CN104737286B - 接触凸块连接以及接触凸块和用于建立凸块接触连接的方法 - Google Patents

接触凸块连接以及接触凸块和用于建立凸块接触连接的方法 Download PDF

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Publication number
CN104737286B
CN104737286B CN201380042531.0A CN201380042531A CN104737286B CN 104737286 B CN104737286 B CN 104737286B CN 201380042531 A CN201380042531 A CN 201380042531A CN 104737286 B CN104737286 B CN 104737286B
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China
Prior art keywords
contact
space
joint face
contact tab
squeezing
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CN201380042531.0A
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English (en)
Chinese (zh)
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CN104737286A (zh
Inventor
卡斯滕·尼兰
弗兰克·克里贝尔
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Si Maida Science And Technology Ltd Co
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Si Maida Science And Technology Ltd Co
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Classifications

    • H10W72/20—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H10W20/063—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H10W72/01235—
    • H10W72/01255—
    • H10W72/072—
    • H10W72/07231—
    • H10W72/07232—
    • H10W72/07233—
    • H10W72/07253—
    • H10W72/07254—
    • H10W72/073—
    • H10W72/07338—
    • H10W72/221—
    • H10W72/231—
    • H10W72/232—
    • H10W72/234—
    • H10W72/241—
    • H10W72/242—
    • H10W72/29—
    • H10W72/9415—
    • H10W74/15—
    • H10W90/724—
    • H10W99/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Power Engineering (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
CN201380042531.0A 2012-08-10 2013-08-09 接触凸块连接以及接触凸块和用于建立凸块接触连接的方法 Active CN104737286B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012015811 2012-08-10
DE102012015811.4 2012-08-10
PCT/DE2013/000451 WO2014023287A2 (de) 2012-08-10 2013-08-09 Kontakthöckerverbindung sowie kontakthöcker und verfahren zur herstellung einer kontakthöckerverbindung

Publications (2)

Publication Number Publication Date
CN104737286A CN104737286A (zh) 2015-06-24
CN104737286B true CN104737286B (zh) 2018-09-25

Family

ID=49303671

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380042531.0A Active CN104737286B (zh) 2012-08-10 2013-08-09 接触凸块连接以及接触凸块和用于建立凸块接触连接的方法

Country Status (12)

Country Link
US (1) US10292270B2 (enExample)
EP (1) EP2883245B1 (enExample)
JP (1) JP6347781B2 (enExample)
KR (1) KR20150053902A (enExample)
CN (1) CN104737286B (enExample)
BR (1) BR112015002759B1 (enExample)
CA (1) CA2880408A1 (enExample)
DE (1) DE102013215771B4 (enExample)
IN (1) IN2015MN00491A (enExample)
MX (1) MX349946B (enExample)
MY (1) MY172360A (enExample)
WO (1) WO2014023287A2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12470254B2 (en) 2019-10-03 2025-11-11 collectID AG Methods and systems for authenticating physical products via near field communication tags and recording authentication transactions on a blockchain

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5640052A (en) * 1993-03-10 1997-06-17 Nec Corporation Interconnection structure of electronic parts
JP2005197488A (ja) * 2004-01-08 2005-07-21 Sony Corp 突起電極及びボンディングキャピラリ並びに半導体チップ
JP2006310477A (ja) * 2005-04-27 2006-11-09 Akita Denshi Systems:Kk 半導体装置及びその製造方法
CN101295692A (zh) * 2007-04-06 2008-10-29 株式会社日立制作所 半导体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5483741A (en) * 1993-09-03 1996-01-16 Micron Technology, Inc. Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice
JPH0870019A (ja) * 1994-08-30 1996-03-12 Casio Comput Co Ltd 電子部品の接続構造および接続方法
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
JPH11163036A (ja) * 1997-09-17 1999-06-18 Tamura Seisakusho Co Ltd バンプ形成方法、はんだ接合用前処理方法、はんだ接合方法、バンプ形成装置、はんだ接合用前処理装置およびはんだ接合装置
US6028436A (en) * 1997-12-02 2000-02-22 Micron Technology, Inc. Method for forming coaxial silicon interconnects
US6045026A (en) * 1998-02-23 2000-04-04 Micron Technology, Inc. Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
JP2000114314A (ja) * 1998-09-29 2000-04-21 Hitachi Ltd 半導体素子実装構造体およびその製造方法並びにｉｃカード
DE19905807A1 (de) 1999-02-11 2000-08-31 Ksw Microtec Ges Fuer Angewand Verfahren zur Herstellung elektrisch leitender Verbindungen
JP2001148401A (ja) * 1999-11-18 2001-05-29 Seiko Epson Corp 半導体装置およびその製造方法
DE10157205A1 (de) 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US7015590B2 (en) * 2003-01-10 2006-03-21 Samsung Electronics Co., Ltd. Reinforced solder bump structure and method for forming a reinforced solder bump
DE102004006457A1 (de) 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
DE102005012496B3 (de) * 2005-03-16 2006-10-26 Technische Universität Berlin Vorrichtung mit einem auf einem Montageteil montierten elektronischen Bauteil und Verfahren
US8102021B2 (en) * 2008-05-12 2012-01-24 Sychip Inc. RF devices
US8766450B2 (en) * 2009-09-22 2014-07-01 Samsung Electro-Mechanics Co., Ltd. Lead pin for package substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5640052A (en) * 1993-03-10 1997-06-17 Nec Corporation Interconnection structure of electronic parts
JP2005197488A (ja) * 2004-01-08 2005-07-21 Sony Corp 突起電極及びボンディングキャピラリ並びに半導体チップ
JP2006310477A (ja) * 2005-04-27 2006-11-09 Akita Denshi Systems:Kk 半導体装置及びその製造方法
CN101295692A (zh) * 2007-04-06 2008-10-29 株式会社日立制作所 半导体装置

Also Published As

Publication number Publication date
DE102013215771B4 (de) 2019-06-13
CA2880408A1 (en) 2014-02-13
MX349946B (es) 2017-08-22
MX2015001754A (es) 2015-09-16
JP6347781B2 (ja) 2018-06-27
DE102013215771A1 (de) 2014-02-13
KR20150053902A (ko) 2015-05-19
MY172360A (en) 2019-11-21
EP2883245A2 (de) 2015-06-17
BR112015002759A2 (pt) 2017-07-04
IN2015MN00491A (enExample) 2015-09-04
US20150208508A1 (en) 2015-07-23
JP2015532780A (ja) 2015-11-12
CN104737286A (zh) 2015-06-24
WO2014023287A3 (de) 2014-04-03
BR112015002759B1 (pt) 2021-11-03
US10292270B2 (en) 2019-05-14
EP2883245B1 (de) 2020-09-30
WO2014023287A2 (de) 2014-02-13

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