition formula (3) is used.
- R 3 is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 14, more preferably 1 to 10 carbon atoms, which does not have an aliphatic unsaturated group.
- b are 0.7 ⁇ a ⁇ 2.1 and 0.001 ⁇ b ⁇ 1.0, and 0.8 ⁇ a + b ⁇ 3.0, more preferably 1.0 ⁇ a + b ⁇ 2.5. Is a positive number.
- R 3 examples include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, t-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, and decyl group.
- Alkyl groups such as phenyl groups, aryl groups such as tolyl groups, xylyl groups and naphthyl groups; aralkyl groups such as benzyl groups, phenylethyl groups and phenylpropyl groups; some or all of hydrogen atoms in these hydrocarbon groups Groups substituted with a halogen atom, for example, a chloromethyl group, a 3-chloropropyl group, a bromoethyl group, a 3,3,3-trifluoropropyl group, and the like.
- R 3 is preferably an alkyl group or an aryl group, more preferably a methyl group or a phenyl group, and particularly preferably a methyl group.
- component (C) examples include molecular chain both ends trimethylsiloxy group-capped methylhydrogenpolysiloxane, molecular chain both ends trimethylsiloxy group-capped dimethylsiloxane / methylhydrogensiloxane copolymer, molecular chain both ends trimethylsiloxy group.
- component (C) among the polyorganohydrogensiloxanes, in particular, polymethylhydrogensiloxane having only a methyl group as an organic group bonded to a silicon atom, specifically, the average composition formula (3) Polymethylhydrogensiloxane in which all R 3 are methyl groups is preferred.
- the content of the polyorganohydrogensiloxane as component (C) is the effective curing amount of the components (A) and (B), and in particular, the Si—H group of component (C) is the component (A). And (B) an amount of 1 to 3 mol, preferably 1.2 to 2.5 mol, relative to 1 mol of the total amount of alkenyl groups (for example, vinyl groups) each of component (B) has is there.
- the curing reaction proceeds sufficiently, and a large amount of unreacted Si—H groups do not remain in the silicone cured product.
- the physical properties of the material hardly change over time.
- the silica powder of a component may be a well-known thing generally mix
- Component (D) imparts adequate fluidity and thixotropy to the composition before crosslinking, and imparts high mechanical strength required for the use to the crosslinked polyorganosiloxane obtained by crosslinking. Has an effect.
- the silica powder of component (D) preferably has a specific surface area by the BET method (hereinafter referred to as BET specific surface area) of 50 m 2 / g or more in order to perform the above function by being added to the composition of the present invention. 50 to 600 m 2 / g is more preferable, and 100 to 400 m 2 / g is particularly preferable.
- the type of silica is not particularly limited, but precipitated silica, fumed silica (fumed silica), calcined silica, and the like are preferably used. From the viewpoint of reinforcing and thixotropic properties, fumed silica is preferred.
- the silica powder of component (D) is an essential component in the composition of the present invention, but since many silanol groups (Si—OH groups) exist on the untreated silica surface, the silica powder is added as it is. , Prone to problems such as thickening and significant plasticization return. Therefore, it is preferable to hydrophobize the surface of the silica powder.
- the surface treatment amount is preferably such that the amount of carbon on the silica surface is 2.0% by mass or more, more preferably 3.0% by mass or more. If it is less than 2.0 mass%, there is little effect in the thickening of a composition and the improvement of a pot life.
- the upper limit of the carbon amount is not particularly limited, but is usually 20% by mass or less, preferably 12% by mass or less, and particularly 8% by mass or less.
- a powder that has been surface-treated in advance in a powder state may be used, or surface treatment may be performed by a kneading process.
- organosilicon compound used as the surface treating agent examples include hexaorganodisilazanes such as 1,3-divinyltetramethyldisilazane, 1,3-dimethyltetravinyldisilazane, hexamethyldisilazane, octamethyltrisilazane, , Organosilazanes such as octaorganotrisilazane such as 5-divinylhexamethyltrisilazane, alkyltrialkoxysilanes such as methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, butyltrimethoxysilane, dimethyldimethoxysilane, Dialkyldialkoxysilanes such as diethyldimethoxysilane, dimethyldiethoxysilane, die
- a commercially available product may be used as the silica powder of component (D).
- Examples of commercially available products as fumed silica surface-untreated, Aerosil 200 (trade name, EVONIC made, BET specific surface area: 200m 2 / g), Aerosil 300 (trade name, EVONIC made, BET specific surface area: 300m 2 / g ) And the like.
- Aerosil 200 trade name, EVONIC made, BET specific surface area: 200m 2 / g
- Aerosil 300 trade name, EVONIC made, BET specific surface area: 300m 2 / g
- a component may use 1 type or may use 2 or more types together.
