KR20160004939A - 배선 기판 및 배선 기판 제조 방법 - Google Patents

배선 기판 및 배선 기판 제조 방법 Download PDF

Info

Publication number
KR20160004939A
KR20160004939A KR1020150093345A KR20150093345A KR20160004939A KR 20160004939 A KR20160004939 A KR 20160004939A KR 1020150093345 A KR1020150093345 A KR 1020150093345A KR 20150093345 A KR20150093345 A KR 20150093345A KR 20160004939 A KR20160004939 A KR 20160004939A
Authority
KR
South Korea
Prior art keywords
layer
wiring
metal
metal posts
posts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020150093345A
Other languages
English (en)
Korean (ko)
Inventor
다카히로 로쿠가와
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20160004939A publication Critical patent/KR20160004939A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H10W70/65—
    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H10W70/60—
    • H10W70/63—
    • H10W72/072—
    • H10W72/073—
    • H10W72/241—
    • H10W72/29—
    • H10W74/00—
    • H10W74/15—
    • H10W90/00—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020150093345A 2014-07-04 2015-06-30 배선 기판 및 배선 기판 제조 방법 Withdrawn KR20160004939A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-138731 2014-07-04
JP2014138731A JP2016018806A (ja) 2014-07-04 2014-07-04 配線基板、配線基板の製造方法

Publications (1)

Publication Number Publication Date
KR20160004939A true KR20160004939A (ko) 2016-01-13

Family

ID=55017538

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150093345A Withdrawn KR20160004939A (ko) 2014-07-04 2015-06-30 배선 기판 및 배선 기판 제조 방법

Country Status (5)

Country Link
US (1) US9431333B2 (enExample)
JP (1) JP2016018806A (enExample)
KR (1) KR20160004939A (enExample)
CN (1) CN105246247A (enExample)
TW (1) TWI680701B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6715618B2 (ja) * 2016-02-23 2020-07-01 イビデン株式会社 プリント配線板
US10651116B2 (en) * 2016-06-30 2020-05-12 Intel Corporation Planar integrated circuit package interconnects
JP6838528B2 (ja) 2017-08-31 2021-03-03 日亜化学工業株式会社 基板の製造方法と発光装置の製造方法
CN108289383B (zh) * 2018-03-05 2020-02-18 东莞市龙谊电子科技有限公司 印制电路板的选择性电镀工艺
CN111511109B (zh) 2019-01-30 2021-11-23 京东方科技集团股份有限公司 柔性电路板及制作方法、电子装置模组及电子装置
WO2020156475A1 (zh) * 2019-01-30 2020-08-06 京东方科技集团股份有限公司 柔性电路板及制作方法、电子装置模组及电子装置
US11500489B2 (en) 2019-01-30 2022-11-15 Chengdu Boe Optoelectronics Technology Co., Ltd. Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof
JP2020202205A (ja) * 2019-06-06 2020-12-17 イビデン株式会社 プリント配線板とプリント配線板の製造方法
WO2021065601A1 (ja) * 2019-09-30 2021-04-08 京セラ株式会社 配線基板
JP2022015756A (ja) 2020-07-09 2022-01-21 イビデン株式会社 配線基板及び配線基板の製造方法
JP2022015755A (ja) 2020-07-09 2022-01-21 イビデン株式会社 配線基板
JP2022015758A (ja) * 2020-07-09 2022-01-21 イビデン株式会社 配線基板
JP7689089B2 (ja) * 2022-01-25 2025-06-05 シチズンファインデバイス株式会社 基板の製造方法
US20240387430A1 (en) * 2023-05-17 2024-11-21 Taiwan Semiconductor Manufacturing Company, Ltd. Metal bump structures and methods of forming the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI268012B (en) * 2003-08-07 2006-12-01 Phoenix Prec Technology Corp Electrically conductive structure formed between neighboring layers of circuit board and method for fabricating the same
JP4653447B2 (ja) * 2004-09-09 2011-03-16 Ｏｋｉセミコンダクタ株式会社 半導体装置の製造方法
JP4747770B2 (ja) * 2005-10-04 2011-08-17 日立化成工業株式会社 プリント配線板の製造方法、及び半導体チップ搭載基板の製造方法
JP4769056B2 (ja) 2005-10-07 2011-09-07 日本特殊陶業株式会社 配線基板及びその製法方法
JP4946225B2 (ja) * 2006-07-13 2012-06-06 株式会社村田製作所 多層セラミック電子部品、多層セラミック基板、および多層セラミック電子部品の製造方法
JP5043743B2 (ja) * 2008-04-18 2012-10-10 ラピスセミコンダクタ株式会社 半導体装置の製造方法
JP2010287710A (ja) * 2009-06-11 2010-12-24 Renesas Electronics Corp 半導体装置およびその製造方法
TWI412308B (zh) * 2009-11-06 2013-10-11 威盛電子股份有限公司 線路基板及其製程
US20110299259A1 (en) * 2010-06-04 2011-12-08 Yu-Ling Hsieh Circuit board with conductor post structure
JP2013105908A (ja) * 2011-11-14 2013-05-30 Ngk Spark Plug Co Ltd 配線基板
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same

Also Published As

Publication number Publication date
TWI680701B (zh) 2019-12-21
JP2016018806A (ja) 2016-02-01
US20160005685A1 (en) 2016-01-07
US9431333B2 (en) 2016-08-30
TW201603663A (zh) 2016-01-16
CN105246247A (zh) 2016-01-13

Similar Documents

Publication Publication Date Title
KR20160004939A (ko) 배선 기판 및 배선 기판 제조 방법
US9179552B2 (en) Wiring board
US9773747B2 (en) Wiring substrate and method for manufacturing wiring subtrate
US9893002B2 (en) Terminal structure and wiring substrate
JP6394136B2 (ja) パッケージ基板およびその製造方法
KR101593280B1 (ko) 코어리스 기판을 형성하기 위한 방법
US9699905B2 (en) Wiring board
JP7253946B2 (ja) 配線基板及びその製造方法、半導体パッケージ
US9380712B2 (en) Wiring substrate and semiconductor device
KR20150087298A (ko) 배선기판
JP2022025342A (ja) 配線基板及びその製造方法
US20130264100A1 (en) Wiring Substrate and Method for Manufacturing Wiring Substrate
TWI454198B (zh) 配線基板製造方法
TWI458416B (zh) 配線基板製造方法
US9818702B2 (en) Wiring substrate and semiconductor device
US20210296260A1 (en) Semiconductor packaging substrate, fabrication method and packaging process thereof
JP2010034430A (ja) 配線基板及びその製造方法
US11823993B2 (en) Wiring substrate and semiconductor device each having first and second via wirings
KR20120046602A (ko) 인쇄회로기판 및 그 제조방법
KR101158213B1 (ko) 전자부품 내장형 인쇄회로기판 및 이의 제조 방법
US11978695B2 (en) Semiconductor package and method of fabricating the same
JP2024160760A (ja) 半導体装置実装用の配線基板およびその製造方法
KR20260007241A (ko) 반도체 장치 실장용의 배선 기판 및 그 제조 방법 그리고 반도체 장치
CN120111774A (zh) 电路板和电子组件封装件
JP6007956B2 (ja) 部品内蔵配線板

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000