KR20130139172A - 기판검사치구 및 기판검사장치 - Google Patents

기판검사치구 및 기판검사장치 Download PDF

Info

Publication number
KR20130139172A
KR20130139172A KR1020130065604A KR20130065604A KR20130139172A KR 20130139172 A KR20130139172 A KR 20130139172A KR 1020130065604 A KR1020130065604 A KR 1020130065604A KR 20130065604 A KR20130065604 A KR 20130065604A KR 20130139172 A KR20130139172 A KR 20130139172A
Authority
KR
South Korea
Prior art keywords
substrate
unit
substrate inspection
probe
continuous
Prior art date
Application number
KR1020130065604A
Other languages
English (en)
Korean (ko)
Inventor
야스히토 구리하라
Original Assignee
니혼덴산리드가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니혼덴산리드가부시키가이샤 filed Critical 니혼덴산리드가부시키가이샤
Publication of KR20130139172A publication Critical patent/KR20130139172A/ko

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0046—Arrangements for measuring currents or voltages or for indicating presence or sign thereof characterised by a specific application or detail not covered by any other subgroup of G01R19/00
    • G01R19/0069—Arrangements for measuring currents or voltages or for indicating presence or sign thereof characterised by a specific application or detail not covered by any other subgroup of G01R19/00 measuring voltage or current standards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020130065604A 2012-06-12 2013-06-10 기판검사치구 및 기판검사장치 KR20130139172A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-132560 2012-06-12
JP2012132560A JP2013257195A (ja) 2012-06-12 2012-06-12 基板検査治具及び基板検査装置

Publications (1)

Publication Number Publication Date
KR20130139172A true KR20130139172A (ko) 2013-12-20

Family

ID=49827989

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130065604A KR20130139172A (ko) 2012-06-12 2013-06-10 기판검사치구 및 기판검사장치

Country Status (4)

Country Link
JP (1) JP2013257195A (zh)
KR (1) KR20130139172A (zh)
CN (1) CN103487608A (zh)
TW (1) TW201403088A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6642443B2 (ja) * 2014-10-29 2020-02-05 日本電産リード株式会社 基板検査装置、及び基板検査方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3441596B2 (ja) * 1995-04-28 2003-09-02 三菱電機株式会社 絶縁劣化診断装置
JPH09142068A (ja) * 1995-11-27 1997-06-03 Toshiba Corp 電子回路モジュールの製造方法およびカード型電子装置の製造方法
JPH10150145A (ja) * 1996-11-18 1998-06-02 Ngk Spark Plug Co Ltd 多層基板、多層基板の通電検査方法及びワークシート
JP3362638B2 (ja) * 1997-07-08 2003-01-07 株式会社村田製作所 アレー型コンデンサの絶縁抵抗測定方法および装置
JP4574222B2 (ja) * 2004-05-06 2010-11-04 日本電産リード株式会社 基板検査用接触子、これを用いた基板検査用治具及び基板検査装置
JP4041831B2 (ja) * 2006-05-15 2008-02-06 日本電産リード株式会社 基板検査用治具及びこの治具における接続電極部の電極構造
JP2008002823A (ja) * 2006-06-20 2008-01-10 Nidec-Read Corp 基板検査装置及び基板検査方法
CN100562450C (zh) * 2006-11-28 2009-11-25 燕山大学 无绝缘轨道电路补偿电容在线主动测量装置
JP2009108719A (ja) * 2007-10-29 2009-05-21 Denso Corp 回路装置
CN101285867B (zh) * 2008-06-11 2010-09-29 重庆大学 电气绝缘电热老化试验设备
JP5496620B2 (ja) * 2009-11-25 2014-05-21 日置電機株式会社 絶縁検査装置および絶縁検査方法
JP5764897B2 (ja) * 2010-09-29 2015-08-19 凸版印刷株式会社 半導体パッケージ基板の検査方法

Also Published As

Publication number Publication date
JP2013257195A (ja) 2013-12-26
CN103487608A (zh) 2014-01-01
TW201403088A (zh) 2014-01-16

Similar Documents

Publication Publication Date Title
JP5953135B2 (ja) 抵抗測定装置および回路基板検査装置
KR20090027610A (ko) 기판 검사 장치 및 기판 검사 방법
KR20130096183A (ko) 기판 내장 전자부품의 단자판별방법 및 단자판별장치
US9874594B2 (en) Circuit board inspecting apparatus and circuit board inspecting method
TWI403734B (zh) 基板檢驗方法
JP2015049100A (ja) 測定装置および測定方法
TW201447334A (zh) 基板檢測裝置、基板檢測方法及基板檢測用夾具
JP2016090495A (ja) 耐電圧試験装置、絶縁抵抗試験装置、及び接続状態確認回路
KR102020258B1 (ko) 부품내장기판의 검사방법
CN109997046B (zh) 电阻测量装置及电阻测量方法
KR20130139172A (ko) 기판검사치구 및 기판검사장치
KR101354031B1 (ko) 임피던스 측정장치
JP2002048833A (ja) 回路基板検査装置
CN110794290B (zh) 基板检测装置及基板检测方法
KR101663920B1 (ko) 기판 검사 방법 및 기판 검사용 지그
KR101471802B1 (ko) 검사 지그의 검사 방법
JP5146109B2 (ja) 検査装置
JP5849923B2 (ja) インピーダンス測定装置
JP5966688B2 (ja) 配線構造及び基板検査装置
JP6255833B2 (ja) 基板検査方法及び基板検査装置
KR101287119B1 (ko) 이어잭 어셈블리의 기능검사방법 및 장치
KR20230089427A (ko) 절연 검사 장치 및 절연 검사 방법
JP2014092541A (ja) 非接触式電気検査装置及び電気検査方法
JP2006113009A (ja) 回路基板検査装置
JP2000206170A (ja) 回路基板検査装置

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination