KR20170023202A - 기재막 및 소결 방법 - Google Patents

기재막 및 소결 방법 Download PDF

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Publication number
KR20170023202A
KR20170023202A KR1020177004747A KR20177004747A KR20170023202A KR 20170023202 A KR20170023202 A KR 20170023202A KR 1020177004747 A KR1020177004747 A KR 1020177004747A KR 20177004747 A KR20177004747 A KR 20177004747A KR 20170023202 A KR20170023202 A KR 20170023202A
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KR
South Korea
Prior art keywords
film
coating layer
base film
functional thin
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020177004747A
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English (en)
Korean (ko)
Inventor
쿠르트 에이. 슈로더
히로시 우치다
켄지 시노자키
Original Assignee
엔씨씨 나노, 엘엘씨
쇼와 덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔씨씨 나노, 엘엘씨, 쇼와 덴코 가부시키가이샤 filed Critical 엔씨씨 나노, 엘엘씨
Publication of KR20170023202A publication Critical patent/KR20170023202A/ko
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G13/00—Electrographic processes using a charge pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Pest Control & Pesticides (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
KR1020177004747A 2012-06-05 2013-05-31 기재막 및 소결 방법 Ceased KR20170023202A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261655644P 2012-06-05 2012-06-05
US61/655,644 2012-06-05
PCT/IB2013/001254 WO2013182896A1 (en) 2012-06-05 2013-05-31 Substrate film and sintering method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020147034282A Division KR20150016552A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020197017474A Division KR102122749B1 (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Publications (1)

Publication Number Publication Date
KR20170023202A true KR20170023202A (ko) 2017-03-02

Family

ID=49711481

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020177004747A Ceased KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020147034282A Ceased KR20150016552A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020197017474A Active KR102122749B1 (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020147034282A Ceased KR20150016552A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020197017474A Active KR102122749B1 (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Country Status (6)

Country Link
US (1) US9631283B2 (enExample)
EP (1) EP2855148B1 (enExample)
JP (1) JP6258303B2 (enExample)
KR (3) KR20170023202A (enExample)
CN (1) CN104797419B (enExample)
WO (1) WO2013182896A1 (enExample)

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US10000411B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductivity and low emissivity coating technology
US10060180B2 (en) 2010-01-16 2018-08-28 Cardinal Cg Company Flash-treated indium tin oxide coatings, production methods, and insulating glass unit transparent conductive coating technology
US10000965B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductive coating technology
JP5275498B1 (ja) * 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
CN105073416B (zh) * 2013-03-29 2018-01-23 太阳控股株式会社 光烧结用热塑性树脂薄膜基材、使用其的导电电路基板和其制造方法
WO2015149054A1 (en) * 2014-03-28 2015-10-01 Ez Print, Llc 3d print bed having permanent coating
CN108353503B (zh) * 2015-10-26 2021-02-19 韩国机械研究院 一种使用强脉冲光烧结的图案形成装置以及方法
WO2017110618A1 (ja) * 2015-12-24 2017-06-29 株式会社村田製作所 樹脂シート、樹脂シートの製造方法および樹脂多層基板の製造方法
JP2017216303A (ja) * 2016-05-30 2017-12-07 株式会社リコー 回路部材用基材、回路部材、回路部材用基材の製造方法、及び回路部材の製造方法
KR102401226B1 (ko) * 2016-11-17 2022-05-24 니폰 가가쿠 고교 가부시키가이샤 아산화구리 입자, 그의 제조 방법, 광 소결형 조성물, 그것을 사용한 도전막의 형성 방법 및 아산화구리 입자 페이스트
CN109426397B (zh) * 2017-08-22 2020-08-04 京东方科技集团股份有限公司 触控结构的制备方法、触控结构
US11028012B2 (en) 2018-10-31 2021-06-08 Cardinal Cg Company Low solar heat gain coatings, laminated glass assemblies, and methods of producing same
US11267763B2 (en) 2019-05-17 2022-03-08 Raytheon Technologies Corporation Rapid processing of laminar composite components
DE102019114806A1 (de) * 2019-06-03 2020-12-03 Value & Intellectual Properties Management Gmbh Verfahren zur Herstellung elektrischer oder elektronischer Bauteile oder Schaltungen auf einem flexiblen flächigen Träger
EP4007458B1 (en) * 2019-07-31 2023-08-09 Fuji Corporation Method for manufacturing circuit wiring by three-dimensional additive manufacturing
WO2021044986A1 (ja) * 2019-09-05 2021-03-11 株式会社Adeka 重合性組成物、被覆構造体の製造方法、被覆構造体及び被覆材
CN110577771A (zh) * 2019-09-17 2019-12-17 宁波石墨烯创新中心有限公司 一种导电油墨、rfid天线和电子标签及制备方法
JP2023017150A (ja) * 2021-07-26 2023-02-07 株式会社リコー 導体の製造方法、導体の製造装置、及び構造体
EP4274391A1 (en) 2022-05-06 2023-11-08 Ecole Polytechnique Federale De Lausanne (Epfl) Method for manufacturing an electrically conductive metal trace and corresponding metal trace, particularly suitable for transient electronic devices

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JP2008522369A (ja) 2004-11-24 2008-06-26 ノバセントリックス コーポレイション ナノ材料組成物の電気的使用、めっき的使用および触媒的使用
JP2010075911A (ja) 2008-09-26 2010-04-08 Samsung Electro-Mechanics Co Ltd 基板の二重表面処理方法及びこの方法により表面処理された基板
JP2010528428A (ja) 2007-05-18 2010-08-19 アプライド・ナノテック・ホールディングス・インコーポレーテッド 金属インク
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JP2005203396A (ja) 2004-01-13 2005-07-28 Toshiba Corp 電子部品の製造装置、電子部品の製造方法および電子部品
JP2008522369A (ja) 2004-11-24 2008-06-26 ノバセントリックス コーポレイション ナノ材料組成物の電気的使用、めっき的使用および触媒的使用
JP2010528428A (ja) 2007-05-18 2010-08-19 アプライド・ナノテック・ホールディングス・インコーポレーテッド 金属インク
JP2010075911A (ja) 2008-09-26 2010-04-08 Samsung Electro-Mechanics Co Ltd 基板の二重表面処理方法及びこの方法により表面処理された基板
WO2010110969A1 (en) 2009-03-25 2010-09-30 Ncc Nano, Llc Method for reducing thin films on low temperature substrates

Also Published As

Publication number Publication date
KR20190075151A (ko) 2019-06-28
WO2013182896A1 (en) 2013-12-12
EP2855148A4 (en) 2016-01-20
CN104797419A (zh) 2015-07-22
JP2015528753A (ja) 2015-10-01
JP6258303B2 (ja) 2018-01-10
US9631283B2 (en) 2017-04-25
KR20150016552A (ko) 2015-02-12
US20150225857A1 (en) 2015-08-13
EP2855148A1 (en) 2015-04-08
KR102122749B1 (ko) 2020-06-15
CN104797419B (zh) 2018-02-23
EP2855148B1 (en) 2019-04-10

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A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20170220

Application number text: 1020147034282

Filing date: 20141205

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