KR20180110102A - 용해성 구리 양극, 전해 구리 도금 장치, 전해 구리 도금 방법 및 산성 전해 구리 도금액의 보존 방법 - Google Patents

용해성 구리 양극, 전해 구리 도금 장치, 전해 구리 도금 방법 및 산성 전해 구리 도금액의 보존 방법 Download PDF

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Publication number
KR20180110102A
KR20180110102A KR1020187026189A KR20187026189A KR20180110102A KR 20180110102 A KR20180110102 A KR 20180110102A KR 1020187026189 A KR1020187026189 A KR 1020187026189A KR 20187026189 A KR20187026189 A KR 20187026189A KR 20180110102 A KR20180110102 A KR 20180110102A
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KR
South Korea
Prior art keywords
copper plating
copper
electrolytic copper
anode
electrolytic
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Application number
KR1020187026189A
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English (en)
Korean (ko)
Inventor
마사루 세이타
토시유키 시게마츠
Original Assignee
멜텍스 가부시키가이샤
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Publication date
Application filed by 멜텍스 가부시키가이샤 filed Critical 멜텍스 가부시키가이샤
Publication of KR20180110102A publication Critical patent/KR20180110102A/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020187026189A 2016-05-24 2017-05-24 용해성 구리 양극, 전해 구리 도금 장치, 전해 구리 도금 방법 및 산성 전해 구리 도금액의 보존 방법 KR20180110102A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016103651A JP2017210644A (ja) 2016-05-24 2016-05-24 溶解性銅陽極、電解銅めっき装置、電解銅めっき方法、及び酸性電解銅めっき液の保存方法
JPJP-P-2016-103651 2016-05-24
PCT/JP2017/019355 WO2017204246A1 (ja) 2016-05-24 2017-05-24 溶解性銅陽極、電解銅めっき装置、電解銅めっき方法、及び酸性電解銅めっき液の保存方法

Publications (1)

Publication Number Publication Date
KR20180110102A true KR20180110102A (ko) 2018-10-08

Family

ID=60412361

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187026189A KR20180110102A (ko) 2016-05-24 2017-05-24 용해성 구리 양극, 전해 구리 도금 장치, 전해 구리 도금 방법 및 산성 전해 구리 도금액의 보존 방법

Country Status (5)

Country Link
JP (1) JP2017210644A (ja)
KR (1) KR20180110102A (ja)
CN (1) CN109154100A (ja)
TW (1) TW201816199A (ja)
WO (1) WO2017204246A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210033321A (ko) * 2019-09-18 2021-03-26 건국대학교 산학협력단 구리펠렛의 전해정련 보조장치 및 이를 이용한 전해정련장치
KR20220161735A (ko) * 2021-05-31 2022-12-07 주식회사 다이브 다층 금속박막 및 이의 제조방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6653799B2 (ja) * 2017-07-31 2020-02-26 メルテックス株式会社 電解銅めっき用陽極、及びそれを用いた電解銅めっき装置
JP7114009B1 (ja) * 2022-02-16 2022-08-05 株式会社荏原製作所 めっき装置、及びめっき方法
CN114892247B (zh) * 2022-05-26 2024-02-09 山东聚力焊接材料有限公司 一种焊丝镀铜装置、电极板的制备方法和焊丝镀铜方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673393B2 (ja) * 1988-09-09 1994-09-14 ペルメレック電極株式会社 プリント基板の銅メッキ方法
JP2002206199A (ja) * 2000-12-28 2002-07-26 Atotech Japan Kk 銅めっき装置における銅溶解槽
DE10325101A1 (de) * 2003-06-03 2004-12-30 Atotech Deutschland Gmbh Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs)
JP2006316328A (ja) * 2005-05-16 2006-11-24 Daiso Co Ltd ２層フレキシブル銅張積層板の製造方法
JP5110269B2 (ja) * 2007-08-09 2012-12-26 上村工業株式会社 電気銅めっき方法
JP5402517B2 (ja) * 2009-01-08 2014-01-29 三菱マテリアル株式会社 めっき用銅材及びめっき用銅材の製造方法、並びに、銅めっき材の製造方法
JP6423320B2 (ja) * 2015-06-25 2018-11-14 田中貴金属工業株式会社 めっき装置及びめっき方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210033321A (ko) * 2019-09-18 2021-03-26 건국대학교 산학협력단 구리펠렛의 전해정련 보조장치 및 이를 이용한 전해정련장치
KR20220161735A (ko) * 2021-05-31 2022-12-07 주식회사 다이브 다층 금속박막 및 이의 제조방법
WO2022255687A1 (ko) * 2021-05-31 2022-12-08 주식회사 다이브 다층 금속박막 및 이의 제조방법

Also Published As

Publication number Publication date
WO2017204246A1 (ja) 2017-11-30
TW201816199A (zh) 2018-05-01
CN109154100A (zh) 2019-01-04
JP2017210644A (ja) 2017-11-30

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