KR20170104648A - 코어리스 빌드업 지지 기판 및 당해 코어리스 빌드업 지지 기판을 사용하여 제조된 프린트 배선판 - Google Patents
코어리스 빌드업 지지 기판 및 당해 코어리스 빌드업 지지 기판을 사용하여 제조된 프린트 배선판 Download PDFInfo
- Publication number
- KR20170104648A KR20170104648A KR1020177024807A KR20177024807A KR20170104648A KR 20170104648 A KR20170104648 A KR 20170104648A KR 1020177024807 A KR1020177024807 A KR 1020177024807A KR 20177024807 A KR20177024807 A KR 20177024807A KR 20170104648 A KR20170104648 A KR 20170104648A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- copper foil
- carrier
- thin copper
- wiring board
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0376—Etching temporary metallic carrier substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013241584 | 2013-11-22 | ||
JPJP-P-2013-241584 | 2013-11-22 | ||
PCT/JP2014/080917 WO2015076372A1 (ja) | 2013-11-22 | 2014-11-21 | 埋設回路を備えるプリント配線板の製造方法及びその製造方法で得られるプリント配線板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020167013101A Division KR20160089364A (ko) | 2013-11-22 | 2014-11-21 | 매설 회로를 구비하는 프린트 배선판의 제조 방법 및 그 제조 방법으로 얻어지는 프린트 배선판 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20170104648A true KR20170104648A (ko) | 2017-09-15 |
Family
ID=53179631
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020177024807A KR20170104648A (ko) | 2013-11-22 | 2014-11-21 | 코어리스 빌드업 지지 기판 및 당해 코어리스 빌드업 지지 기판을 사용하여 제조된 프린트 배선판 |
KR1020167013101A KR20160089364A (ko) | 2013-11-22 | 2014-11-21 | 매설 회로를 구비하는 프린트 배선판의 제조 방법 및 그 제조 방법으로 얻어지는 프린트 배선판 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020167013101A KR20160089364A (ko) | 2013-11-22 | 2014-11-21 | 매설 회로를 구비하는 프린트 배선판의 제조 방법 및 그 제조 방법으로 얻어지는 프린트 배선판 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6753669B2 (ja) |
KR (2) | KR20170104648A (ja) |
CN (2) | CN105746003B (ja) |
TW (2) | TWI589201B (ja) |
WO (1) | WO2015076372A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220019747A (ko) * | 2015-02-03 | 2022-02-17 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR102429384B1 (ko) * | 2021-07-02 | 2022-08-04 | 와이엠티 주식회사 | 캐리어박 부착 금속박, 이를 이용한 프린트 배선판용 적층체 및 이의 제조방법 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015076372A1 (ja) * | 2013-11-22 | 2015-05-28 | 三井金属鉱業株式会社 | 埋設回路を備えるプリント配線板の製造方法及びその製造方法で得られるプリント配線板 |
JP6546526B2 (ja) * | 2015-12-25 | 2019-07-17 | 三井金属鉱業株式会社 | キャリア付銅箔及びコアレス支持体用積層板、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
WO2017149810A1 (ja) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
WO2018066113A1 (ja) * | 2016-10-06 | 2018-04-12 | 三井金属鉱業株式会社 | 多層配線板の製造方法 |
JP7032578B2 (ja) * | 2019-01-11 | 2022-03-08 | 三井金属鉱業株式会社 | 積層体 |
CN110996540B (zh) * | 2019-12-31 | 2022-02-08 | 生益电子股份有限公司 | 一种pcb的制作方法 |
US20230361094A1 (en) * | 2020-11-24 | 2023-11-09 | Corning Incorporated | Substrates for microled and micro-electronics transfer |
CN113380529A (zh) * | 2021-05-13 | 2021-09-10 | 江苏普诺威电子股份有限公司 | 单层无线充电线圈载板的加工工艺 |
CN113473721A (zh) * | 2021-07-08 | 2021-10-01 | 江西柔顺科技有限公司 | 一种柔性印刷电路板及其制备方法 |
CN114650654B (zh) * | 2021-08-09 | 2024-05-31 | 广州方邦电子股份有限公司 | 金属箔、线路板及线路板的制备方法 |
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JPH11186716A (ja) * | 1997-10-14 | 1999-07-09 | Fujitsu Ltd | 金属層の形成方法 |
US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
US6893742B2 (en) * | 2001-02-15 | 2005-05-17 | Olin Corporation | Copper foil with low profile bond enhancement |
