KR20180037111A - 원판형 회전날, 절삭 장치 및 원판형 회전날의 제조 방법 - Google Patents

원판형 회전날, 절삭 장치 및 원판형 회전날의 제조 방법 Download PDF

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Publication number
KR20180037111A
KR20180037111A KR1020170123608A KR20170123608A KR20180037111A KR 20180037111 A KR20180037111 A KR 20180037111A KR 1020170123608 A KR1020170123608 A KR 1020170123608A KR 20170123608 A KR20170123608 A KR 20170123608A KR 20180037111 A KR20180037111 A KR 20180037111A
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KR
South Korea
Prior art keywords
disk
shaped
rotary blade
resin
cutting
Prior art date
Application number
KR1020170123608A
Other languages
English (en)
Korean (ko)
Inventor
신지 다카세
구니히코 후지와라
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20180037111A publication Critical patent/KR20180037111A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B26D2001/002—Materials or surface treatments therefor, e.g. composite materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Forests & Forestry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
KR1020170123608A 2016-10-03 2017-09-25 원판형 회전날, 절삭 장치 및 원판형 회전날의 제조 방법 KR20180037111A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-195630 2016-10-03
JP2016195630A JP2018058130A (ja) 2016-10-03 2016-10-03 円板状の回転刃、切削装置、及び、円板状の回転刃の製造方法

Publications (1)

Publication Number Publication Date
KR20180037111A true KR20180037111A (ko) 2018-04-11

Family

ID=61803522

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170123608A KR20180037111A (ko) 2016-10-03 2017-09-25 원판형 회전날, 절삭 장치 및 원판형 회전날의 제조 방법

Country Status (4)

Country Link
JP (1) JP2018058130A (zh)
KR (1) KR20180037111A (zh)
CN (1) CN107891378A (zh)
TW (1) TWI657895B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018164964A (ja) * 2017-03-28 2018-10-25 Ｔｏｗａ株式会社 レジノイド砥石、レジノイド砥石の製造方法、及び、加工装置
EP3666490B1 (en) 2018-12-14 2021-07-21 The Gillette Company LLC Method of manufacturing cutting-edge structures
JP7350436B2 (ja) * 2019-08-21 2023-09-26 株式会社ディスコ 切削ブレード及び加工方法
CN113858305B (zh) * 2021-09-26 2022-12-13 浙江工业大学之江学院 一种黄酒坛封口材料自动输送机

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010039B2 (zh) * 1971-11-08 1975-04-17
JPS5112487A (ja) * 1974-07-23 1976-01-31 Takahide Kotani Erasuchitsukutoishino seizoho
JP2002137160A (ja) * 2000-08-24 2002-05-14 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法
JP4415474B2 (ja) * 2000-10-05 2010-02-17 三菱マテリアル株式会社 レジンボンド砥石
US6949129B2 (en) * 2002-01-30 2005-09-27 Saint-Gobain Abrasives, Inc. Method for making resin bonded abrasive tools
CN100506491C (zh) * 2004-03-31 2009-07-01 黄焕仪 一种剑麻纤维抛光轮的制造方法
CN101096079A (zh) * 2006-06-29 2008-01-02 四川省三台县固锐实业有限责任公司 树脂砂轮及其生产方法
JP5318526B2 (ja) * 2008-10-29 2013-10-16 大和化成工業株式会社 繊維状多孔研磨砥石
JP2010274369A (ja) * 2009-05-28 2010-12-09 Teijin Techno Products Ltd 繊維強化砥石
JP5841437B2 (ja) * 2012-01-27 2016-01-13 株式会社東京精密 切断用ブレード及びその製造方法
TWM455592U (zh) * 2013-01-11 2013-06-21 M & S Prec Machinery Co Ltd 具有車削功能之多軸研磨機
FI126837B (en) * 2013-09-05 2017-06-15 Upm Kymmene Corp Composite body and method for making it
CN103551984B (zh) * 2013-11-08 2016-01-13 谢泽 含天然纤维、磨料、热膨胀树脂空心微球抛磨一体轮的制备方法
CN103551981B (zh) * 2013-11-08 2016-04-13 谢泽 一种含纤维绳、磨料和发泡剂的抛磨一体轮
JP6333650B2 (ja) * 2014-07-18 2018-05-30 Ｔｏｗａ株式会社 切断装置及び切断方法

Also Published As

Publication number Publication date
JP2018058130A (ja) 2018-04-12
TW201813767A (zh) 2018-04-16
TWI657895B (zh) 2019-05-01
CN107891378A (zh) 2018-04-10

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E601 Decision to refuse application