KR20120066581A - 에칭제 및 이를 이용한 에칭방법 - Google Patents

에칭제 및 이를 이용한 에칭방법 Download PDF

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Publication number
KR20120066581A
KR20120066581A KR1020110118604A KR20110118604A KR20120066581A KR 20120066581 A KR20120066581 A KR 20120066581A KR 1020110118604 A KR1020110118604 A KR 1020110118604A KR 20110118604 A KR20110118604 A KR 20110118604A KR 20120066581 A KR20120066581 A KR 20120066581A
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KR
South Korea
Prior art keywords
copper
etching
metal oxide
etchant
layer
Prior art date
Application number
KR1020110118604A
Other languages
English (en)
Korean (ko)
Inventor
테루카즈 이시다
유카리 데구치
미나 사토
Original Assignee
멕크 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 멕크 가부시키가이샤 filed Critical 멕크 가부시키가이샤
Publication of KR20120066581A publication Critical patent/KR20120066581A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
KR1020110118604A 2010-12-14 2011-11-15 에칭제 및 이를 이용한 에칭방법 KR20120066581A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010278161A JP5219304B2 (ja) 2010-12-14 2010-12-14 エッチング剤及びこれを用いたエッチング方法
JPJP-P-2010-278161 2010-12-14

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020170004046A Division KR101823817B1 (ko) 2010-12-14 2017-01-11 에칭제 및 이를 이용한 에칭방법
KR1020170062078A Division KR101811553B1 (ko) 2010-12-14 2017-05-19 에칭제 및 이를 이용한 에칭방법

Publications (1)

Publication Number Publication Date
KR20120066581A true KR20120066581A (ko) 2012-06-22

Family

ID=46407051

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020110118604A KR20120066581A (ko) 2010-12-14 2011-11-15 에칭제 및 이를 이용한 에칭방법
KR1020170004046A KR101823817B1 (ko) 2010-12-14 2017-01-11 에칭제 및 이를 이용한 에칭방법
KR1020170062078A KR101811553B1 (ko) 2010-12-14 2017-05-19 에칭제 및 이를 이용한 에칭방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020170004046A KR101823817B1 (ko) 2010-12-14 2017-01-11 에칭제 및 이를 이용한 에칭방법
KR1020170062078A KR101811553B1 (ko) 2010-12-14 2017-05-19 에칭제 및 이를 이용한 에칭방법

Country Status (4)

Country Link
JP (1) JP5219304B2 (zh)
KR (3) KR20120066581A (zh)
CN (2) CN103820783A (zh)
TW (2) TWI553155B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9466508B2 (en) 2013-04-23 2016-10-11 Mitsubishi Gas Chemical Company, Inc. Liquid composition used in etching multilayer film containing copper and molybdenum, manufacturing method of substrate using said liquid composition, and substrate manufactured by said manufacturing method
EP2862959A1 (en) * 2013-10-21 2015-04-22 ATOTECH Deutschland GmbH Method of selectively treating copper in the presence of further metal
CN103695908A (zh) * 2013-12-27 2014-04-02 东莞市广华化工有限公司 一种新型的有机碱微蚀液
JP6417612B2 (ja) * 2014-12-01 2018-11-07 メック株式会社 エッチング剤およびその補給液、マグネシウム部品の表面粗化方法、ならびにマグネシウム−樹脂複合体の製造方法
JP6662671B2 (ja) * 2016-03-24 2020-03-11 株式会社Adeka エッチング液組成物及びエッチング方法
JP6736088B2 (ja) * 2017-05-22 2020-08-05 メック株式会社 エッチング液、補給液および銅配線の形成方法
KR102206587B1 (ko) 2020-06-10 2021-01-21 심교권 유연성 기판의 배선 형성 방법.
JP7274221B2 (ja) 2020-11-11 2023-05-16 メック株式会社 エッチング剤及び回路基板の製造方法
CN113667978A (zh) * 2021-08-24 2021-11-19 青岛爱大生环保科技有限公司 一种中性铜蚀刻液及其制备方法
TW202408335A (zh) * 2022-08-04 2024-02-16 日商三菱瓦斯化學股份有限公司 印刷配線板之製造方法
CN116240547B (zh) * 2022-12-25 2024-03-12 湖北兴福电子材料股份有限公司 一种铜蚀刻液及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1096937A (ja) 1996-09-24 1998-04-14 Canon Inc 液晶素子及びその製造方法
JP4063475B2 (ja) * 1999-11-10 2008-03-19 メック株式会社 銅または銅合金のエッチング剤
JP4706081B2 (ja) 2001-06-05 2011-06-22 メック株式会社 銅または銅合金のエッチング剤ならびにエッチング法
JP4521460B2 (ja) * 2008-02-20 2010-08-11 メック株式会社 エッチング液及びこれを用いた銅配線の形成方法
CN102985596B (zh) * 2010-06-18 2016-08-10 三菱瓦斯化学株式会社 用于包含铜层和钼层的多层结构膜的蚀刻液

Also Published As

Publication number Publication date
JP5219304B2 (ja) 2013-06-26
CN103820783A (zh) 2014-05-28
CN102560497B (zh) 2014-10-15
KR20170059931A (ko) 2017-05-31
KR20170010026A (ko) 2017-01-25
KR101823817B1 (ko) 2018-01-30
TWI553155B (zh) 2016-10-11
TWI604090B (zh) 2017-11-01
TW201617481A (zh) 2016-05-16
KR101811553B1 (ko) 2017-12-21
CN102560497A (zh) 2012-07-11
JP2012129304A (ja) 2012-07-05
TW201224208A (en) 2012-06-16

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