KR20190039865A - 박리 필름 부착 점착 시트 - Google Patents

박리 필름 부착 점착 시트 Download PDF

Info

Publication number
KR20190039865A
KR20190039865A KR1020180117569A KR20180117569A KR20190039865A KR 20190039865 A KR20190039865 A KR 20190039865A KR 1020180117569 A KR1020180117569 A KR 1020180117569A KR 20180117569 A KR20180117569 A KR 20180117569A KR 20190039865 A KR20190039865 A KR 20190039865A
Authority
KR
South Korea
Prior art keywords
pressure
sensitive adhesive
film
adhesive sheet
release film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020180117569A
Other languages
English (en)
Korean (ko)
Inventor
켄타 조쥬카
나오아키 히구치
나오히로 카토
야스시 부조지마
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20190039865A publication Critical patent/KR20190039865A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C09J2201/622—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/005—Presence of polyolefin in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/045—Presence of homo or copolymers of ethene in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/105—Presence of homo or copolymers of propene in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020180117569A 2017-10-06 2018-10-02 박리 필름 부착 점착 시트 Withdrawn KR20190039865A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-196425 2017-10-06
JP2017196425A JP7240806B2 (ja) 2017-10-06 2017-10-06 剥離フィルム付き粘着シート

Publications (1)

Publication Number Publication Date
KR20190039865A true KR20190039865A (ko) 2019-04-16

Family

ID=63762412

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180117569A Withdrawn KR20190039865A (ko) 2017-10-06 2018-10-02 박리 필름 부착 점착 시트

Country Status (5)

Country Link
US (1) US20190106606A1 (https=)
EP (1) EP3521395A1 (https=)
JP (1) JP7240806B2 (https=)
KR (1) KR20190039865A (https=)
CN (1) CN109627995B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115367303B (zh) * 2019-08-16 2024-06-28 日东电工株式会社 盖构件和具有该盖构件的构件供给组件
JP7624817B2 (ja) * 2019-09-30 2025-01-31 日東電工株式会社 積層シート
JP7411374B2 (ja) * 2019-10-09 2024-01-11 リンテック株式会社 粘着フィルムおよび粘着フィルムの切断方法
US20240059937A1 (en) * 2019-10-11 2024-02-22 3M Innovative Properties Company Adhesive delivery system
CN114867601A (zh) * 2019-12-25 2022-08-05 日东电工株式会社 层叠体
JP2021152114A (ja) * 2020-03-24 2021-09-30 日東電工株式会社 粘着シート
JP2021152113A (ja) * 2020-03-24 2021-09-30 日東電工株式会社 粘着シート
JP7798467B2 (ja) * 2020-03-24 2026-01-14 日東電工株式会社 粘着シート
JP7614728B2 (ja) * 2020-03-31 2025-01-16 日東電工株式会社 剥離フィルム付き粘着シート
JP7160965B2 (ja) * 2021-01-22 2022-10-25 日東電工株式会社 両面粘着シート
CN116897196A (zh) * 2021-03-05 2023-10-17 日东电工株式会社 带衬垫的双面粘合片
JP2022172615A (ja) * 2021-05-06 2022-11-17 日東電工株式会社 剥離フィルム付き粘着シートおよびその利用
JP7784242B2 (ja) * 2021-05-28 2025-12-11 日東電工株式会社 積層シートおよび剥離フィルム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013100485A (ja) 2011-10-14 2013-05-23 Nitto Denko Corp 両面粘着テープ
JP2015147873A (ja) 2014-02-06 2015-08-20 日東電工株式会社 両面粘着シート及びその製造方法
JP2017002292A (ja) 2015-06-15 2017-01-05 日東電工株式会社 粘着シート
JP2017132911A (ja) 2016-01-28 2017-08-03 日東電工株式会社 粘着シート