- the content of the component (D) in the composition of the present invention is 5 to 20 parts by mass, preferably 10 to 15 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). If the content of the silica powder as the component (D) is in the above range, the viscosity of the composition will be moderate, the workability during molding will be kept good, and the mechanical strength of the resulting silicone cured product, etc. The characteristics are also kept sufficiently.
- the hydrosilylation reaction catalyst as component (E) promotes the addition reaction (hydrosilylation reaction) between the alkenyl group contained in each of components (A) and (B) and the Si—H group in component (C). It is a catalyst.
- the component (E) include platinum-based catalysts, palladium-based catalysts, rhodium-based catalysts, and the like, but platinum-based catalysts are preferable from the viewpoint of economy.
- platinum-based catalyst for example, chloroplatinic acid, alcohol-modified chloroplatinic acid, a coordination compound of chloroplatinic acid and olefins, vinylsiloxane or acetylene compound can be used. These can be used singly or in combination of two or more.
- the content of the component (E) is not particularly limited as long as it is an amount effective as a catalyst for the hydrosilylation reaction, but with respect to the total amount (mass) of the component (A), the component (B), and the component (C),
- platinum element it is in the range of 0.1 to 1,000 ppm, more preferably 1 to 500 ppm, and still more preferably 1 to 20 ppm. When the content is within this range, the addition reaction is sufficiently accelerated, so that sufficient curing can be obtained and it is economically advantageous.
- the silicone composition for sealing an optical semiconductor element of the present invention further contains at least two kinds selected from an epoxy group, a hydrosilyl group (Si—H group), a crosslinkable vinyl group, and an alkoxysilyl group as the component (F). It is preferable to contain an adhesion-imparting agent.
- the silane coupling agent (F1) represented by following formula (4) is mentioned, for example.
- YQ-SiR 11 p X (3-p) (4) (In the formula (4), R 11 represents an alkyl group having 1 to 5 carbon atoms, X represents an alkoxy group having 1 to 5 carbon atoms, and Y represents an epoxy group or an optionally substituted vinyl group.
- Q represents a divalent hydrocarbon group having 1 to 10 carbon atoms which may have a single bond, —O—, —C ( ⁇ O) —O— bond, and p is 0 or 1 Yes, multiple Xs may be the same or different.
- YQ- examples include vinyl group, vinylphenyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, 2- (3,4-epoxycyclohexyl) ethyl group, 3-glycidoxy A propyl group etc. are mentioned.
- R 11 is preferably a methyl group.
- X is preferably a methoxy group or an ethoxy group.
- component (F) adhesion-imparting agent examples include an organosiloxane oligomer having at least two Si—H groups in one molecule, a functional group capable of reacting with the Si—H group, and an epoxy group.
- a compound (F2) obtained by reacting a compound having at least one selected from a crosslinkable vinyl group and an alkoxysilyl group is also preferably used.
- the organosiloxane oligomer having a Si—H group preferably has 2 to 10 silicon atoms, more preferably 2 to 6 silicon atoms.
- Examples of the organosiloxane oligomer having a Si—H group include organosiloxane oligomers represented by the following formulas (S1) to (S4), respectively. Among these, the organosiloxane oligomer represented by (S1) is preferable.
- Examples of the compound having a functional group capable of reacting with the Si—H group of the organosiloxane oligomer having the Si—H group and at least one selected from an epoxy group, a crosslinkable vinyl group, and an alkoxysilyl group include the above (4 Silane coupling agent (F1) having a vinyl group having a vinyl group, a vinylphenyl group, a 3-acryloxypropyl group, a 3-methacryloxypropyl group, etc. as YQ- Is mentioned.
- a 1: 1 reaction product may be mentioned in a molar ratio of the organosiloxane oligomer represented by (S1) and the silane coupling agent (F1) having a 3-methacryloxypropyl group.
- the resulting reaction product is a compound (F2) having an alkoxysilyl group and a Si—H group.
- the adhesiveness-imparting agent of component (F) is also independently selected from the 1,3,5-position hydrogen of isocyanuric acid from an epoxy group, Si—H group, a crosslinkable vinyl group and an alkoxysilyl group.
- An isocyanuric acid derivative (F3) substituted with a monovalent organic group having one kind may be used.
- an isocyanuric acid derivative having an alkoxysilyl group is preferable.
- a component may use 1 type or may use 2 or more types together.
- a preferred combination is a combination of at least one silane coupling agent (F1) having an epoxy group and at least one compound (F2) having an alkoxysilyl group and a Si—H group.
- the component (F) is preferably contained in a proportion of 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass, with respect to 100 parts by mass of the total of the components (A) and (B).