US6930256B1 (en) * | 2002-05-01 | 2005-08-16 | Amkor Technology, Inc. | Integrated circuit substrate having laser-embedded conductive patterns and method therefor |
JP4517564B2 (ja) * | 2002-05-23 | 2010-08-04 | 住友金属鉱山株式会社 | 2層銅ポリイミド基板 |
EP1531656A3 (en) * | 2003-11-11 | 2007-10-03 | Furukawa Circuit Foil Co., Ltd. | Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
JP2008235923A (ja) * | 2003-11-14 | 2008-10-02 | Hitachi Chem Co Ltd | プリント配線板の製造方法及び多層配線板 |
JP4756637B2 (ja) * | 2005-11-10 | 2011-08-24 | 三井金属鉱業株式会社 | 硫酸系銅電解液及び該硫酸系銅電解液を用いて得られた電解銅箔 |
JP4927503B2 (ja) * | 2005-12-15 | 2012-05-09 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
TW200738913A (en) * | 2006-03-10 | 2007-10-16 | Mitsui Mining & Smelting Co | Surface treated elctrolytic copper foil and process for producing the same |
JP2010157605A (ja) * | 2008-12-26 | 2010-07-15 | Panasonic Electric Works Co Ltd | 回路基板及び回路基板の製造方法 |
KR101298999B1 (ko) * | 2009-09-01 | 2013-08-23 | 일진머티리얼즈 주식회사 | 미세회로 형성을 위한 임베디드용 동박 |
JP5473838B2 (ja) * | 2010-03-30 | 2014-04-16 | 日本電解株式会社 | 支持体金属箔付き複合金属層、これを用いた配線板とその製造方法、この配線板を用いた半導体パッケージの製造方法 |
JP5672524B2 (ja) * | 2010-07-02 | 2015-02-18 | 日立化成株式会社 | 半導体素子搭載用パッケージ基板の製造方法 |
CN101892499B (zh) * | 2010-07-24 | 2011-11-09 | 江西理工大学 | 以铜箔作载体的可剥离超薄铜箔及其制备方法 |
JP5896200B2 (ja) * | 2010-09-29 | 2016-03-30 | 日立化成株式会社 | 半導体素子搭載用パッケージ基板の製造方法 |
TWI561138B (en) | 2011-03-30 | 2016-12-01 | Mitsui Mining & Smelting Co | Method of manufacturing multi-layer printed wiring board and multi-layer printed wiring board obtained by the manufacturing method |
WO2015076372A1 (ja) * | 2013-11-22 | 2015-05-28 | 三井金属鉱業株式会社 | 埋設回路を備えるプリント配線板の製造方法及びその製造方法で得られるプリント配線板 |
-
2014
- 2014-11-21 WO PCT/JP2014/080917 patent/WO2015076372A1/ja active Application Filing
- 2014-11-21 TW TW103140381A patent/TWI589201B/zh active
- 2014-11-21 CN CN201480062866.3A patent/CN105746003B/zh active Active
- 2014-11-21 KR KR1020177024807A patent/KR20170104648A/ko not_active Application Discontinuation
- 2014-11-21 TW TW106114233A patent/TWI633817B/zh active
- 2014-11-21 KR KR1020167013101A patent/KR20160089364A/ko not_active Application Discontinuation
- 2014-11-21 JP JP2015515311A patent/JP6753669B2/ja active Active
- 2014-11-21 CN CN201710821288.2A patent/CN107708314B/zh active Active
-
2017
- 2017-08-17 JP JP2017157371A patent/JP6753825B2/ja active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220019747A (ko) * | 2015-02-03 | 2022-02-17 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR102429384B1 (ko) * | 2021-07-02 | 2022-08-04 | 와이엠티 주식회사 | 캐리어박 부착 금속박, 이를 이용한 프린트 배선판용 적층체 및 이의 제조방법 |
WO2023277462A1 (ko) * | 2021-07-02 | 2023-01-05 | 와이엠티 주식회사 | 캐리어박 부착 금속박, 이를 이용한 프린트 배선판용 적층체 및 이의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
WO2015076372A1 (ja) | 2015-05-28 |
JPWO2015076372A1 (ja) | 2017-03-16 |
TW201731355A (zh) | 2017-09-01 |
JP6753825B2 (ja) | 2020-09-09 |
TWI633817B (zh) | 2018-08-21 |
CN107708314B (zh) | 2021-01-01 |
CN107708314A (zh) | 2018-02-16 |
JP2017224848A (ja) | 2017-12-21 |
CN105746003B (zh) | 2018-12-21 |
KR20160089364A (ko) | 2016-07-27 |
TW201536134A (zh) | 2015-09-16 |
TWI589201B (zh) | 2017-06-21 |
JP6753669B2 (ja) | 2020-09-09 |
CN105746003A (zh) | 2016-07-06 |
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