JP4889464B2 - 電子部品の実装方法 - Google Patents
電子部品の実装方法 Download PDFInfo
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- JP4889464B2 JP4889464B2 JP2006331245A JP2006331245A JP4889464B2 JP 4889464 B2 JP4889464 B2 JP 4889464B2 JP 2006331245 A JP2006331245 A JP 2006331245A JP 2006331245 A JP2006331245 A JP 2006331245A JP 4889464 B2 JP4889464 B2 JP 4889464B2
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Description
図15(b)に示すように基板1に電子部品としての半導体チップ2を実装する場合には、図15(a)に示すように、半導体チップ2の電極3上に金の突起電極4を形成する。突起電極4は引きちぎることによって先端が細く形成されている。基板1の上に形成された配線電極5は、その中央に形成されている凹部6の形状が入口よりも奥端が広く形成されている。そして、基板1の凹部6の中央に、突起電極4の先端が来るように基板1に対する半導体チップ2の位置を合わせる。そして、基板1に半導体チップ2を押圧することによって、突起電極4の先端は基板1の凹部6の底部に当接して変形して配線電極5に係合して実装が完了する。
また、本発明の電子部品の実装方法は、突起電極と前記突起電極が形成されている同じ面に位置し前記突起電極より高さが高い位置合わせ突起が形成された電子部品を、前記突起電極と接続される配線電極を有する基板に実装するに際し、前記基板の前記配線電極が形成された面に内周面が底部に向かって狭くなるよう傾いた斜面を有する貫通孔が前記位置合わせ突起に対応して形成されており、前記突起電極と接続される前記配線電極を有する基板の前記配線電極とは反対側の面に前記貫通孔の開口部を閉塞するようにランド電極が形成されており、前記位置合わせ突起を前記貫通孔の前記斜面に当接させて前記貫通孔の底部中央にガイドして前記電子部品の前記突起電極を前記基板の配線電極に位置合わせして導通させ、前記位置合わせ突起とランド電極との導通から実装状態を判定することを特徴とする。
また、本発明の電子部品の実装方法は、突起電極と前記突起電極が形成されている同じ面に位置し前記突起電極より高さが高い位置合わせ突起が形成された電子部品を、前記突起電極と接続される配線電極を有する基板に実装するに際し、前記基板に内装された電極に底部が達するように前記位置合わせ突起の位置に対応して前記基板に内周面が底部に向かって狭くなるよう傾いた斜面を有する凹部が形成されており、前記位置合わせ突起を前記貫通孔の前記斜面に当接させて前記凹部の底部中央にガイドして前記位置合わせ突起の先端を前記基板に内装された前記電極に当接させて変形させて、前記電子部品の前記突起電極を前記基板の配線電極に位置合わせして導通させ、前記導通から実装状態を判定することを特徴とする。
また、加圧して前記電子部品を前記基板に仮実装して前記電子部品の前記突起電極を前記基板の配線電極に位置合わせし、仮実装した前記電子部品を加熱しながら押圧して前記電子部品と前記基板との間に介装された熱硬化性樹脂を前記電子部品の周辺に押し出しながら硬化させ、前記位置合わせ突起を変形させることを特徴とする。
(実施の形態1)
図1〜図4は本発明の実施の形態1を示す。
基板1に半導体チップ2をフリップチップ実装する工程は、図1(a)〜図1(e)の工程で実行する。
この実施の形態の凹部14は、図1(a)に示すように基板1の表面よりも窪ませて形成された平面形状が環状の凹部本体15と、この凹部本体15の内側と凹部本体15の周囲にわたって形成された電極16とで構成されている。凹部本体15は内周面が底部に向かって狭くなるように傾いた斜面17を有しており、この上に形成されている電極16の表面も斜面17に沿って傾いている。また、電極16の基板1の表面に形成されている部分の内周側の角18も凹部本体15の中心に向かって傾斜している。このような電極16は、配線電極13を形成する工程において形成されている。図4は基板1の要部を示しており、半導体チップ2の実装位置を仮想線で示している。
凹部14の大きさを、更に詳しく説明する。
D1 < D2
に形成することによって、半導体チップの基板実装時の位置ずれを防止することができる。
また、実装の完了状態における突起電極11の高さを揃えることができるので、半導体チップ2を基板1に押し付けて突起電極11を塑性変形させる時の実装荷重のばらつきを小さくすることができるので、再現性が良好である。
図5は本発明の実施の形態2を示す。
実施の形態1における凹部14は、凹部本体15とこの凹部本体15の内側と凹部本体15の周囲にわたって形成された電極16とで構成されていたが、図5では、電極16が存在していない。また図5では電極9,81,82に均一に突起電極11を形成した後に、電極81,82の上にだけ同じ突起電極11をもう一度ずつ打ち付けて位置合わせ突起12を形成した場合を示している。その他は実施の形態1と同じである。
図6は本発明の実施の形態3を示す。
実施の形態1における凹部14は、凹部本体15とこの凹部本体15の内側と凹部本体15の周囲にわたって形成された電極16とで構成されていたが、図6では、電極16aが凹部本体15の底部に設けられており、凹部本体15の斜面17と凹部本体15の周囲には電極16が存在していない。また図6では電極9,81,82に均一に突起電極11を形成した後に、電極81,82の上にだけ同じ突起電極11をもう一度ずつ打ち付けて位置合わせ突起12を形成した場合を示している。その他は実施の形態1と同じである。
