KR20150053902A - 접촉 범프 연결부와 접촉 범프 및 접촉 범프 연결부를 제조하는 방법 - Google Patents

접촉 범프 연결부와 접촉 범프 및 접촉 범프 연결부를 제조하는 방법 Download PDF

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KR20150053902A
KR20150053902A KR1020157004910A KR20157004910A KR20150053902A KR 20150053902 A KR20150053902 A KR 20150053902A KR 1020157004910 A KR1020157004910 A KR 1020157004910A KR 20157004910 A KR20157004910 A KR 20157004910A KR 20150053902 A KR20150053902 A KR 20150053902A
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South Korea
Prior art keywords
contact
terminal
edge portion
contact bump
bump
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KR1020157004910A
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English (en)
Korean (ko)
Inventor
카르스텐 닐랜드
프랜크 크리벨
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스마트랙 테크놀로지 게엠베하
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Publication of KR20150053902A publication Critical patent/KR20150053902A/ko
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
KR1020157004910A 2012-08-10 2013-08-09 접촉 범프 연결부와 접촉 범프 및 접촉 범프 연결부를 제조하는 방법 Withdrawn KR20150053902A (ko)

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DE102012015811 2012-08-10
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PCT/DE2013/000451 WO2014023287A2 (de) 2012-08-10 2013-08-09 Kontakthöckerverbindung sowie kontakthöcker und verfahren zur herstellung einer kontakthöckerverbindung

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Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
JP2716336B2 (ja) 1993-03-10 1998-02-18 日本電気株式会社 集積回路装置
US5483741A (en) * 1993-09-03 1996-01-16 Micron Technology, Inc. Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice
JPH0870019A (ja) * 1994-08-30 1996-03-12 Casio Comput Co Ltd 電子部品の接続構造および接続方法
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
JPH11163036A (ja) * 1997-09-17 1999-06-18 Tamura Seisakusho Co Ltd バンプ形成方法、はんだ接合用前処理方法、はんだ接合方法、バンプ形成装置、はんだ接合用前処理装置およびはんだ接合装置
US6028436A (en) * 1997-12-02 2000-02-22 Micron Technology, Inc. Method for forming coaxial silicon interconnects
US6045026A (en) * 1998-02-23 2000-04-04 Micron Technology, Inc. Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
JP2000114314A (ja) 1998-09-29 2000-04-21 Hitachi Ltd 半導体素子実装構造体およびその製造方法並びにｉｃカード
DE19905807A1 (de) * 1999-02-11 2000-08-31 Ksw Microtec Ges Fuer Angewand Verfahren zur Herstellung elektrisch leitender Verbindungen
JP2001148401A (ja) * 1999-11-18 2001-05-29 Seiko Epson Corp 半導体装置およびその製造方法
DE10157205A1 (de) 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US7015590B2 (en) 2003-01-10 2006-03-21 Samsung Electronics Co., Ltd. Reinforced solder bump structure and method for forming a reinforced solder bump
JP2005197488A (ja) * 2004-01-08 2005-07-21 Sony Corp 突起電極及びボンディングキャピラリ並びに半導体チップ
DE102004006457A1 (de) 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
DE102005012496B3 (de) * 2005-03-16 2006-10-26 Technische Universität Berlin Vorrichtung mit einem auf einem Montageteil montierten elektronischen Bauteil und Verfahren
JP2006310477A (ja) * 2005-04-27 2006-11-09 Akita Denshi Systems:Kk 半導体装置及びその製造方法
JP5117169B2 (ja) * 2007-04-06 2013-01-09 株式会社日立製作所 半導体装置
US8102021B2 (en) * 2008-05-12 2012-01-24 Sychip Inc. RF devices
US8766450B2 (en) * 2009-09-22 2014-07-01 Samsung Electro-Mechanics Co., Ltd. Lead pin for package substrate

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WO2014023287A2 (de) 2014-02-13
US20150208508A1 (en) 2015-07-23
EP2883245A2 (de) 2015-06-17
DE102013215771A1 (de) 2014-02-13
BR112015002759B1 (pt) 2021-11-03
JP2015532780A (ja) 2015-11-12
WO2014023287A3 (de) 2014-04-03
CN104737286B (zh) 2018-09-25
IN2015MN00491A (enExample) 2015-09-04
EP2883245B1 (de) 2020-09-30
BR112015002759A2 (pt) 2017-07-04
CN104737286A (zh) 2015-06-24
MY172360A (en) 2019-11-21
MX349946B (es) 2017-08-22
MX2015001754A (es) 2015-09-16
DE102013215771B4 (de) 2019-06-13
CA2880408A1 (en) 2014-02-13
US10292270B2 (en) 2019-05-14
JP6347781B2 (ja) 2018-06-27

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