KR20190058513A - 워크 유지 지그 및 워크 유지 지그에 대한 워크 장착 방법 - Google Patents

워크 유지 지그 및 워크 유지 지그에 대한 워크 장착 방법 Download PDF

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Publication number
KR20190058513A
KR20190058513A KR1020197010020A KR20197010020A KR20190058513A KR 20190058513 A KR20190058513 A KR 20190058513A KR 1020197010020 A KR1020197010020 A KR 1020197010020A KR 20197010020 A KR20197010020 A KR 20197010020A KR 20190058513 A KR20190058513 A KR 20190058513A
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KR
South Korea
Prior art keywords
members
pair
clamp
work
workpieces
Prior art date
Application number
KR1020197010020A
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English (en)
Korean (ko)
Inventor
카츠미 이시이
시게유키 와타나베
Original Assignee
아루멕쿠스 피이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아루멕쿠스 피이 가부시키가이샤 filed Critical 아루멕쿠스 피이 가부시키가이샤
Publication of KR20190058513A publication Critical patent/KR20190058513A/ko

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1628Specific elements or parts of the apparatus
    • C23C18/163Supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • C25D17/08Supporting racks, i.e. not for suspending
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Jigs For Machine Tools (AREA)
  • Coating Apparatus (AREA)
  • Chemically Coating (AREA)
KR1020197010020A 2016-09-29 2017-09-27 워크 유지 지그 및 워크 유지 지그에 대한 워크 장착 방법 KR20190058513A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016192109 2016-09-29
JPJP-P-2016-192109 2016-09-29
PCT/JP2017/034924 WO2018062260A1 (ja) 2016-09-29 2017-09-27 ワーク保持治具及びワーク保持治具へのワーク取付方法

Publications (1)

Publication Number Publication Date
KR20190058513A true KR20190058513A (ko) 2019-05-29

Family

ID=61759793

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197010020A KR20190058513A (ko) 2016-09-29 2017-09-27 워크 유지 지그 및 워크 유지 지그에 대한 워크 장착 방법

Country Status (6)

Country Link
JP (1) JP6793967B2 (ja)
KR (1) KR20190058513A (ja)
CN (1) CN109963964B (ja)
MY (1) MY195297A (ja)
PH (1) PH12019500670A1 (ja)
WO (1) WO2018062260A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210092219A (ko) * 2018-11-20 2021-07-23 가부시키가이샤 아루멕쿠스 테크놀로지스 지그 반송 부재 그리고 표면처리 장치 및 방법
CN111945213B (zh) * 2020-07-06 2022-10-28 西安飞机工业(集团)有限责任公司 一种对滑轨零件多电镀面电镀的象形阳极夹具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093651A (ja) 2004-08-26 2006-04-06 Ngk Spark Plug Co Ltd 配線基板の製造方法および配線基板製造用無電解メッキ装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060115734A (ko) * 2003-10-28 2006-11-09 노드슨 코포레이션 플라즈마 프로세싱 시스템 및 플라즈마 처리 방법
JP6234731B2 (ja) * 2013-08-08 2017-11-22 上村工業株式会社 クランパーを備える保持具

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093651A (ja) 2004-08-26 2006-04-06 Ngk Spark Plug Co Ltd 配線基板の製造方法および配線基板製造用無電解メッキ装置

Also Published As

Publication number Publication date
JP6793967B2 (ja) 2020-12-02
CN109963964A (zh) 2019-07-02
MY195297A (en) 2023-01-12
WO2018062260A1 (ja) 2018-04-05
CN109963964B (zh) 2021-08-31
JPWO2018062260A1 (ja) 2019-07-11
PH12019500670A1 (en) 2019-12-02

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