KR20140024953A - 기판제조장치 및 기판제조방법 - Google Patents

기판제조장치 및 기판제조방법 Download PDF

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Publication number
KR20140024953A
KR20140024953A KR1020147000800A KR20147000800A KR20140024953A KR 20140024953 A KR20140024953 A KR 20140024953A KR 1020147000800 A KR1020147000800 A KR 1020147000800A KR 20147000800 A KR20147000800 A KR 20147000800A KR 20140024953 A KR20140024953 A KR 20140024953A
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KR
South Korea
Prior art keywords
substrate
station
thin film
board
coating
Prior art date
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KR1020147000800A
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English (en)
Korean (ko)
Inventor
야스히토 나카모리
케이지 이소
유지 오카모토
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
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Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20140024953A publication Critical patent/KR20140024953A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1563—Reversing the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
KR1020147000800A 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법 KR20140024953A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2011-164874 2011-07-27
JP2011164874 2011-07-27
JPJP-P-2011-175170 2011-08-10
JP2011175170 2011-08-10
PCT/JP2012/068118 WO2013015157A1 (ja) 2011-07-27 2012-07-17 基板製造装置及び基板製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020167009136A Division KR20160044587A (ko) 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법

Publications (1)

Publication Number Publication Date
KR20140024953A true KR20140024953A (ko) 2014-03-03

Family

ID=47601007

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020147000800A KR20140024953A (ko) 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법
KR1020167009136A KR20160044587A (ko) 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법
KR1020187008021A KR102061315B1 (ko) 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020167009136A KR20160044587A (ko) 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법
KR1020187008021A KR102061315B1 (ko) 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법

Country Status (5)

Country Link
JP (1) JP5714110B2 (zh)
KR (3) KR20140024953A (zh)
CN (2) CN110099513B (zh)
TW (1) TWI458408B (zh)
WO (1) WO2013015157A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180012710A (ko) * 2016-07-27 2018-02-06 스미도모쥬기가이고교 가부시키가이샤 위치검출장치 및 위치검출방법
KR101954917B1 (ko) * 2018-09-12 2019-03-06 (주)에이피텍 카메라 모듈 제작용 양면 트레이를 이용한 카메라 모듈 양면 디스펜싱 시스템

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6112898B2 (ja) * 2013-02-20 2017-04-12 住友重機械工業株式会社 基板製造装置
JP6247950B2 (ja) * 2014-02-12 2017-12-13 矢崎総業株式会社 プライマ塗布方法及びプライマ塗布装置
CN105499069B (zh) * 2014-10-10 2019-03-08 住友重机械工业株式会社 膜形成装置及膜形成方法
JP6605876B2 (ja) * 2015-08-11 2019-11-13 東京応化工業株式会社 レジストパターン形成装置およびレジストパターン形成方法
CN105188277B (zh) * 2015-09-21 2017-12-08 迅得机械（东莞）有限公司 一种板件自动翻转插框装置
WO2017057374A1 (ja) * 2015-09-30 2017-04-06 住友金属鉱山株式会社 有機被膜の製造方法、導電性基板の製造方法、有機被膜製造装置
JP6652426B2 (ja) * 2016-03-29 2020-02-26 東レエンジニアリング株式会社 連続塗布装置及び連続塗布方法
CN106067436A (zh) * 2016-08-01 2016-11-02 江苏宇天港玻新材料有限公司 一种基于同步带传送的基片材料输送装置
KR102205125B1 (ko) * 2019-09-17 2021-01-19 연세대학교 산학협력단 베젤리스 표시 장치의 배선 인쇄 장치 및 표시 장치
US11878532B2 (en) 2021-05-11 2024-01-23 Applied Materials, Inc. Inkjet platform for fabrication of optical films and structures

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DE3824230A1 (de) * 1988-07-16 1990-01-25 Spiess Gmbh G Vorrichtung zum transport von werkstuecken
JP2001506804A (ja) * 1996-12-16 2001-05-22 バンティコ アクチエンゲゼルシャフト 基板の塗布のための方法および装置
CN1240567A (zh) * 1996-12-16 2000-01-05 希巴特殊化学控股公司 用于向板涂料的方法和装置
JPH11340606A (ja) * 1998-03-27 1999-12-10 Kansai Paint Co Ltd レジスト層の形成方法及びプリント配線基板の製造方法
JP2001185833A (ja) * 1999-12-27 2001-07-06 Ibiden Co Ltd 多層プリント配線板の製造方法及び製造装置
JP4386430B2 (ja) * 2004-04-07 2009-12-16 東京エレクトロン株式会社 塗布膜形成装置
JPWO2006011548A1 (ja) * 2004-07-30 2008-05-01 日立化成工業株式会社 感光性フィルム、感光性フィルム積層体及び感光性フィルムロール
ITMI20061960A1 (it) * 2006-10-13 2008-04-14 Cedal Equipment Srl Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato
KR100872565B1 (ko) * 2006-10-25 2008-12-08 삼성전기주식회사 인쇄회로기판 제조방법
EP2073620A1 (de) * 2007-12-18 2009-06-24 Siemens Aktiengesellschaft Substrat-Transportvorrichtung für einen Bestückautomaten
JP5096972B2 (ja) * 2008-03-19 2012-12-12 株式会社ミマキエンジニアリング インクジェットプリンタ、印刷ユニットおよびその印刷方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180012710A (ko) * 2016-07-27 2018-02-06 스미도모쥬기가이고교 가부시키가이샤 위치검출장치 및 위치검출방법
KR101954917B1 (ko) * 2018-09-12 2019-03-06 (주)에이피텍 카메라 모듈 제작용 양면 트레이를 이용한 카메라 모듈 양면 디스펜싱 시스템

Also Published As

Publication number Publication date
TWI458408B (zh) 2014-10-21
KR20160044587A (ko) 2016-04-25
JPWO2013015157A1 (ja) 2015-02-23
KR102061315B1 (ko) 2019-12-31
CN110099513A (zh) 2019-08-06
WO2013015157A1 (ja) 2013-01-31
TW201322853A (zh) 2013-06-01
JP5714110B2 (ja) 2015-05-07
CN103718661A (zh) 2014-04-09
CN110099513B (zh) 2022-02-18
KR20180033598A (ko) 2018-04-03

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