- the silicone composition for sealing an optical semiconductor element of the present invention preferably further contains a liquid thixotropic agent as the component (G).
- the component (G) is a liquid compound that exhibits thixotropy by forming a hydrogen bond or pseudo-crosslinking with the hydroxyl group of the silica powder of the component (D).
- the term “liquid” means a liquid state at least at room temperature (25 ° C.), that is, a state having fluidity, for example, a state having a viscosity of 1000 mPa ⁇ s or less.
- liquid thixotropic agents examples include silanes and silicones having any one of polar groups such as organooxy groups such as hydroxy groups (—OH groups), alkoxy groups, alkenyloxy groups, aryloxy groups, and epoxy groups.
- Organic resin components such as compounds (organopolysiloxane) and polyether can be used. Specific examples include polyoxypropylene glycol, alkoxysilanes, and cyclic siloxanes containing the above functional groups.
- a component may use 1 type or may use 2 or more types together.
- the component (G) is preferably contained in a proportion of 0.005 to 5 parts by mass, more preferably 0.01 to 3 parts by mass with respect to 100 parts by mass of the total of the components (A) and (B). .
- the thixotropy is preferably set to a sufficient level in, for example, an index ( ⁇ 2 / ⁇ 20 ) described later.
- the (G) component preferably the (G) component that does not function as an adhesiveness imparting agent, It is preferable to blend in an amount that reaches a sufficient level.
- the blending amount of the component (G) when the components (F1), (F2), and (F3) are blended in the above preferred amounts as the component (F), the blending amount of the component (G)
- the ratio of 0.005 to 1 part by mass is preferable with respect to the total of 100 parts by mass of component (A) and component (B), and 0.01 to 0.5 part by mass is more preferable.
- a polyether such as polyoxypropylene glycol is preferably used as the component (G).
- the thixotropy is thereby improved.
- the level described below has reached a sufficient level, it is not necessary to further add component (G).
- the adhesive can be blended so that the cured product obtained has a sufficient level of adhesion with the optical semiconductor element and the support substrate, and thixotropy has a sufficient level according to the following index. That's fine.
- the silicone composition for encapsulating an optical semiconductor element of the present invention contains the components (A) to (E) as essential components in the above-described content, and optionally contains the components (F) as optional components. ) Component and (G) component are contained in the above content. Furthermore, you may add the reaction inhibitor which suppresses hydrosilylation reaction as an arbitrary component.
- reaction inhibitor examples include phosphorus-containing compounds such as triphenylphosphine; nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine, and benzotriazole; sulfur-containing compounds, acetylenic compounds, compounds containing two or more alkenyl groups, hydro Examples thereof include peroxy compounds and maleic acid derivatives, and acetylene compounds having a hydroxyl group such as 3-methyl-1-butyn-3-ol and 1-ethynyl-1-cyclohexanol are preferable.
- phosphorus-containing compounds such as triphenylphosphine
- nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine, and benzotriazole
- sulfur-containing compounds acetylenic compounds, compounds containing two or more alkenyl groups
- hydro Examples thereof include peroxy compounds and maleic acid derivatives, and acetylene compounds having a hydroxyl group such as 3-methyl-1-butyn-3-o
- the silicone composition for sealing an optical semiconductor element of the present invention includes an inorganic filler other than the above-mentioned silica powder of the above component (D) such as polyorganosiloxane other than the above, pulverized silica (quartz fine powder), aluminum oxide, Conductive fillers such as silver powder, phosphors for obtaining the desired emission color in the optical semiconductor device used, organic solvents such as toluene, xylene, hexane, heptane, ethanol, isopropyl alcohol, acetone, methyl ethyl ketone, dyes, pigments
- flame retardancy imparting agent, heat resistance improver, oxidation resistance deterioration agent, wavelength adjusting agent, etc. the range of the composition of the present invention described below and its cured product are not impaired and the purpose of the present invention is not impaired. You may add in the range.
- each component is not particularly limited, and the essential components (A) to (E) and optional components preferably added And a method of kneading the component (F), the component (G), and other optional components described above with a known kneader.
- the kneader include a planetary mixer, a three-roller, a kneader, and a Shinagawa mixer, which are provided with a heating unit and a cooling unit, if necessary, and these can be used alone or in combination.
- the silicone composition for encapsulating an optical semiconductor element of the present invention is liquid, and the viscosity ⁇ 20 at 20 rpm at 25 ° C. by a rotational viscometer is preferably 10 to 50 Pa ⁇ s.
- the viscosity exceeds 50 Pa ⁇ s, for example, when the LED is potted, the dispenser is likely to be clogged.
- it is less than 10 Pa ⁇ s, dripping tends to occur when potting.