この構成によると、位置合わせ突起12を凹部本体15の底部に設けられ電極16aによって安定に変形させるこができ、半導体チップ2の突起電極11を基板1の配線電極13に位置ずれなく接続できる。
図7は本発明の実施の形態4を示す。
実施の形態1における凹部14は、凹部本体15と電極16とで構成されており、凹部本体15の内側と凹部本体15の周囲にわたって形成された電極16は、基板1に配線電極13を形成する工程で作成したが、図7では、実施の形態3の図6のように内装電極からなる電極16aが底部に設けられた凹部本体15を有する基板1を作成し、基板1の表面に配線電極13を形成する工程で、凹部本体15の斜面17と凹部本体15の周囲にわたる電極16bを形成して、電極16aと電極16bとを導通させて構成している。また図7では電極9,81,82に均一に突起電極11を形成した後に、電極81,82の上にだけ同じ突起電極11をもう一度ずつ打ち付けて位置合わせ突起12を形成した場合を示している。その他は実施の形態1と同じである。
(実施の形態5)
図8は本発明の実施の形態5を示す。
(実施の形態6)
図9は本発明の実施の形態6を示す。
図10は本発明の実施の形態7を示す。
図9に示す実施の形態6では凹部本体15aの内周面に電極が形成されていなかったが、この実施の形態7では図10に示すように、貫通した凹部本体15aがランド電極22によって閉塞された基板1を作成し、基板1の表面に配線電極13を形成する工程で、凹部本体15の斜面17と凹部本体15の周囲にわたる電極16bを形成して、ランド電極22と電極16bとを導通させて構成している点だけが異なっている。
図11は本発明の実施の形態8を示す。
実施の形態5を示す図8では、突起電極11と同じ大きさのバンプを重ね打ちして位置合わせ突起12を構成していたが、図11では突起電極11よりも台座径の大きなバンプを1度打ちによって形成している。基板1には大きなシングルの位置合わせ突起12に応じた径の凹部本体15が凹部14として形成されている。
その他は実施の形態5と同じである。
(実施の形態9)
図12と図13は本発明の実施の形態9を示す。
図14は本発明の実施の形態10を示す。
図14(a)は基板1の要部の平面図、図14(b)は図14(a)のB−BB線に沿った断面図である。
2 半導体チップ(電子部品)
7 電極群
81,82,9 電極
11 突起電極
12 位置合わせ突起
13 配線電極
14 凹部
15 凹部本体
16,16a,16b 電極
17 斜面
18 電極16の内周側の角
19 熱硬化性エポキシ樹脂
21 台座
22 ランド電極
23a,23b ガイド片
24 ガイド片23a,23bの内側の斜面
Claims (4)
- 突起電極と前記突起電極が形成されている同じ面に位置し前記突起電極より高さが高い位置合わせ突起が形成された電子部品を、前記突起電極と接続される配線電極を有する基板に実装するに際し、
前記基板の前記配線電極が形成された面に内周面が底部に向かって狭くなるよう傾いた斜面を有する貫通孔が前記位置合わせ突起に対応して形成されており、
前記位置合わせ突起を前記貫通孔の前記斜面に当接させて前記貫通孔の底部中央にガイドして前記電子部品の前記突起電極を前記基板の配線電極に位置合わせして、前記位置合わせ突起を変形させ、
前記貫通孔からの前記位置合わせ突起の先端の露出状態で実装状態を判定する
電子部品の実装方法。 - 突起電極と前記突起電極が形成されている同じ面に位置し前記突起電極より高さが高い位置合わせ突起が形成された電子部品を、前記突起電極と接続される配線電極を有する基板に実装するに際し、
前記基板の前記配線電極が形成された面に内周面が底部に向かって狭くなるよう傾いた斜面を有する貫通孔が前記位置合わせ突起に対応して形成されており、前記突起電極と接続される前記配線電極を有する基板の前記配線電極とは反対側の面に前記貫通孔の開口部を閉塞するようにランド電極が形成されており、
前記位置合わせ突起を前記貫通孔の前記斜面に当接させて前記貫通孔の底部中央にガイドして前記電子部品の前記突起電極を前記基板の配線電極に位置合わせして導通させ、
前記位置合わせ突起とランド電極との導通から実装状態を判定する
電子部品の実装方法。 - 突起電極と前記突起電極が形成されている同じ面に位置し前記突起電極より高さが高い位置合わせ突起が形成された電子部品を、前記突起電極と接続される配線電極を有する基板に実装するに際し、
前記基板に内装された電極に底部が達するように前記位置合わせ突起の位置に対応して前記基板に内周面が底部に向かって狭くなるよう傾いた斜面を有する凹部が形成されており、
前記位置合わせ突起を前記貫通孔の前記斜面に当接させて前記凹部の底部中央にガイドして前記位置合わせ突起の先端を前記基板に内装された前記電極に当接させて変形させて、前記電子部品の前記突起電極を前記基板の配線電極に位置合わせして導通させ、前記導通から実装状態を判定する
電子部品の実装方法。 - 加圧して前記電子部品を前記基板に仮実装して前記電子部品の前記突起電極を前記基板の配線電極に位置合わせし、
仮実装した前記電子部品を加熱しながら押圧して前記電子部品と前記基板との間に介装された熱硬化性樹脂を前記電子部品の周辺に押し出しながら硬化させ、前記位置合わせ突起を変形させる
請求項1〜請求項3の何れかに記載の電子部品の実装方法。
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