TWI680701B - 配線基板及其製造方法 - Google Patents

配線基板及其製造方法 Download PDF

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Publication number
TWI680701B
TWI680701B TW104121259A TW104121259A TWI680701B TW I680701 B TWI680701 B TW I680701B TW 104121259 A TW104121259 A TW 104121259A TW 104121259 A TW104121259 A TW 104121259A TW I680701 B TWI680701 B TW I680701B
Authority
TW
Taiwan
Prior art keywords
layer
wiring
metal
metal terminal
wiring layer
Prior art date
Application number
TW104121259A
Other languages
English (en)
Chinese (zh)
Other versions
TW201603663A (zh
Inventor
六川，貴博
Takahiro Rokugawa
Original Assignee
日商新光電氣工業股份有限公司
Shinko Electric Industries Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新光電氣工業股份有限公司, Shinko Electric Industries Co., Ltd. filed Critical 日商新光電氣工業股份有限公司
Publication of TW201603663A publication Critical patent/TW201603663A/zh
Application granted granted Critical
Publication of TWI680701B publication Critical patent/TWI680701B/zh

Links

Classifications

    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H10W70/65—
    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H10W70/60—
    • H10W70/63—
    • H10W72/072—
    • H10W72/073—
    • H10W72/241—
    • H10W72/29—
    • H10W74/00—
    • H10W74/15—
    • H10W90/00—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW104121259A 2014-07-04 2015-07-01 配線基板及其製造方法 TWI680701B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014138731A JP2016018806A (ja) 2014-07-04 2014-07-04 配線基板、配線基板の製造方法
JP??2014-138731 2014-07-04

Publications (2)

Publication Number Publication Date
TW201603663A TW201603663A (zh) 2016-01-16
TWI680701B true TWI680701B (zh) 2019-12-21

Family

ID=55017538

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104121259A TWI680701B (zh) 2014-07-04 2015-07-01 配線基板及其製造方法

Country Status (5)

Country Link
US (1) US9431333B2 (enExample)
JP (1) JP2016018806A (enExample)
KR (1) KR20160004939A (enExample)
CN (1) CN105246247A (enExample)
TW (1) TWI680701B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6715618B2 (ja) * 2016-02-23 2020-07-01 イビデン株式会社 プリント配線板
US10651116B2 (en) * 2016-06-30 2020-05-12 Intel Corporation Planar integrated circuit package interconnects
JP6838528B2 (ja) 2017-08-31 2021-03-03 日亜化学工業株式会社 基板の製造方法と発光装置の製造方法
CN108289383B (zh) * 2018-03-05 2020-02-18 东莞市龙谊电子科技有限公司 印制电路板的选择性电镀工艺
CN111511109B (zh) 2019-01-30 2021-11-23 京东方科技集团股份有限公司 柔性电路板及制作方法、电子装置模组及电子装置
WO2020156475A1 (zh) * 2019-01-30 2020-08-06 京东方科技集团股份有限公司 柔性电路板及制作方法、电子装置模组及电子装置
US11500489B2 (en) 2019-01-30 2022-11-15 Chengdu Boe Optoelectronics Technology Co., Ltd. Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof
JP2020202205A (ja) * 2019-06-06 2020-12-17 イビデン株式会社 プリント配線板とプリント配線板の製造方法
WO2021065601A1 (ja) * 2019-09-30 2021-04-08 京セラ株式会社 配線基板
JP2022015756A (ja) 2020-07-09 2022-01-21 イビデン株式会社 配線基板及び配線基板の製造方法
JP2022015755A (ja) 2020-07-09 2022-01-21 イビデン株式会社 配線基板
JP2022015758A (ja) * 2020-07-09 2022-01-21 イビデン株式会社 配線基板
JP7689089B2 (ja) * 2022-01-25 2025-06-05 シチズンファインデバイス株式会社 基板の製造方法
US20240387430A1 (en) * 2023-05-17 2024-11-21 Taiwan Semiconductor Manufacturing Company, Ltd. Metal bump structures and methods of forming the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006080267A (ja) * 2004-09-09 2006-03-23 Oki Electric Ind Co Ltd 半導体装置の製造方法
US7253364B2 (en) * 2003-08-07 2007-08-07 Phoenix Precision Technology Corporation Circuit board having electrically conductive structure formed between circuit layers thereof and method for fabricating the same
JP2008021883A (ja) * 2006-07-13 2008-01-31 Murata Mfg Co Ltd 多層セラミック電子部品、多層セラミック基板、および多層セラミック電子部品の製造方法
US20090263938A1 (en) * 2008-04-18 2009-10-22 Oki Semiconductor Co., Ltd. Method for manufacturing semiconductor device
JP2010287710A (ja) * 2009-06-11 2010-12-24 Renesas Electronics Corp 半導体装置およびその製造方法
US20110108313A1 (en) * 2009-11-06 2011-05-12 Via Technologies, Inc. Circuit substrate and fabricating process thereof
US20110299259A1 (en) * 2010-06-04 2011-12-08 Yu-Ling Hsieh Circuit board with conductor post structure
JP2013105908A (ja) * 2011-11-14 2013-05-30 Ngk Spark Plug Co Ltd 配線基板
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4747770B2 (ja) * 2005-10-04 2011-08-17 日立化成工業株式会社 プリント配線板の製造方法、及び半導体チップ搭載基板の製造方法
JP4769056B2 (ja) 2005-10-07 2011-09-07 日本特殊陶業株式会社 配線基板及びその製法方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7253364B2 (en) * 2003-08-07 2007-08-07 Phoenix Precision Technology Corporation Circuit board having electrically conductive structure formed between circuit layers thereof and method for fabricating the same
JP2006080267A (ja) * 2004-09-09 2006-03-23 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP2008021883A (ja) * 2006-07-13 2008-01-31 Murata Mfg Co Ltd 多層セラミック電子部品、多層セラミック基板、および多層セラミック電子部品の製造方法
US20090263938A1 (en) * 2008-04-18 2009-10-22 Oki Semiconductor Co., Ltd. Method for manufacturing semiconductor device
JP2010287710A (ja) * 2009-06-11 2010-12-24 Renesas Electronics Corp 半導体装置およびその製造方法
US20110108313A1 (en) * 2009-11-06 2011-05-12 Via Technologies, Inc. Circuit substrate and fabricating process thereof
US20110299259A1 (en) * 2010-06-04 2011-12-08 Yu-Ling Hsieh Circuit board with conductor post structure
JP2013105908A (ja) * 2011-11-14 2013-05-30 Ngk Spark Plug Co Ltd 配線基板
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same

Also Published As

Publication number Publication date
JP2016018806A (ja) 2016-02-01
KR20160004939A (ko) 2016-01-13
US20160005685A1 (en) 2016-01-07
US9431333B2 (en) 2016-08-30
TW201603663A (zh) 2016-01-16
CN105246247A (zh) 2016-01-13

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