- the ratio ⁇ 2 / ⁇ 20 of the viscosity ⁇ 2 at 2 rpm and the viscosity ⁇ 20 at 20 rpm at 25 ° C. by a rotational viscometer is 1.8 to 6.0. It is preferable that ⁇ 2 / ⁇ 20 is more preferably 2.0 to 5.0.
- the value of ⁇ 2 / ⁇ 20 can be used as an index for evaluating the thixotropy of the silicone composition for sealing an optical semiconductor element of the present invention.
- the discharged composition can maintain an appropriate dome shape.
- An appropriate dome shape means that the height / diameter ratio is 0.2 to 0.5.
- a bismetron VDH type manufactured by Shibaura System Co., Ltd.
- the silicone composition for sealing an optical semiconductor element of the present invention has a refractive index (25 ° C., D line) of 1.41 to 1.44, and a refractive index (25 ° C., D line) of 1.42 to 1.4. 43 is preferred.
- the refractive index of a composition can be measured using an Abbe refractometer, for example.
- a refractive index is a refractive index measured by 25 degreeC and a D line unless there is particular notice.
- the obtained silicone cured product has high light transmittance, for example, light at a wavelength of 400 nm, and is excellent in mechanical strength such as tensile strength and elongation.
- the silicone composition for sealing an optical semiconductor element of the present invention has a transmittance of 90% of light at a wavelength of 400 nm at 25 ° C. when measured as a sheet having a thickness of 2 mm in a cured silicone obtained by curing the silicone composition. It is preferable that it is above, and it is more preferable that it is 93% or more. If the transmittance
- the light transmittance can be measured by, for example, an ultraviolet / visible / near infrared spectrophotometer.
- the silicone composition for encapsulating an optical semiconductor element of the present invention is a cured silicone obtained by curing this, and has a hardness of 30 to 80 at 25 ° C. measured with a TYPE A type hardness tester based on JIS K6249. It is preferable that it is 50 to 70. If the hardness at 25 ° C. measured with a TYPE A type hardness tester is in the above range, it can be said that when the optical semiconductor element is sealed, it has sufficient mechanical strength as a sealing material.
- the silicone composition for encapsulating an optical semiconductor element of the present invention is a cured silicone product obtained by curing it, and has the above-mentioned hardness and a tensile strength at 25 ° C. measured by a tensile tester based on JIS K6249. Is preferably 4 MPa or more, and more preferably 6 MPa or more. Moreover, it is preferable that the elongation measured simultaneously with tensile strength is 70% or more, and it is more preferable that it is 100% or more. If the tensile strength and elongation are in the above ranges, it can be said that when the optical semiconductor element is sealed, it has sufficient mechanical strength as a sealing material.
- curing is carried out mainly by subjecting the (A) component, the (B) component and the (C) component to a hydrosilylation reaction.
- hardening reaction can be suitably adjusted according to the kind and the addition amount of the said reaction inhibitor.
- Preferred curing conditions include heating at 50 to 200 ° C. for 60 to 300 minutes.
- the silicone cured product thus obtained is in the form of a hard rubber or flexible resin and has good light transmission and mechanical strength as described above.
- the cured product of the silicone composition for sealing an optical semiconductor element of the present invention is used as a sealing material for sealing an optical semiconductor element such as an LED mounted on a substrate.
- the silicone composition for sealing an optical semiconductor element of the present invention is used, for example, for COB (chip on board)
- the silicone composition for sealing an optical semiconductor element is an optical semiconductor element mounted on a substrate.
- a predetermined amount is supplied so as to cover the whole.
- sealing is performed by hardening this composition. Since the silicone composition for sealing an optical semiconductor element of the present invention can maintain a predetermined shape, for example, a dome shape, after being supplied onto the optical semiconductor element until curing is completed, It is particularly suitable for COB (chip on board).
- the optical semiconductor device of the present invention is obtained by encapsulating an optical semiconductor element using the above-described silicone composition for encapsulating an optical semiconductor element of the present invention.
- the optical semiconductor element to be sealed is not particularly limited.
- the support structure for mounting the optical semiconductor element is not particularly limited, and may be a package, or a packageless support substrate such as a ceramic substrate, a silicon substrate, a glass epoxy substrate, a bakelite (epoxy resin) substrate, or a metal substrate. Good.
- the sealing method is not particularly limited, and a predetermined amount of the silicone composition for sealing an optical semiconductor element of the present invention is supplied in accordance with various sealing methods so that the optical semiconductor element is sealed.
- the optical semiconductor device can be manufactured by curing under predetermined conditions.
- COB is suitable as described above.
- general-purpose optical semiconductor devices such as photodiodes, CCDs, and CMOSs can be widely cited.
