KR20130041746A - 에칭액조성물 및 에칭 방법 - Google Patents

에칭액조성물 및 에칭 방법 Download PDF

Info

Publication number
KR20130041746A
KR20130041746A KR1020120114716A KR20120114716A KR20130041746A KR 20130041746 A KR20130041746 A KR 20130041746A KR 1020120114716 A KR1020120114716 A KR 1020120114716A KR 20120114716 A KR20120114716 A KR 20120114716A KR 20130041746 A KR20130041746 A KR 20130041746A
Authority
KR
South Korea
Prior art keywords
etching
copper
film
transparent conductive
copper alloy
Prior art date
Application number
KR1020120114716A
Other languages
English (en)
Korean (ko)
Inventor
타카오 야마구치
노리오 이시카와
Original Assignee
간또 가가꾸 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 간또 가가꾸 가부시끼가이샤 filed Critical 간또 가가꾸 가부시끼가이샤
Publication of KR20130041746A publication Critical patent/KR20130041746A/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Electric Cables (AREA)
KR1020120114716A 2011-10-17 2012-10-16 에칭액조성물 및 에칭 방법 KR20130041746A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011228237A JP5885993B2 (ja) 2011-10-17 2011-10-17 エッチング液組成物およびエッチング方法
JPJP-P-2011-228237 2011-10-17

Publications (1)

Publication Number Publication Date
KR20130041746A true KR20130041746A (ko) 2013-04-25

Family

ID=48058907

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120114716A KR20130041746A (ko) 2011-10-17 2012-10-16 에칭액조성물 및 에칭 방법

Country Status (4)

Country Link
JP (1) JP5885993B2 (ja)
KR (1) KR20130041746A (ja)
CN (1) CN103046050A (ja)
TW (1) TW201331417A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180066057A (ko) * 2015-10-16 2018-06-18 스미토모 긴조쿠 고잔 가부시키가이샤 적층체 기판, 적층체 기판 제조방법, 도전성 기판 및 도전성 기판 제조방법

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6417556B2 (ja) * 2014-03-28 2018-11-07 メック株式会社 配線形成方法及びエッチング液
CN103966604A (zh) * 2014-05-23 2014-08-06 湘能华磊光电股份有限公司 Led芯片的电极去除液及去除方法
JP6557575B2 (ja) 2015-10-23 2019-08-07 株式会社Adeka エッチング液組成物及びエッチング方法
CN105441947A (zh) * 2016-01-13 2016-03-30 深圳市信维通信股份有限公司 一种金属料带的蚀刻工艺
CN106283055A (zh) * 2016-08-31 2017-01-04 河源西普电子有限公司 一种印刷板的蚀刻方法
KR101776055B1 (ko) * 2016-12-21 2017-09-19 와이엠티 주식회사 터치패널용 식각조성물 및 터치패널의 식각방법
CN111448621B (zh) * 2018-01-11 2021-10-22 三菱制纸株式会社 导电材料及处理方法
CN108950570B (zh) * 2018-07-03 2020-03-10 山东大学 一种锂离子电池负极集流体用多孔铜箔的制备方法
CN108803946A (zh) * 2018-09-07 2018-11-13 蓝思科技（长沙）有限公司 一种柔性窄边框触控感应器及其制备方法
CN109307654A (zh) * 2018-11-05 2019-02-05 中国航发航空科技股份有限公司 一种快速检测焊接热影响区的方法
CN109161891A (zh) * 2018-11-22 2019-01-08 江苏永瀚特种合金技术有限公司 金属局部腐蚀用腐蚀剂及其腐蚀方法
CN110743551B (zh) * 2019-09-30 2021-04-23 中南大学 一种光催化合成氨多孔铜铁双金属催化剂及其应用
CN113388836B (zh) * 2021-07-26 2023-05-16 中国科学院宁波材料技术与工程研究所 一种化学蚀刻减薄FeNi合金箔带的方法
CN116540792B (zh) * 2023-06-25 2023-09-12 福建天甫电子材料有限公司 一种草酸系ito蚀刻液制备的流量自动化控制方法及系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1083762A (ja) * 1996-09-05 1998-03-31 Toshiba Corp シャドウマスクの洗浄装置、これを用いたシャドウマスクの製造方法及び製造装置
JPH11256368A (ja) * 1998-03-10 1999-09-21 Asahi Denka Kogyo Kk 薄銅箔用のエッチング液および薄銅箔のエッチング方法
US8307549B2 (en) * 2001-11-20 2012-11-13 Touchsensor Technologies, Llc Method of making an electrical circuit
TW200643224A (en) * 2005-06-09 2006-12-16 Basf Ag Copper etchant and method of etching copper
JP2008207235A (ja) * 2007-02-28 2008-09-11 Toyota Motor Corp ダイカスト鋳造装置およびダイカスト鋳造方法
JP5018581B2 (ja) * 2008-03-21 2012-09-05 東亞合成株式会社 エッチング液を用いた透明導電膜のエッチング方法
JP2009235438A (ja) * 2008-03-26 2009-10-15 Toagosei Co Ltd エッチング液、該エッチング液を用いたエッチング方法および被エッチング基板
CN101550341A (zh) * 2009-05-12 2009-10-07 西安宝莱特光电科技有限公司 Ito导电膜图形蚀刻的蚀刻液组合物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180066057A (ko) * 2015-10-16 2018-06-18 스미토모 긴조쿠 고잔 가부시키가이샤 적층체 기판, 적층체 기판 제조방법, 도전성 기판 및 도전성 기판 제조방법

