PH12019500670A1 - Workpiece holding jig and method for attaching workpiece to workpiece holding jig - Google Patents

Workpiece holding jig and method for attaching workpiece to workpiece holding jig

Info

Publication number
PH12019500670A1
PH12019500670A1 PH12019500670A PH12019500670A PH12019500670A1 PH 12019500670 A1 PH12019500670 A1 PH 12019500670A1 PH 12019500670 A PH12019500670 A PH 12019500670A PH 12019500670 A PH12019500670 A PH 12019500670A PH 12019500670 A1 PH12019500670 A1 PH 12019500670A1
Authority
PH
Philippines
Prior art keywords
members
pair
workpiece
holding jig
supported
Prior art date
Application number
PH12019500670A
Other languages
English (en)
Inventor
Katsumi Ishii
Shigeyuki Watanabe
Original Assignee
Almex Pe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Pe Inc filed Critical Almex Pe Inc
Publication of PH12019500670A1 publication Critical patent/PH12019500670A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Jigs For Machine Tools (AREA)
  • Coating Apparatus (AREA)
  • Chemically Coating (AREA)
PH12019500670A 2016-09-29 2019-03-27 Workpiece holding jig and method for attaching workpiece to workpiece holding jig PH12019500670A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016192109 2016-09-29
PCT/JP2017/034924 WO2018062260A1 (ja) 2016-09-29 2017-09-27 ワーク保持治具及びワーク保持治具へのワーク取付方法

Publications (1)

Publication Number Publication Date
PH12019500670A1 true PH12019500670A1 (en) 2019-12-02

Family

ID=61759793

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12019500670A PH12019500670A1 (en) 2016-09-29 2019-03-27 Workpiece holding jig and method for attaching workpiece to workpiece holding jig

Country Status (6)

Country Link
JP (1) JP6793967B2 (ja)
KR (1) KR20190058513A (ja)
CN (1) CN109963964B (ja)
MY (1) MY195297A (ja)
PH (1) PH12019500670A1 (ja)
WO (1) WO2018062260A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113056576A (zh) * 2018-11-20 2021-06-29 Almex科技株式会社 夹具输送构件以及表面处理装置和方法
CN111945213B (zh) * 2020-07-06 2022-10-28 西安飞机工业（集团）有限责任公司 一种对滑轨零件多电镀面电镀的象形阳极夹具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1875454A (zh) * 2003-10-28 2006-12-06 诺信公司 等离子处理系统和等离子处理工艺
JP2006093651A (ja) 2004-08-26 2006-04-06 Ngk Spark Plug Co Ltd 配線基板の製造方法および配線基板製造用無電解メッキ装置
JP6234731B2 (ja) * 2013-08-08 2017-11-22 上村工業株式会社 クランパーを備える保持具

Also Published As

Publication number Publication date
JP6793967B2 (ja) 2020-12-02
KR20190058513A (ko) 2019-05-29
WO2018062260A1 (ja) 2018-04-05
CN109963964A (zh) 2019-07-02
CN109963964B (zh) 2021-08-31
MY195297A (en) 2023-01-12
JPWO2018062260A1 (ja) 2019-07-11

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