KR20170082973A - 아릴 화합물 및 그 제조 방법 - Google Patents
아릴 화합물 및 그 제조 방법 Download PDFInfo
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- KR20170082973A KR20170082973A KR1020160178131A KR20160178131A KR20170082973A KR 20170082973 A KR20170082973 A KR 20170082973A KR 1020160178131 A KR1020160178131 A KR 1020160178131A KR 20160178131 A KR20160178131 A KR 20160178131A KR 20170082973 A KR20170082973 A KR 20170082973A
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- -1 Aryl compound Chemical class 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 32
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 18
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 10
- 125000005843 halogen group Chemical group 0.000 claims abstract description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 5
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 125000002723 alicyclic group Chemical group 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 abstract description 50
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 48
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
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- 239000012044 organic layer Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 150000002430 hydrocarbons Chemical class 0.000 description 10
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 9
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- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
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- 239000004793 Polystyrene Substances 0.000 description 4
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- 229910001873 dinitrogen Inorganic materials 0.000 description 4
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
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- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
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- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 125000000466 oxiranyl group Chemical group 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- RXMBXXLBQPWRCU-UHFFFAOYSA-N C=CCc1cc(C(c2ccc(C(c(cc3)cc(CC=C)c3O)c(cc3)cc(CC=C)c3O)cc2)c(cc2CC=C)ccc2O)ccc1O Chemical compound C=CCc1cc(C(c2ccc(C(c(cc3)cc(CC=C)c3O)c(cc3)cc(CC=C)c3O)cc2)c(cc2CC=C)ccc2O)ccc1O RXMBXXLBQPWRCU-UHFFFAOYSA-N 0.000 description 1
- TYJPXZAWEQAHTA-UHFFFAOYSA-N CC(C)(c(cc1)cc(CC=C)c1OC1COC1)c1cc(-c2cc(OCC3OC3)c(CC=C)cc2-c(cc2)cc(CC=C)c2OCC2OC2)c(C)cc1 Chemical compound CC(C)(c(cc1)cc(CC=C)c1OC1COC1)c1cc(-c2cc(OCC3OC3)c(CC=C)cc2-c(cc2)cc(CC=C)c2OCC2OC2)c(C)cc1 TYJPXZAWEQAHTA-UHFFFAOYSA-N 0.000 description 1
- XDJNRXHDGKTQMZ-UHFFFAOYSA-N CC(Cc(cc(cc1)-c2cc(-c3cc(OCC4OC4)c(CC(C)=C)cc3-c(cc3)cc(CC(C)=C)c3OCC3OC3)c(C)cc2)c1OCC1OC1)=C Chemical compound CC(Cc(cc(cc1)-c2cc(-c3cc(OCC4OC4)c(CC(C)=C)cc3-c(cc3)cc(CC(C)=C)c3OCC3OC3)c(C)cc2)c1OCC1OC1)=C XDJNRXHDGKTQMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- RQTDWDATSAVLOR-UHFFFAOYSA-N Oc(cc1)ccc1-c1cc(-c(cc2)ccc2O)cc(-c(cc2)ccc2O)c1 Chemical compound Oc(cc1)ccc1-c1cc(-c(cc2)ccc2O)cc(-c(cc2)ccc2O)c1 RQTDWDATSAVLOR-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
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- 239000003054 catalyst Substances 0.000 description 1
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- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- WVIIMZNLDWSIRH-UHFFFAOYSA-N cyclohexylcyclohexane Chemical group C1CCCCC1C1CCCCC1 WVIIMZNLDWSIRH-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012156 elution solvent Substances 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000006178 methyl benzyl group Chemical group 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/04—Compounds containing oxirane rings containing only hydrogen and carbon atoms in addition to the ring oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D301/00—Preparation of oxiranes
- C07D301/27—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms
- C07D301/28—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms by reaction with hydroxyl radicals
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
- C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
- C07D303/27—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds having all hydroxyl radicals etherified with oxirane containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
상기 과제를 해결하기 위하여 본 발명은
하기 식(2)
(상기 식(2) 중에서, R1은 탄소수 3∼20의 탄화수소기이며, R2는 수소 원자 또는 메틸기이며, n은 3 또는 4이다.)