Also Published As

Publication number Publication date
JP2013089731A (ja) 2013-05-13
JP5885993B2 (ja) 2016-03-16
CN103046050A (zh) 2013-04-17
TW201331417A (zh) 2013-08-01

Similar Documents

Publication Publication Date Title
KR20130041746A (ko) 에칭액조성물 및 에칭 방법
EP2579277B1 (en) Transparent conductive film
KR101358529B1 (ko) 전자부품용 적층 배선막 및 피복층 형성용 스퍼터링 타겟재
KR20130130515A (ko) 은함유 패턴의 식각액
US10963109B2 (en) Conductive structure and manufacturing method therefor
US10138541B2 (en) Method for producing substrate with transparent electrode, and substrate with transparent electrode
JP4949416B2 (ja) Ｉｔｏ膜用のエッチング液組成物、および、それを利用したｉｔｏ膜のエッチング方法
KR20110047308A (ko) 산화인듐주석 스퍼터링 타겟 및 이를 이용하여 제조되는 투명전도막
KR101600169B1 (ko) 전자 부품용 금속 박막 및 금속 박막 형성용 Mo 합금 스퍼터링 타깃재
KR101926274B1 (ko) 은 박막 식각액 조성물 및 이를 이용한 식각 방법 및 금속 패턴의 형성 방법
KR101884643B1 (ko) 아연이 도핑된 주석산화물계 투명 전도성 산화물, 이를 이용한 다층 투명 전도막 및 그 제조 방법
US7648783B2 (en) Cadmium tin oxide multi-layer laminate and producing method thereof
KR101597018B1 (ko) 금속 박막 및 금속 박막 형성용 Mo 합금 스퍼터링 타깃재
JP6361957B2 (ja) 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材
KR101350648B1 (ko) 전자부품용 적층 배선막 및 피복층 형성용 스퍼터링 타겟재
JP4567127B2 (ja) 透明導電積層体
KR20190057018A (ko) 은 박막 식각액 조성물 및 이를 이용한 식각 방법 및 금속 패턴의 형성 방법
KR100952425B1 (ko) 미세 패터닝 가능한 다층 투명 전도막
TW201411449A (zh) 透明電極基板、其製造方法及圖像顯示裝置
EP3272520A1 (en) Conductive structure and electronic device comprising same
JP2001001441A (ja) 透明導電積層体及びその製造方法
CN113990555B (zh) 触控传感器用ito导电薄膜及其制备方法和触控屏应用
KR102664354B1 (ko) 은 박막 식각액 조성물, 이를 이용한 식각 방법 및 금속 패턴의 형성 방법
KR101991047B1 (ko) 전도성 적층체, 이의 제조방법, 이를 포함하는 투명 전극 및 전자소자
JP2001291445A (ja) パターニングされた電極基板の製造方法

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination