JP2013541852A - 積層セラミック部品及び積層セラミック部品の製造方法 - Google Patents

積層セラミック部品及び積層セラミック部品の製造方法 Download PDF

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Publication number
JP2013541852A
JP2013541852A JP2013537075A JP2013537075A JP2013541852A JP 2013541852 A JP2013541852 A JP 2013541852A JP 2013537075 A JP2013537075 A JP 2013537075A JP 2013537075 A JP2013537075 A JP 2013537075A JP 2013541852 A JP2013541852 A JP 2013541852A
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JP
Japan
Prior art keywords
multilayer ceramic
ceramic component
ceramic
internal electrode
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013537075A
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English (en)
Japanese (ja)
Other versions
JP2013541852A5 (enExample
Inventor
クロイバー ジェラルド
ヴィスプリンゴフ ゲルハルト
ヘッセ クリスチャン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of JP2013541852A publication Critical patent/JP2013541852A/ja
Publication of JP2013541852A5 publication Critical patent/JP2013541852A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed with two or more layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed with two or more layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP2013537075A 2010-11-03 2011-10-27 積層セラミック部品及び積層セラミック部品の製造方法 Pending JP2013541852A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010050370 2010-11-03
DE102010050370.3 2010-11-03
PCT/EP2011/068891 WO2012059401A2 (de) 2010-11-03 2011-10-27 Keramisches vielschichtbauelement und verfahren zur herstellung eines keramischen vielschichtbauelements

Publications (2)

Publication Number Publication Date
JP2013541852A true JP2013541852A (ja) 2013-11-14
JP2013541852A5 JP2013541852A5 (enExample) 2014-05-08

Family

ID=44903225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013537075A Pending JP2013541852A (ja) 2010-11-03 2011-10-27 積層セラミック部品及び積層セラミック部品の製造方法

Country Status (6)

Country Link
US (1) US20130300533A1 (enExample)
EP (1) EP2636047A2 (enExample)
JP (1) JP2013541852A (enExample)
KR (1) KR20130128403A (enExample)
CN (1) CN103180915A (enExample)
WO (1) WO2012059401A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE538681C2 (sv) 2014-04-02 2016-10-18 Fidesmo Ab Koppling av betalning till säker nedladdning av applikationsdata
DE102016101247A1 (de) * 2015-11-02 2017-05-04 Epcos Ag Sensorelement und Verfahren zur Herstellung eines Sensorelements
DE102015225584A1 (de) * 2015-12-17 2017-06-22 Robert Bosch Gmbh Startvorrichtung für eine Brennkraftmaschine
KR102603598B1 (ko) * 2016-11-30 2023-11-21 엘지디스플레이 주식회사 표시장치
CN112420297B (zh) * 2020-10-16 2022-04-15 深圳顺络电子股份有限公司 压敏电阻

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6378503A (ja) * 1986-09-20 1988-04-08 株式会社村田製作所 高温サ−ミスタ
JPH08316012A (ja) * 1995-05-17 1996-11-29 Soshin Denki Kk チップ型電子部品の製造方法
JP2001118746A (ja) * 1999-10-18 2001-04-27 Murata Mfg Co Ltd 積層コンデンサ、配線基板および高周波回路
JP2002359102A (ja) * 2001-05-30 2002-12-13 Mitsubishi Materials Corp 積層型チップサーミスタ及びその製造方法
JP2006521691A (ja) * 2003-03-27 2006-09-21 エプコス　アクチエンゲゼルシャフト 電気的多層構成素子
JP2009513006A (ja) * 2005-10-20 2009-03-26 エプコス アクチエンゲゼルシャフト 電気モジュール

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3660342D1 (en) * 1985-01-17 1988-07-28 Siemens Ag Voltage-dependent electric resistance (varistor)
US5075665A (en) * 1988-09-08 1991-12-24 Murata Manufacturing Co., Ltd. Laminated varistor
US6236302B1 (en) * 1998-03-05 2001-05-22 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
US6327134B1 (en) * 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
JP2003532284A (ja) * 2000-04-25 2003-10-28 エプコス アクチエンゲゼルシャフト 電気的構造素子、その製造法および該構造素子の使用
US6686827B2 (en) * 2001-03-28 2004-02-03 Protectronics Technology Corporation Surface mountable laminated circuit protection device and method of making the same
TW539229U (en) * 2002-06-06 2003-06-21 Protectronics Technology Corp Surface mountable laminated thermistor device
EP1593660A4 (en) * 2003-01-29 2009-01-21 Tdk Corp COATING COMPOSITION FOR GREEN FILM, MANUFACTURING METHOD, GREEN FILM, METHOD OF MANUFACTURING THEREOF, ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
TWI265534B (en) * 2003-12-31 2006-11-01 Polytronics Technology Corp Over-current protection apparatus
US20060182939A1 (en) * 2005-02-11 2006-08-17 Motorola, Inc. Method and arrangement forming a solder mask on a ceramic module
US7095602B1 (en) * 2005-06-29 2006-08-22 Murata Manufacturing Co., Ltd. Ceramic structure and nonreciprocal circuit device
JP4355010B2 (ja) * 2006-10-04 2009-10-28 昭栄化学工業株式会社 積層電子部品用導体ペースト
JP4224109B2 (ja) * 2007-03-02 2009-02-12 コーア株式会社 積層体およびその製造方法
JP5347553B2 (ja) * 2009-02-20 2013-11-20 Ｔｄｋ株式会社 サーミスタ素子

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6378503A (ja) * 1986-09-20 1988-04-08 株式会社村田製作所 高温サ−ミスタ
JPH08316012A (ja) * 1995-05-17 1996-11-29 Soshin Denki Kk チップ型電子部品の製造方法
JP2001118746A (ja) * 1999-10-18 2001-04-27 Murata Mfg Co Ltd 積層コンデンサ、配線基板および高周波回路
JP2002359102A (ja) * 2001-05-30 2002-12-13 Mitsubishi Materials Corp 積層型チップサーミスタ及びその製造方法
JP2006521691A (ja) * 2003-03-27 2006-09-21 エプコス　アクチエンゲゼルシャフト 電気的多層構成素子
JP2009513006A (ja) * 2005-10-20 2009-03-26 エプコス アクチエンゲゼルシャフト 電気モジュール

Also Published As

Publication number Publication date
US20130300533A1 (en) 2013-11-14
CN103180915A (zh) 2013-06-26
WO2012059401A2 (de) 2012-05-10
WO2012059401A3 (de) 2012-08-30
KR20130128403A (ko) 2013-11-26
EP2636047A2 (de) 2013-09-11

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