KR20150080449A - 기질들을 정렬하기 위한 장치 및 방법 - Google Patents

기질들을 정렬하기 위한 장치 및 방법 Download PDF

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Publication number
KR20150080449A
KR20150080449A KR1020147030498A KR20147030498A KR20150080449A KR 20150080449 A KR20150080449 A KR 20150080449A KR 1020147030498 A KR1020147030498 A KR 1020147030498A KR 20147030498 A KR20147030498 A KR 20147030498A KR 20150080449 A KR20150080449 A KR 20150080449A
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KR
South Korea
Prior art keywords
substrate
holder
sensing
marking
unit
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Ceased
Application number
KR1020147030498A
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English (en)
Korean (ko)
Inventor
토마스 발겐라이트너
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에베 그룹 에. 탈너 게엠베하
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Publication of KR20150080449A publication Critical patent/KR20150080449A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020147030498A 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법 Ceased KR20150080449A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/075831 WO2015082020A1 (de) 2013-12-06 2013-12-06 Vorrichtung und verfahren zum ausrichten von substraten

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020167022033A Division KR101741384B1 (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법

Publications (1)

Publication Number Publication Date
KR20150080449A true KR20150080449A (ko) 2015-07-09

Family

ID=49753165

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147030498A Ceased KR20150080449A (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법
KR1020167022033A Active KR101741384B1 (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167022033A Active KR101741384B1 (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법

Country Status (8)

Country Link
US (1) US9851645B2 (https=)
EP (1) EP2893556B9 (https=)
JP (1) JP6042564B2 (https=)
KR (2) KR20150080449A (https=)
CN (1) CN105247670B (https=)
SG (1) SG11201406979VA (https=)
TW (1) TWI637458B (https=)
WO (1) WO2015082020A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102020236B1 (ko) * 2018-04-20 2019-09-10 세메스 주식회사 패널 합착 장치
KR20210148855A (ko) * 2020-05-28 2021-12-08 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 본딩된 웨이퍼들을 위한 포토리소그래피 정렬 공정
KR20220097217A (ko) * 2020-12-31 2022-07-07 주식회사 테스 기판접합장치 및 기판접합방법
KR20230000465U (ko) * 2021-08-26 2023-03-07 케이-제트 레이저 테크 인코포레이티드 정렬 기기

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KR102300481B1 (ko) 2016-08-12 2021-09-10 에베 그룹 에. 탈너 게엠베하 기판을 접합하기 위한 방법 및 샘플 홀더
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102020236B1 (ko) * 2018-04-20 2019-09-10 세메스 주식회사 패널 합착 장치
KR20210148855A (ko) * 2020-05-28 2021-12-08 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 본딩된 웨이퍼들을 위한 포토리소그래피 정렬 공정
KR20220097217A (ko) * 2020-12-31 2022-07-07 주식회사 테스 기판접합장치 및 기판접합방법
KR20230000465U (ko) * 2021-08-26 2023-03-07 케이-제트 레이저 테크 인코포레이티드 정렬 기기

Also Published As

Publication number Publication date
WO2015082020A1 (de) 2015-06-11
JP6042564B2 (ja) 2016-12-14
CN105247670A (zh) 2016-01-13
KR20160101202A (ko) 2016-08-24
CN105247670B (zh) 2018-06-12
US9851645B2 (en) 2017-12-26
SG11201406979VA (en) 2015-07-30
TW201523782A (zh) 2015-06-16
EP2893556B1 (de) 2018-01-10
TWI637458B (zh) 2018-10-01
EP2893556A1 (de) 2015-07-15
EP2893556B9 (de) 2018-09-12
JP2016503589A (ja) 2016-02-04
US20160240420A1 (en) 2016-08-18
KR101741384B1 (ko) 2017-05-29

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