KR20160078874A - 반도체 웨이퍼의 마운트 방법 및 반도체 웨이퍼의 마운트 장치 - Google Patents

반도체 웨이퍼의 마운트 방법 및 반도체 웨이퍼의 마운트 장치 Download PDF

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Publication number
KR20160078874A
KR20160078874A KR1020150171157A KR20150171157A KR20160078874A KR 20160078874 A KR20160078874 A KR 20160078874A KR 1020150171157 A KR1020150171157 A KR 1020150171157A KR 20150171157 A KR20150171157 A KR 20150171157A KR 20160078874 A KR20160078874 A KR 20160078874A
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KR
South Korea
Prior art keywords
adhesive tape
semiconductor wafer
attaching
wafer
holding
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Application number
KR1020150171157A
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English (en)
Korean (ko)
Inventor
쵸헤이 오쿠노
마사유키 야마모토
Original Assignee
닛토덴코 가부시키가이샤
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Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20160078874A publication Critical patent/KR20160078874A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating
KR1020150171157A 2014-12-25 2015-12-03 반도체 웨이퍼의 마운트 방법 및 반도체 웨이퍼의 마운트 장치 KR20160078874A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014262761A JP6636696B2 (ja) 2014-12-25 2014-12-25 半導体ウエハのマウント方法および半導体ウエハのマウント装置
JPJP-P-2014-262761 2014-12-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020200023454A Division KR102157458B1 (ko) 2014-12-25 2020-02-26 반도체 웨이퍼의 마운트 방법 및 반도체 웨이퍼의 마운트 장치

Publications (1)

Publication Number Publication Date
KR20160078874A true KR20160078874A (ko) 2016-07-05

Family

ID=56296061

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020150171157A KR20160078874A (ko) 2014-12-25 2015-12-03 반도체 웨이퍼의 마운트 방법 및 반도체 웨이퍼의 마운트 장치
KR1020200023454A KR102157458B1 (ko) 2014-12-25 2020-02-26 반도체 웨이퍼의 마운트 방법 및 반도체 웨이퍼의 마운트 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020200023454A KR102157458B1 (ko) 2014-12-25 2020-02-26 반도체 웨이퍼의 마운트 방법 및 반도체 웨이퍼의 마운트 장치

Country Status (4)

Country Link
JP (1) JP6636696B2 (ja)
KR (2) KR20160078874A (ja)
CN (2) CN105742241A (ja)
TW (2) TWI693666B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220129510A (ko) * 2019-12-10 2022-09-23 정라파엘 테이프 마운팅 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6813367B2 (ja) * 2017-01-13 2021-01-13 株式会社ディスコ フレームユニット搬送システム
JPWO2019044506A1 (ja) * 2017-08-28 2020-09-10 東京エレクトロン株式会社 基板処理システム、および基板処理方法
CN108248233B (zh) * 2018-02-01 2023-10-24 梵利特智能科技（苏州）有限公司 一种高精度卡片冲压印字装置
JP2021027070A (ja) 2019-07-31 2021-02-22 日東電工株式会社 シート材貼付け方法およびシート材貼付け装置
JP7451028B2 (ja) 2019-12-27 2024-03-18 株式会社ディスコ 保護シートの配設方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013232582A (ja) 2012-05-01 2013-11-14 Nitto Denko Corp 粘着テープ貼付け方法および粘着テープ貼付け装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841355B2 (ja) * 2006-08-08 2011-12-21 日東電工株式会社 半導体ウエハの保持方法
JP5055509B2 (ja) * 2007-12-28 2012-10-24 株式会社タカトリ 基板への接着シートの貼付け装置
JP5417131B2 (ja) * 2009-11-20 2014-02-12 日東電工株式会社 粘着テープ貼付け装置および粘着テープ貼付け方法
JP5542582B2 (ja) * 2010-08-26 2014-07-09 リンテック株式会社 シート貼付装置および貼付方法
JP6059921B2 (ja) * 2012-08-31 2017-01-11 日東電工株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP5589045B2 (ja) * 2012-10-23 2014-09-10 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置
JP5992803B2 (ja) * 2012-11-07 2016-09-14 リンテック株式会社 シート貼付装置及び貼付方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013232582A (ja) 2012-05-01 2013-11-14 Nitto Denko Corp 粘着テープ貼付け方法および粘着テープ貼付け装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220129510A (ko) * 2019-12-10 2022-09-23 정라파엘 테이프 마운팅 장치

Also Published As

Publication number Publication date
KR102157458B1 (ko) 2020-09-17
CN111261590A (zh) 2020-06-09
TW201635418A (zh) 2016-10-01
TW202011510A (zh) 2020-03-16
TWI693666B (zh) 2020-05-11
CN105742241A (zh) 2016-07-06
JP6636696B2 (ja) 2020-01-29
KR20200024188A (ko) 2020-03-06
JP2016122763A (ja) 2016-07-07

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