- the viscosity of each component is measured using a bismetron VDH type (manufactured by Shibaura System Co., Ltd.) as the rotational viscometer for the rotational speeds of 20 rpm and 2 rpm, and the rotational speed is 60 rpm.
- About bismethoron VDA type (made by Shibaura System Co., Ltd.) was used.
- polyorganosiloxanes shown in Table 1 below were used as the (A) component, the (B) component, and the (C) component.
- Table 1 for each component, abbreviations of polyorganosiloxane, average molecular formula or average unit formula (only expressed as a unit formula in the case of the average unit formula), viscosity [mPa ⁇ s] or mass at 25 ° C. measured by a rotational viscometer Average molecular weight (Mw) is shown.
- Mw rotational viscometer Average molecular weight
- the viscosity other than the component (B) indicates the viscosity.
- the viscosity was measured for the (A) component and the following (Ac) component with a No. 4 rotor at 60 rpm, and for the (C) component with a No. 1 rotor at 60 rpm.
- linear polymers (A1) and (A2) are linear polyorganosiloxanes classified as the component (A) used in the composition of the present invention, and the linear polymers (Ac1) to (Ac4) are It is a linear polyorganosiloxane used in comparative examples not classified as component (A) used in the composition of the present invention.
- the linear polymers (Ac1) to (Ac4) are referred to as (Ac) components.
- m / (m + n) was calculated, where m is the number of Ph 2 SiO units and n is the number of Me 2 SiO units. The results are also shown in Table 1.
- Vi represents a vinyl group
- Me represents a methyl group
- Ph represents a phenyl group.
- (D) Component Silica powder Silica powder (D1): Homogeneous silica having a specific surface area of about 140 m 2 / g, the surface of which was treated with hexamethyldisilazane. 4% by mass of carbon on the silica surface.
- Adhesion imparting agent 2 3-glycidoxypropyltrimethoxysilane (G) component: liquid thixotropic imparting agent polyoxypropylene glycol (Mw: 2000, viscosity (25 ° C., No 3 rotor, 60 rpm) 300 [mPa ⁇ s ])
- Examples 1 to 6, Comparative Examples 1 to 3 The components shown in Table 2 were mixed to prepare silicone compositions for encapsulating optical semiconductor elements of Examples 1 to 6 and Comparative Examples 1 to 3.
- the component (B) component which is a solid component contains uniformly in a composition.
- the component (B) was mixed with the component (A) as an xylene solution having an appropriate concentration, and then the xylene was removed by heating and / or decompression to prepare a mixture of the component (A) and the component (B). .
- the composition of each example was produced by mixing this mixture with another component.
- content of (E) component in Table 2 is content (ppm) of platinum element conversion with respect to the total mass of (A) component, (B) component, and (C) component.
- composition (refractive index) About each composition, the refractive index of D line
- Viscosity and thixotropy evaluation (viscosity ratio; ⁇ 2 / ⁇ 20 )
- thixotropy was evaluated by measuring the viscosity ⁇ 2 of 2 rpm and the viscosity ⁇ 20 of 20 rpm with a No 6 rotor using a rotational viscometer, and calculating the viscosity ratio ⁇ 2 / ⁇ 20 .
- the silicone composition for sealing an optical semiconductor element of the present invention has a high transmittance of light having a wavelength of 400 nm required for an optical semiconductor device in the obtained silicone cured product, and also has a high mechanical strength. Excellent. Note that, in the compositions of Comparative Examples 1 to 3 outside the range of the composition of the present invention, the obtained silicone cured product has insufficient light transmittance and / or mechanical strength at a wavelength of 400 nm.
