KR20130128403A - 세라믹 다층 소자 및 세라믹 다층 소자의 제조 방법 - Google Patents

세라믹 다층 소자 및 세라믹 다층 소자의 제조 방법 Download PDF

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Publication number
KR20130128403A
KR20130128403A KR1020137013152A KR20137013152A KR20130128403A KR 20130128403 A KR20130128403 A KR 20130128403A KR 1020137013152 A KR1020137013152 A KR 1020137013152A KR 20137013152 A KR20137013152 A KR 20137013152A KR 20130128403 A KR20130128403 A KR 20130128403A
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KR
South Korea
Prior art keywords
ceramic
electrode
internal electrode
layer
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020137013152A
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English (en)
Korean (ko)
Inventor
게랄드 클로이베르
게르하르드 비스프링호프
크리스티앙 헤쎄
Original Assignee
에프코스 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에프코스 아게 filed Critical 에프코스 아게
Publication of KR20130128403A publication Critical patent/KR20130128403A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020137013152A 2010-11-03 2011-10-27 세라믹 다층 소자 및 세라믹 다층 소자의 제조 방법 Ceased KR20130128403A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010050370 2010-11-03
DE102010050370.3 2010-11-03
PCT/EP2011/068891 WO2012059401A2 (de) 2010-11-03 2011-10-27 Keramisches vielschichtbauelement und verfahren zur herstellung eines keramischen vielschichtbauelements

Publications (1)

Publication Number Publication Date
KR20130128403A true KR20130128403A (ko) 2013-11-26

Family

ID=44903225

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137013152A Ceased KR20130128403A (ko) 2010-11-03 2011-10-27 세라믹 다층 소자 및 세라믹 다층 소자의 제조 방법

Country Status (6)

Country Link
US (1) US20130300533A1 (enExample)
EP (1) EP2636047A2 (enExample)
JP (1) JP2013541852A (enExample)
KR (1) KR20130128403A (enExample)
CN (1) CN103180915A (enExample)
WO (1) WO2012059401A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE538681C2 (sv) 2014-04-02 2016-10-18 Fidesmo Ab Koppling av betalning till säker nedladdning av applikationsdata
DE102016101246A1 (de) * 2015-11-02 2017-05-04 Epcos Ag Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung
DE102015225584A1 (de) * 2015-12-17 2017-06-22 Robert Bosch Gmbh Startvorrichtung für eine Brennkraftmaschine
KR102603598B1 (ko) * 2016-11-30 2023-11-21 엘지디스플레이 주식회사 표시장치
CN112420297B (zh) * 2020-10-16 2022-04-15 深圳顺络电子股份有限公司 压敏电阻

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006521691A (ja) * 2003-03-27 2006-09-21 エプコス　アクチエンゲゼルシャフト 電気的多層構成素子
JP2009513006A (ja) * 2005-10-20 2009-03-26 エプコス アクチエンゲゼルシャフト 電気モジュール

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0189087B1 (de) * 1985-01-17 1988-06-22 Siemens Aktiengesellschaft Spannungsabhängiger elektrischer Widerstand (Varistor)
JP2633838B2 (ja) * 1986-09-20 1997-07-23 株式会社村田製作所 高温サーミスタ
US5075665A (en) * 1988-09-08 1991-12-24 Murata Manufacturing Co., Ltd. Laminated varistor
JPH08316012A (ja) * 1995-05-17 1996-11-29 Soshin Denki Kk チップ型電子部品の製造方法
US6236302B1 (en) * 1998-03-05 2001-05-22 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
JP3489728B2 (ja) * 1999-10-18 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板および高周波回路
US6327134B1 (en) * 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
US7215236B2 (en) * 2000-04-25 2007-05-08 Epcos Ag Electric component, method for the production thereof and use of the same
US6686827B2 (en) * 2001-03-28 2004-02-03 Protectronics Technology Corporation Surface mountable laminated circuit protection device and method of making the same
JP4461641B2 (ja) * 2001-05-30 2010-05-12 三菱マテリアル株式会社 積層型チップサーミスタ及びその製造方法
TW539229U (en) * 2002-06-06 2003-06-21 Protectronics Technology Corp Surface mountable laminated thermistor device
CN100478304C (zh) * 2003-01-29 2009-04-15 Tdk株式会社 生片材用涂料、生片材及其和电子部件的制造方法
TWI265534B (en) * 2003-12-31 2006-11-01 Polytronics Technology Corp Over-current protection apparatus
US20060182939A1 (en) * 2005-02-11 2006-08-17 Motorola, Inc. Method and arrangement forming a solder mask on a ceramic module
US7095602B1 (en) * 2005-06-29 2006-08-22 Murata Manufacturing Co., Ltd. Ceramic structure and nonreciprocal circuit device
JP4355010B2 (ja) * 2006-10-04 2009-10-28 昭栄化学工業株式会社 積層電子部品用導体ペースト
JP4224109B2 (ja) * 2007-03-02 2009-02-12 コーア株式会社 積層体およびその製造方法
JP5347553B2 (ja) * 2009-02-20 2013-11-20 Ｔｄｋ株式会社 サーミスタ素子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006521691A (ja) * 2003-03-27 2006-09-21 エプコス　アクチエンゲゼルシャフト 電気的多層構成素子
JP2009513006A (ja) * 2005-10-20 2009-03-26 エプコス アクチエンゲゼルシャフト 電気モジュール

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
일본 공표특허공보 특표2009-513006호(2009.03.26.) 1부. *

Also Published As

Publication number Publication date
WO2012059401A3 (de) 2012-08-30
WO2012059401A2 (de) 2012-05-10
US20130300533A1 (en) 2013-11-14
CN103180915A (zh) 2013-06-26
EP2636047A2 (de) 2013-09-11
JP2013541852A (ja) 2013-11-14

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Patent event date: 20130523

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