MY172360A - Contact bump connection and contact bump and method for producing a contact bump connection - Google Patents

Contact bump connection and contact bump and method for producing a contact bump connection

Info

Publication number
MY172360A
MY172360A MYPI2015700401A MYPI2015700401A MY172360A MY 172360 A MY172360 A MY 172360A MY PI2015700401 A MYPI2015700401 A MY PI2015700401A MY PI2015700401 A MYPI2015700401 A MY PI2015700401A MY 172360 A MY172360 A MY 172360A
Authority
MY
Malaysia
Prior art keywords
contact
contact bump
terminal face
displacement
connection
Prior art date
Application number
MYPI2015700401A
Other languages
English (en)
Inventor
Carsten Nieland
Frank Kriebel
Original Assignee
Smartrac Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartrac Tech Gmbh filed Critical Smartrac Tech Gmbh
Publication of MY172360A publication Critical patent/MY172360A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/18—Printed circuits structurally associated with non-printed electric components
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
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    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
MYPI2015700401A 2012-08-10 2013-08-09 Contact bump connection and contact bump and method for producing a contact bump connection MY172360A (en)

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US5483741A (en) * 1993-09-03 1996-01-16 Micron Technology, Inc. Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice
JPH0870019A (ja) * 1994-08-30 1996-03-12 Casio Comput Co Ltd 電子部品の接続構造および接続方法
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
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JP2000114314A (ja) 1998-09-29 2000-04-21 Hitachi Ltd 半導体素子実装構造体およびその製造方法並びにｉｃカード
DE19905807A1 (de) * 1999-02-11 2000-08-31 Ksw Microtec Ges Fuer Angewand Verfahren zur Herstellung elektrisch leitender Verbindungen
JP2001148401A (ja) * 1999-11-18 2001-05-29 Seiko Epson Corp 半導体装置およびその製造方法
DE10157205A1 (de) 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
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JP2005197488A (ja) * 2004-01-08 2005-07-21 Sony Corp 突起電極及びボンディングキャピラリ並びに半導体チップ
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WO2014023287A2 (de) 2014-02-13
US20150208508A1 (en) 2015-07-23
EP2883245A2 (de) 2015-06-17
DE102013215771A1 (de) 2014-02-13
BR112015002759B1 (pt) 2021-11-03
JP2015532780A (ja) 2015-11-12
WO2014023287A3 (de) 2014-04-03
CN104737286B (zh) 2018-09-25
IN2015MN00491A (enExample) 2015-09-04
EP2883245B1 (de) 2020-09-30
BR112015002759A2 (pt) 2017-07-04
CN104737286A (zh) 2015-06-24
MX349946B (es) 2017-08-22
MX2015001754A (es) 2015-09-16
DE102013215771B4 (de) 2019-06-13
KR20150053902A (ko) 2015-05-19
CA2880408A1 (en) 2014-02-13
US10292270B2 (en) 2019-05-14
JP6347781B2 (ja) 2018-06-27

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