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Abstract
Description
(A)下記一般式(1)で表されるポリオルガノシロキサンと、(B)1分子中に少なくとも1個のアルケニル基を有し、x個のR1 3SiO1/2単位、y個のR1 2SiO単位、およびz個のSiO2単位を含有し(ただし、各シロキサン単位中、R1はそれぞれ独立にアルケニル基またはハロゲン置換されていてもよいアルキル基を示す。)、x、y、zの合計を1と換算したときのx、y、zがそれぞれ、0.3≦x≦0.5、0<y≦0.1、0.4≦z<0.7である樹脂状構造のポリオルガノシロキサンを、(A)成分と(B)成分の合計で100質量部、かつ(A)成分と(B)成分の合計量100質量部に対して(B)成分が10~40質量部となる量、
(R1 3SiO1/2)(R2 2SiO)m(R1 2SiO)n(R1 3SiO1/2) …(1)
(ただし、式(1)中、R1はそれぞれ独立にアルケニル基またはハロゲン置換されていてもよいアルキル基を、R2はそれぞれ独立にアリール基を示し、R1の少なくとも2個はアルケニル基であり、0.01<m/(m+n)<0.10である。)
(C)1分子中に少なくとも2個のケイ素原子に結合した水素原子を有するポリオルガノハイドロジェンシロキサンを、前記(A)成分および(B)成分がそれぞれ有するアルケニル基の合計量1モルに対して、ケイ素原子に結合した水素原子が1~3モルとなる量、
(D)シリカ粉末の5~20質量部、および
(E)ヒドロシリル化反応触媒の触媒量、
をそれぞれ含有し、屈折率(25℃、D線)が1.41~1.44であることを特徴とする。
の硬化物により光半導体素子が封止されてなることを特徴とする。
本発明の光半導体素子封止用シリコーン組成物は、(A)上記一般式(1)で表される1分子中に少なくとも2個のアルケニル基を有する直鎖状のポリオルガノシロキサンと、(B)1分子中に少なくとも1個のアルケニル基を有し、x個のR1 3SiO1/2単位、y個のR1 2SiO単位、およびz個のSiO2単位を含有し(ただし、各シロキサン単位中、R1はそれぞれ独立にアルケニル基またはハロゲン置換されていてもよいアルキル基を示す。)、x、y、zの合計を1と換算したときのx、y、zがそれぞれ、0.3≦x≦0.5、0<y≦0.1、0.4≦z<0.7である樹脂状構造のポリオルガノシロキサンを、(A)成分と(B)成分の合計で100質量部、かつ(A)成分と(B)成分の合計量100質量部に対して(B)成分が10~40質量部となる量、(C)1分子中に少なくとも2個のケイ素原子に結合した水素原子を有するポリオルガノハイドロジェンシロキサンを、前記(A)成分および(B)成分がそれぞれ有するアルケニル基の合計量1モルに対して、ケイ素原子に結合した水素原子が1~3モルとなる量、(D)シリカ粉末の5~20質量部、および(E)ヒドロシリル化反応触媒の触媒量、をそれぞれ含有し、屈折率(25℃、D線)が1.41~1.44であることを特徴とする。
以下、各成分について説明する。
(A)成分は、次に説明する(B)成分とともに、本発明の組成物のベースポリマーとなるアルケニル基含有のポリオルガノシロキサンである。
(A)成分は下記一般式(1)で表される1分子中に少なくとも2個のアルケニル基を有する直鎖状のポリオルガノシロキサンである。以下、一般式(1)で表されるポリオルガノシロキサンをポリオルガノシロキサン(1)ということもある。
(R1 3SiO1/2)(R2 2SiO)m(R1 2SiO)n(R1 3SiO1/2) …(1)
(ただし、式(1)中、R1はそれぞれ独立にアルケニル基またはハロゲン置換されていてもよいアルキル基を、R2はそれぞれ独立にアリール基を示し、R1の少なくとも2個はアルケニル基であり、0.01<m/(m+n)<0.10である。)
(B)成分は、1分子中に少なくとも1個のアルケニル基を有し、x個のR1 3SiO1/2単位、y個のR1 2SiO単位、およびz個のSiO2単位を含有し(ただし、各シロキサン単位中、R1はそれぞれ独立にアルケニル基またはハロゲン置換されていてもよいアルキル基を示す。)、x、y、zの合計を1と換算したときのx、y、zがそれぞれ、0.3≦x≦0.5、0<y≦0.1、0.4≦z<0.7である樹脂状構造、いいかえれば三次元網状構造のポリオルガノシロキサンである。以下、上記構成のポリオルガノシロキサンをポリオルガノシロキサン(2)という。
(B)成分としては、ポリオルガノシロキサン(2)の1種を単独で用いてもよく、2種以上を併用してもよい。
(C)成分である1分子中に少なくとも2個のケイ素原子に結合した水素原子を有するポリオルガノハイドロジェンシロキサンは、上記(A)成分および(B)成分と反応する架橋成分として作用する。(C)成分の分子構造に特に制限はなく、例えば直鎖状、環状、分岐状、三次元網状構造(樹脂状構造)などの各種のポリオルガノハイドロジェンシロキサンを使用することができる。