으로 표시되는, (메타)알릴기를 함유하는 페놀기를 3개 이상 가지는 아릴 화합물에, 하기 식(3)
(상기 식(3) 중에서, X는 할로겐 원자이다.)
으로 표시되는 2-할로메틸옥시란을 반응시킴으로써 얻어지는, 하기 식(1)
(상기 식(1) 중, R1, R2, n은 상기한 바와 동일함)
으로 표시되는, 글리시딜기와 (메타)알릴기를 1분자 내에 각각 3개 이상 가지는 아릴 화합물을 제공한다.
Description
Claims (5)
- 제1항에 있어서,
상기 일반식(1)에 있어서, R1이 탄소수 3∼15의 3가 또는 4가의 탄화수소기인, 아릴 화합물. - 제2항에 있어서,
상기 일반식(1)에 있어서, R1이 적어도 방향족기 또는 지환식기를 가지는, 아릴 화합물. - 하기 일반식(2):
(상기 일반식(2) 중에서, R1은 탄소수 3∼20의 3가 또는 4가의 탄화수소기이며, R2는 수소 원자 또는 메틸기이며, n은 3 또는 4임)
으로 표시되는, (메타)알릴기를 함유하는 페놀기를 가지는 아릴 화합물에, 하기 일반식(3):
(상기 일반식(3) 중에서, X는 할로겐 원자임)
으로 표시되는 2-할로메틸옥시란을 반응시키는 것을 특징으로 하는, 하기 일반식(1):
(상기 일반식(1) 중에서, R1은 탄소수 3∼20의 3가 또는 4가의 탄화수소기이며, R2는 수소 원자 또는 메틸기이며, n은 3 또는 4임)
으로 표시되는, 글리시딜기와 (메타)알릴기를 가지는 아릴 화합물의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-001905 | 2016-01-07 | ||
JP2016001905 | 2016-01-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170082973A true KR20170082973A (ko) | 2017-07-17 |
KR102576756B1 KR102576756B1 (ko) | 2023-09-07 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11130838A (ja) | 1997-10-28 | 1999-05-18 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びその硬化物 |
JP2002249584A (ja) | 2001-02-23 | 2002-09-06 | Shin Etsu Chem Co Ltd | シリコーン変性エポキシ樹脂又はシリコーン変性フェノール樹脂を含有する樹脂組成物、並びにこれを用いた半導体装置 |
US20030078322A1 (en) * | 2001-09-06 | 2003-04-24 | Tsuyoshi Honda | Conductive resin compositions and electronic parts using the same |
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CN103342892A (zh) * | 2013-06-06 | 2013-10-09 | 西安交通大学 | 一种双马来酰亚胺树脂的增韧改性剂及其制备方法 |
JP6613901B2 (ja) * | 2016-01-07 | 2019-12-04 | 信越化学工業株式会社 | エポキシ変性シリコーン樹脂及びその製造方法、硬化性組成物及び電子部品 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11130838A (ja) | 1997-10-28 | 1999-05-18 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びその硬化物 |
JP2002249584A (ja) | 2001-02-23 | 2002-09-06 | Shin Etsu Chem Co Ltd | シリコーン変性エポキシ樹脂又はシリコーン変性フェノール樹脂を含有する樹脂組成物、並びにこれを用いた半導体装置 |
US20020192477A1 (en) * | 2001-02-23 | 2002-12-19 | Tsuyoshi Honda | Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith |
US20030078322A1 (en) * | 2001-09-06 | 2003-04-24 | Tsuyoshi Honda | Conductive resin compositions and electronic parts using the same |
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TW201739742A (zh) | 2017-11-16 |
CN106946815B (zh) | 2022-07-01 |
JP2017125008A (ja) | 2017-07-20 |
JP6763293B2 (ja) | 2020-09-30 |
TWI745332B (zh) | 2021-11-11 |
KR102576756B1 (ko) | 2023-09-07 |
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