KR20160004939A - 배선 기판 및 배선 기판 제조 방법 - Google Patents

배선 기판 및 배선 기판 제조 방법 Download PDF

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Publication number
KR20160004939A
KR20160004939A KR1020150093345A KR20150093345A KR20160004939A KR 20160004939 A KR20160004939 A KR 20160004939A KR 1020150093345 A KR1020150093345 A KR 1020150093345A KR 20150093345 A KR20150093345 A KR 20150093345A KR 20160004939 A KR20160004939 A KR 20160004939A
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KR
South Korea
Prior art keywords
layer
wiring
metal
metal posts
posts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020150093345A
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English (en)
Korean (ko)
Inventor
다카히로 로쿠가와
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20160004939A publication Critical patent/KR20160004939A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H01L23/525—
    • H01L21/28026—
    • H01L21/768—
    • H01L23/5226—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1020150093345A 2014-07-04 2015-06-30 배선 기판 및 배선 기판 제조 방법 Withdrawn KR20160004939A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014138731A JP2016018806A (ja) 2014-07-04 2014-07-04 配線基板、配線基板の製造方法
JPJP-P-2014-138731 2014-07-04

Publications (1)

Publication Number Publication Date
KR20160004939A true KR20160004939A (ko) 2016-01-13

Family

ID=55017538

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150093345A Withdrawn KR20160004939A (ko) 2014-07-04 2015-06-30 배선 기판 및 배선 기판 제조 방법

Country Status (5)

Country Link
US (1) US9431333B2 (enExample)
JP (1) JP2016018806A (enExample)
KR (1) KR20160004939A (enExample)
CN (1) CN105246247A (enExample)
TW (1) TWI680701B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6715618B2 (ja) * 2016-02-23 2020-07-01 イビデン株式会社 プリント配線板
US10651116B2 (en) 2016-06-30 2020-05-12 Intel Corporation Planar integrated circuit package interconnects
JP6838528B2 (ja) 2017-08-31 2021-03-03 日亜化学工業株式会社 基板の製造方法と発光装置の製造方法
CN108289383B (zh) * 2018-03-05 2020-02-18 东莞市龙谊电子科技有限公司 印制电路板的选择性电镀工艺
US11500489B2 (en) 2019-01-30 2022-11-15 Chengdu Boe Optoelectronics Technology Co., Ltd. Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof
WO2020156475A1 (zh) * 2019-01-30 2020-08-06 京东方科技集团股份有限公司 柔性电路板及制作方法、电子装置模组及电子装置
CN111511109B (zh) 2019-01-30 2021-11-23 京东方科技集团股份有限公司 柔性电路板及制作方法、电子装置模组及电子装置
JP2020202205A (ja) * 2019-06-06 2020-12-17 イビデン株式会社 プリント配線板とプリント配線板の製造方法
US12127340B2 (en) * 2019-09-30 2024-10-22 Kyocera Corporation Wiring substrate
JP2022015758A (ja) * 2020-07-09 2022-01-21 イビデン株式会社 配線基板
JP2022015755A (ja) 2020-07-09 2022-01-21 イビデン株式会社 配線基板
JP2022015756A (ja) 2020-07-09 2022-01-21 イビデン株式会社 配線基板及び配線基板の製造方法
US11823983B2 (en) * 2021-03-23 2023-11-21 Qualcomm Incorporated Package with a substrate comprising pad-on-pad interconnects
JP7689089B2 (ja) * 2022-01-25 2025-06-05 シチズンファインデバイス株式会社 基板の製造方法
JP2024094553A (ja) * 2022-12-28 2024-07-10 新光電気工業株式会社 配線基板及びその製造方法、半導体装置
US20240387430A1 (en) * 2023-05-17 2024-11-21 Taiwan Semiconductor Manufacturing Company, Ltd. Metal bump structures and methods of forming the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI268012B (en) * 2003-08-07 2006-12-01 Phoenix Prec Technology Corp Electrically conductive structure formed between neighboring layers of circuit board and method for fabricating the same
JP4653447B2 (ja) * 2004-09-09 2011-03-16 Ｏｋｉセミコンダクタ株式会社 半導体装置の製造方法
JP4747770B2 (ja) * 2005-10-04 2011-08-17 日立化成工業株式会社 プリント配線板の製造方法、及び半導体チップ搭載基板の製造方法
JP4769056B2 (ja) 2005-10-07 2011-09-07 日本特殊陶業株式会社 配線基板及びその製法方法
JP4946225B2 (ja) * 2006-07-13 2012-06-06 株式会社村田製作所 多層セラミック電子部品、多層セラミック基板、および多層セラミック電子部品の製造方法
JP5043743B2 (ja) * 2008-04-18 2012-10-10 ラピスセミコンダクタ株式会社 半導体装置の製造方法
JP2010287710A (ja) * 2009-06-11 2010-12-24 Renesas Electronics Corp 半導体装置およびその製造方法
TWI412308B (zh) * 2009-11-06 2013-10-11 威盛電子股份有限公司 線路基板及其製程
US20110299259A1 (en) * 2010-06-04 2011-12-08 Yu-Ling Hsieh Circuit board with conductor post structure
JP2013105908A (ja) * 2011-11-14 2013-05-30 Ngk Spark Plug Co Ltd 配線基板
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same

Also Published As

Publication number Publication date
CN105246247A (zh) 2016-01-13
US9431333B2 (en) 2016-08-30
TWI680701B (zh) 2019-12-21
TW201603663A (zh) 2016-01-16
JP2016018806A (ja) 2016-02-01
US20160005685A1 (en) 2016-01-07

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P22-X000 Classification modified

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