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5167995A (en) * 1990-06-08 1992-12-01 Minnesota Mining And Manufacturing Company Low temperature shock resistant release liner
US5178924A (en) * 1991-06-17 1993-01-12 Minnesota Mining And Manufacturing Company Release liner
US5817386A (en) * 1996-03-28 1998-10-06 Norton Performance Plastics Corporation Silicone-free release films
JP2004010647A (ja) 2002-06-04 2004-01-15 Hitachi Chem Co Ltd セパレータ付き感圧型接着シート及び光学部材組立体並びにその組立方法
JP4749058B2 (ja) 2005-07-04 2011-08-17 日東電工株式会社 反射性及び／又は遮光性を有する両面粘着テープ又はシート
JP2007051271A (ja) 2005-07-21 2007-03-01 Nitto Denko Corp 粘着剤組成物、両面粘着テープ、接着方法及び携帯用電子機器
JP5676081B2 (ja) * 2005-12-23 2015-02-25 スリーエム イノベイティブ プロパティズ カンパニー 接着テープアセンブリ及び両面感圧性接着テープの適用方法
JP5135751B2 (ja) 2006-09-29 2013-02-06 大日本印刷株式会社 両面テープ
JP5305595B2 (ja) 2007-01-10 2013-10-02 日東電工株式会社 熱接着シート
CN101874088A (zh) * 2007-11-28 2010-10-27 电气化学工业株式会社 粘合片、粘合片的制造方法及其贴合方法
JP4800363B2 (ja) 2008-09-26 2011-10-26 日東電工株式会社 光学部材貼り合わせ用粘着シート
JP5243990B2 (ja) * 2009-02-18 2013-07-24 日東電工株式会社 両面粘着シート
US8846192B2 (en) 2012-01-19 2014-09-30 Ralph Giammarco Enhanced film carrier
KR102169342B1 (ko) 2012-05-31 2020-10-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접착 용품
CN104449438A (zh) 2013-09-17 2015-03-25 日东电工（上海松江）有限公司 双面胶带
US10792902B2 (en) * 2014-04-22 2020-10-06 Nitto Denko Corporation Pressure-sensitive adhesive sheet
EP3012302B1 (en) * 2014-10-21 2020-09-30 3M Innovative Properties Company Release liner for pressure sensitive adhesives
WO2017065275A1 (ja) 2015-10-14 2017-04-20 日東電工株式会社 セパレーター付き粘着テープおよびセパレーター
CN105778803B (zh) 2016-03-09 2019-01-11 东莞高伟光学电子有限公司 一种手机摄像头背胶的生产工艺

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013100485A (ja) 2011-10-14 2013-05-23 Nitto Denko Corp 両面粘着テープ
JP2015147873A (ja) 2014-02-06 2015-08-20 日東電工株式会社 両面粘着シート及びその製造方法
JP2017002292A (ja) 2015-06-15 2017-01-05 日東電工株式会社 粘着シート
JP2017132911A (ja) 2016-01-28 2017-08-03 日東電工株式会社 粘着シート

Also Published As

Publication number Publication date
JP2019070072A (ja) 2019-05-09
US20190106606A1 (en) 2019-04-11
CN109627995A (zh) 2019-04-16
CN109627995B (zh) 2022-09-23
EP3521395A1 (en) 2019-08-07
JP7240806B2 (ja) 2023-03-16

Similar Documents

Publication Publication Date Title
KR20190039865A (ko) 박리 필름 부착 점착 시트
CN109628026B (zh) 丙烯酸类粘合剂组合物及粘合片
JP7175622B2 (ja) アクリル系粘着剤組成物および粘着シート
JP5518436B2 (ja) 光学用粘着シート
JP5968587B2 (ja) 光学用粘着シート、光学フィルムおよび表示装置
JP7614728B2 (ja) 剥離フィルム付き粘着シート
CN107033793B (zh) 粘合片和带剥离薄膜的粘合片
CN111748291A (zh) 粘合片
JP2013006892A (ja) 光学用両面粘着シート
WO2011111575A1 (ja) 光学用粘着シート
CN111978883B (zh) 粘合片
CN109852271B (zh) 粘合片
JP7063690B2 (ja) 粘着シート
KR20130116816A (ko) 점착 시트 및 점착제 조성물
WO2022038926A1 (ja) 接合体の分離方法
CN109852267B (zh) 粘合片
CN109627994B (zh) 粘合片
CN114051521B (zh) 粘合片及其利用
JP7063689B2 (ja) アクリル系粘着剤組成物および粘着シート
WO2022054788A1 (ja) 粘着シート
JP2021008606A (ja) 粘着シートおよびその利用
CN117363240A (zh) 树脂薄膜
WO2022030198A1 (ja) 接合体の分離方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000