JP2013541852A5 - - Google Patents

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Publication number
JP2013541852A5
JP2013541852A5 JP2013537075A JP2013537075A JP2013541852A5 JP 2013541852 A5 JP2013541852 A5 JP 2013541852A5 JP 2013537075 A JP2013537075 A JP 2013537075A JP 2013537075 A JP2013537075 A JP 2013537075A JP 2013541852 A5 JP2013541852 A5 JP 2013541852A5
Authority
JP
Japan
Prior art keywords
multilayer ceramic
internal electrode
electrode
multilayer
ceramic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013537075A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013541852A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2011/068891 external-priority patent/WO2012059401A2/de
Publication of JP2013541852A publication Critical patent/JP2013541852A/ja
Publication of JP2013541852A5 publication Critical patent/JP2013541852A5/ja
Pending legal-status Critical Current

Links

JP2013537075A 2010-11-03 2011-10-27 積層セラミック部品及び積層セラミック部品の製造方法 Pending JP2013541852A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010050370 2010-11-03
DE102010050370.3 2010-11-03
PCT/EP2011/068891 WO2012059401A2 (de) 2010-11-03 2011-10-27 Keramisches vielschichtbauelement und verfahren zur herstellung eines keramischen vielschichtbauelements

Publications (2)

Publication Number Publication Date
JP2013541852A JP2013541852A (ja) 2013-11-14
JP2013541852A5 true JP2013541852A5 (enExample) 2014-05-08

Family

ID=44903225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013537075A Pending JP2013541852A (ja) 2010-11-03 2011-10-27 積層セラミック部品及び積層セラミック部品の製造方法

Country Status (6)

Country Link
US (1) US20130300533A1 (enExample)
EP (1) EP2636047A2 (enExample)
JP (1) JP2013541852A (enExample)
KR (1) KR20130128403A (enExample)
CN (1) CN103180915A (enExample)
WO (1) WO2012059401A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE538681C2 (sv) 2014-04-02 2016-10-18 Fidesmo Ab Koppling av betalning till säker nedladdning av applikationsdata
DE102016101246A1 (de) * 2015-11-02 2017-05-04 Epcos Ag Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung
DE102015225584A1 (de) * 2015-12-17 2017-06-22 Robert Bosch Gmbh Startvorrichtung für eine Brennkraftmaschine
KR102603598B1 (ko) * 2016-11-30 2023-11-21 엘지디스플레이 주식회사 표시장치
CN112420297B (zh) * 2020-10-16 2022-04-15 深圳顺络电子股份有限公司 压敏电阻

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0189087B1 (de) * 1985-01-17 1988-06-22 Siemens Aktiengesellschaft Spannungsabhängiger elektrischer Widerstand (Varistor)
JP2633838B2 (ja) * 1986-09-20 1997-07-23 株式会社村田製作所 高温サーミスタ
US5075665A (en) * 1988-09-08 1991-12-24 Murata Manufacturing Co., Ltd. Laminated varistor
JPH08316012A (ja) * 1995-05-17 1996-11-29 Soshin Denki Kk チップ型電子部品の製造方法
US6236302B1 (en) * 1998-03-05 2001-05-22 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
JP3489728B2 (ja) * 1999-10-18 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板および高周波回路
US6327134B1 (en) * 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
US7215236B2 (en) * 2000-04-25 2007-05-08 Epcos Ag Electric component, method for the production thereof and use of the same
US6686827B2 (en) * 2001-03-28 2004-02-03 Protectronics Technology Corporation Surface mountable laminated circuit protection device and method of making the same
JP4461641B2 (ja) * 2001-05-30 2010-05-12 三菱マテリアル株式会社 積層型チップサーミスタ及びその製造方法
TW539229U (en) * 2002-06-06 2003-06-21 Protectronics Technology Corp Surface mountable laminated thermistor device
CN100478304C (zh) * 2003-01-29 2009-04-15 Tdk株式会社 生片材用涂料、生片材及其和电子部件的制造方法
DE10313891A1 (de) * 2003-03-27 2004-10-14 Epcos Ag Elektrisches Vielschichtbauelement
TWI265534B (en) * 2003-12-31 2006-11-01 Polytronics Technology Corp Over-current protection apparatus
US20060182939A1 (en) * 2005-02-11 2006-08-17 Motorola, Inc. Method and arrangement forming a solder mask on a ceramic module
US7095602B1 (en) * 2005-06-29 2006-08-22 Murata Manufacturing Co., Ltd. Ceramic structure and nonreciprocal circuit device
DE102005050638B4 (de) * 2005-10-20 2020-07-16 Tdk Electronics Ag Elektrisches Bauelement
JP4355010B2 (ja) * 2006-10-04 2009-10-28 昭栄化学工業株式会社 積層電子部品用導体ペースト
JP4224109B2 (ja) * 2007-03-02 2009-02-12 コーア株式会社 積層体およびその製造方法
JP5347553B2 (ja) * 2009-02-20 2013-11-20 Ｔｄｋ株式会社 サーミスタ素子

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