R3 aHbSiO(4-a-b)/2 …(3)
(式(3)中、R3は、脂肪族不飽和基を有しない、炭素原子数が1~14、より好ましくは1~10の非置換または置換の1価の炭化水素基である。aおよびbは、0.7≦a≦2.1、0.001≦b≦1.0であり、かつ0.8≦a+b≦3.0より好ましくは1.0≦a+b≦2.5を満足する正数である。)
(D)成分のシリカ粉末は、一般的にシリコーン硬化物に配合されている公知のものでよい。(D)成分は架橋前の組成物に適度の流動性、チクソ性を与え、かつ架橋して得られるポリオルガノシロキサンの架橋体に、その用途に応じて要求される高い機械的強度を付与する作用を有する。
(E)成分であるヒドロシリル化反応触媒は、(A)成分および(B)成分にそれぞれ含まれるアルケニル基と(C)成分中のSi-H基との付加反応(ヒドロシリル化反応)を促進する触媒である。(E)成分としては、白金系触媒、パラジウム系触媒、ロジウム系触媒等が挙げられるが、経済性の点から白金系触媒が好ましい。白金系触媒としては、例えば、塩化白金酸、アルコール変性塩化白金酸、塩化白金酸とオレフィン類、ビニルシロキサンまたはアセチレン化合物との配位化合物などを使用することができる。これらは1種を単独でも2種以上を組み合わせても使用することができる。
本発明の光半導体素子封止用シリコーン組成物は、さらに(F)成分として、エポキシ基、ヒドロシリル基(Si-H基)、架橋性のビニル基およびアルコキシシリル基から選ばれる少なくとも2種を含む接着性付与剤を含有することが好ましい。
Y-Q-SiR11 pX(3-p) …(4)
(ただし、式(4)中、R11は炭素原子数1~5のアルキル基を、Xは炭素原子数1~5のアルコキシ基を、Yはエポキシ基または置換されていてもよいビニル基を、Qは、単結合、-O-、-C(=O)-O-結合を有してもよい炭素数1~10の2価の炭化水素基を、それぞれ示し、pは0または1であり、複数のXは同一でも異なってもよい。)
本発明の光半導体素子封止用シリコーン組成物は、(G)成分として、液状のチクソ性付与剤をさらに含有することが好ましい。(G)成分は、(D)成分のシリカ粉末が有する水酸基と水素結合や擬似架橋を形成することによりチクソ性を発現させるもので、液状の化合物である。なお、本明細書において液状とは、少なくとも室温(25℃)で液状、すなわち流動性を有する状態、例えば、粘度が1000mPa・s以下の状態であることをいう。
本発明の光半導体素子封止用シリコーン組成物は、上記(A)~(E)の各成分を必須成分として上記の含有量で含有し、これらに任意成分として必要に応じて、上記(F)成分、(G)成分を上記の含有量で含有する。さらに、任意成分として、ヒドロシリル化反応を抑制する反応抑制剤を添加してもよい。
なお、以下の実施例において各成分の粘度測定には、回転粘度計として、回転数が20rpmおよび2rpmでの測定についてはビスメトロンVDH型(芝浦システム社製)を用い、回転数が60rpmでの測定についてはビスメトロンVDA型(芝浦システム社製)を使用した。
また、(A)成分、(Ac)成分においては、Ph2SiO単位数をm、Me2SiO単位数をnとして、m/(m+n)を算出した。結果を表1に併せて示す。リニアポリマー(A1)、(A2)は、本発明の組成物の(A)成分の範囲である0.01<m/(m+n)<0.10の範囲内であり、リニアポリマー(Ac1)~(Ac4)は範囲外である。
また、(B)成分の樹脂状ポリマー(B1)における、各シロキサン単位の割合を上記x、y、zで示すと、x=0.40、y=0.07、z=0.53である。
(D)成分:シリカ粉末
シリカ粉末(D1):表面をヘキサメチルジシラザンで処理された、比表面積約140m2/gの煙霧質シリカ。シリカ表面のカーボン量4質量%。
シリカ粉末(D2):表面をヘキサメチルジシラザンで処理された、比表面積約200m2/gの煙霧質シリカ。シリカ表面のカーボン量3.5質量%。
(E)成分:ヒドロシリル化反応触媒
ビニルダイマー配位白金触媒(単に「白金触媒」という)
(F)成分:接着性付与剤
接着性付与剤1:上記式(S1)に示す(HMeSiO)3(Me2SiO)の1モルに対して3-メタクリロキシプロピルトリメトキシシランの1モルを反応させて得られた反応生成物。
接着性付与剤2:3-グリシドキシプロピルトリメトキシシラン
(G)成分:液状のチクソ性付与剤
ポリオキシプロピレングリコール(Mw:2000、粘度(25℃、No3ローター、60rpm)300[mPa・s])
表2に示す組成で各成分を混合し、実施例1~6および比較例1~3の光半導体素子封止用シリコーン組成物を製造した。なお、固体成分である(B)成分を組成物中に均一に含有させるために、以下の方法を用いた。まず、(B)成分を適度な濃度のキシレン溶液として(A)成分と混合した後、加熱および/または減圧によりキシレンを除去することで、(A)成分と(B)成分の混合物を作製した。この混合物を他の成分と混合することで各例の組成物を作製した。
なお、表2中(E)成分の含有量は、(A)成分、(B)成分および(C)成分の合計質量に対する白金元素換算の含有量(ppm)である。
上記で得られた光半導体素子封止用シリコーン組成物およびそれを硬化して得られたシリコーン硬化物を以下の評価項目について評価した。結果を表2に併せて示す。
(屈折率)
各組成物について、25℃においてD線の屈折率を、アッベ屈折率計を用いて測定した。
(粘度、チクソ性評価(粘度比;η2/η20))
各組成物について、回転粘度計を用いて、No6ローターによる2rpmの粘度η2と20rpmの粘度η20を測定し、その粘度比η2/η20を算出することで、チクソ性を評価した。
(硬化物による試験片の作製)
上記で得られた各組成物を150℃、60分間の条件で硬化させて、透過率測定用の厚さ2mmのシート状試験片を得た。また、同様に硬化させたシート状硬化物からJIS K6249に準拠した機械特性測定用試験片としてダンベル状2号形を作製した。
透過率測定用の厚さ2mmのシート状試験片を用いて、波長400nmの光に対する光透過率[%]を25℃において分光光度計により測定した。
(機械的強度)
機械特性測定用試験片を用いて、JIS K6249にしたがって、25℃における硬度(TYPE A)、引張強さ[MPa]、伸び[%]を測定した。
Claims (8)
- (A)下記一般式(1)で表されるポリオルガノシロキサンと、(B)1分子中に少なくとも1個のアルケニル基を有し、x個のR1 3SiO1/2単位、y個のR1 2SiO単位、およびz個のSiO2単位を含有し(ただし、各シロキサン単位中、R1はそれぞれ独立にアルケニル基またはハロゲン置換されていてもよいアルキル基を示す。)、x、y、zの合計を1と換算したときのx、y、zがそれぞれ、0.3≦x≦0.5、0<y≦0.1、0.4≦z<0.7である樹脂状構造のポリオルガノシロキサンを、(A)成分と(B)成分の合計で100質量部、かつ(A)成分と(B)成分の合計量100質量部に対して(B)成分が10~40質量部となる量、
(R1 3SiO1/2)(R2 2SiO)m(R1 2SiO)n(R1 3SiO1/2) …(1)
(ただし、式(1)中、R1はそれぞれ独立にアルケニル基またはハロゲン置換されていてもよいアルキル基を、R2はそれぞれ独立にアリール基を示し、R1の少なくとも2個はアルケニル基であり、0.01<m/(m+n)<0.10である。)
(C)1分子中に少なくとも2個のケイ素原子に結合した水素原子を有するポリオルガノハイドロジェンシロキサンを、前記(A)成分および(B)成分がそれぞれ有するアルケニル基の合計量1モルに対して、ケイ素原子に結合した水素原子が1~3モルとなる量、
(D)シリカ粉末の5~20質量部、および
(E)ヒドロシリル化反応触媒の触媒量、
をそれぞれ含有し、屈折率(25℃、D線)が1.41~1.44であることを特徴とする、光半導体素子封止用シリコーン組成物。 - さらに(F)エポキシ基、ヒドロシリル基(Si-H基)、架橋性のビニル基およびアルコキシシリル基から選ばれる少なくとも2種を含む接着性付与剤を0.1~10質量部含む請求項1記載の光半導体素子封止用シリコーン組成物。
- さらに(G)液状のチクソ性付与剤を0.005~5質量部含む請求項1または2記載の光半導体素子封止用シリコーン組成物。
- 厚さ2mmのシートとしたときに25℃における波長400nmの光の透過率が90%以上であるシリコーン硬化物を与えることを特徴とする請求項1~3のいずれか1項に記載の光半導体素子封止用シリコーン組成物。
- 回転粘度計による25℃における2rpmの粘度η2と20rpmの粘度η20の比η2/η20が、1.8~6.0である請求項1~4のいずれか1項に記載の光半導体素子封止用シリコーン組成物。
- JIS K6249に基づいて25℃で測定される、TYPE A型硬度計による硬度が30~80であり、引張強さが4MPa以上であるシリコーン硬化物を与えることを特徴とする請求項1~5のいずれか1項に記載の光半導体素子封止用シリコーン組成物。
- 前記(C)成分のポリオルガノハイドロジェンシロキサンが、ケイ素原子に結合する有機基としてメチル基のみを有するポリメチルハイドロジェンシロキサンである請求項1~6のいずれか1項に記載の光半導体素子封止用シリコーン組成物。
- 請求項1~7のいずれか1項に記載の光半導体素子封止用シリコーン組成物の硬化物により光半導体素子が封止されてなる光半導体装置。
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