KR20120044935A - 중합체 및 표면 개질된 육방정 질화붕소 입자의 복합물 - Google Patents

중합체 및 표면 개질된 육방정 질화붕소 입자의 복합물 Download PDF

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KR20120044935A
KR20120044935A KR1020117029687A KR20117029687A KR20120044935A KR 20120044935 A KR20120044935 A KR 20120044935A KR 1020117029687 A KR1020117029687 A KR 1020117029687A KR 20117029687 A KR20117029687 A KR 20117029687A KR 20120044935 A KR20120044935 A KR 20120044935A
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South Korea
Prior art keywords
polymer
smhbn
boron nitride
composite
film
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KR1020117029687A
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English (en)
Korean (ko)
Inventor
푸이-얀 린
고빈다사미 파라마시반 라젠드란
조지 엘리아스 자히르
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이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20120044935A publication Critical patent/KR20120044935A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/77—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by unit-cell parameters, atom positions or structure diagrams
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
KR1020117029687A 2009-05-13 2010-05-12 중합체 및 표면 개질된 육방정 질화붕소 입자의 복합물 Withdrawn KR20120044935A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/465,059 2009-05-13
US12/465,059 US8288466B2 (en) 2009-05-13 2009-05-13 Composite of a polymer and surface modified hexagonal boron nitride particles

Publications (1)

Publication Number Publication Date
KR20120044935A true KR20120044935A (ko) 2012-05-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117029687A Withdrawn KR20120044935A (ko) 2009-05-13 2010-05-12 중합체 및 표면 개질된 육방정 질화붕소 입자의 복합물

Country Status (6)

Country Link
US (1) US8288466B2 (enExample)
EP (1) EP2430091B1 (enExample)
JP (1) JP5597699B2 (enExample)
KR (1) KR20120044935A (enExample)
CN (1) CN102421841B (enExample)
WO (1) WO2010132510A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160124516A (ko) 2015-04-20 2016-10-28 주식회사 엘지화학 질화붕소 분산액

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8258346B2 (en) * 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles
JP2012096432A (ja) 2010-11-01 2012-05-24 Sony Corp バリアフィルム及びその製造方法
EP2791228B1 (en) 2011-12-16 2018-04-25 Ticona LLC Boron-containing nucleating agent for polyphenylene sulfide
KR20140102217A (ko) 2011-12-16 2014-08-21 티코나 엘엘씨 폴리아릴렌 설파이드 조성물용 핵 형성 시스템
WO2013090172A1 (en) 2011-12-16 2013-06-20 Ticona Llc Method for low temperature injection molding of polyarylene sulfide compositions and injection molded part obtained thereby
US8852487B2 (en) 2011-12-16 2014-10-07 Ticona Llc Injection molding of polyarylene sulfide compositions
CN102786815B (zh) * 2012-08-15 2014-04-02 中国科学院上海硅酸盐研究所 氮化硼粉体表面改性的方法、改性氮化硼及聚合物复合材料
US9464214B2 (en) 2014-02-25 2016-10-11 The Boeing Company Thermally conductive flexible adhesive for aerospace applications
TWI708805B (zh) 2015-12-30 2020-11-01 美商聖高拜陶器塑膠公司 改質氮化物顆粒、寡聚物官能化氮化物顆粒、基於聚合物之複合材料及其形成方法
WO2017158919A1 (ja) * 2016-03-14 2017-09-21 ナミックス株式会社 窒化ホウ素フィラ―、樹脂組成物、フィルム、窒化ホウ素フィラ―の製造方法
US10246623B2 (en) * 2016-09-21 2019-04-02 NAiEEL Technology Resin composition, article prepared by using the same, and method of preparing the same
KR101850244B1 (ko) * 2017-04-05 2018-06-07 한국과학기술원 Bnnp를 포함하는 나노 복합 재료 및 그의 제조 방법
CN109135267B (zh) * 2017-06-15 2021-04-27 中国科学院化学研究所 一种表面胺基化的氮化硼/尼龙复合材料及其制备方法和用途
KR102293461B1 (ko) 2017-07-14 2021-08-25 후지필름 가부시키가이샤 표면 수식 무기 질화물, 조성물, 열전도 재료, 열전도층 부착 디바이스
CN111417373B (zh) * 2018-01-26 2024-04-12 弗门尼舍有限公司 包含微胶囊的染发组合物
EP3916773A4 (en) 2019-01-23 2022-03-23 FUJIFILM Corporation COMPOSITION, THERMOCONDUCTIVE SHEET AND DEVICE EQUIPPED WITH A THERMOCONDUCTIVE LAYER
WO2020158259A1 (ja) 2019-02-01 2020-08-06 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料
WO2021010291A1 (ja) * 2019-07-17 2021-01-21 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料、表面修飾無機物
CN119306916B (zh) * 2024-12-17 2025-03-14 河北铁科翼辰新材科技有限公司 可过滤低频振动的减振隔振聚氨酯弹性垫板及其制备方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2555515C2 (de) 1975-12-10 1990-04-19 Hoechst Ag, 6230 Frankfurt Verfahren zur Herstellung von einheitlichen 4-Aminobenzoldiazoniumsalzen
US4670325A (en) * 1983-04-29 1987-06-02 Ibm Corporation Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure
DE69115171T2 (de) 1990-08-27 1996-05-15 Du Pont Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
JPH07215705A (ja) 1994-02-07 1995-08-15 Shin Etsu Chem Co Ltd シリコーンゴム添加用窒化ほう素粉末およびシリコーンゴム製品
JP2732822B2 (ja) * 1995-12-28 1998-03-30 デュポン帝人アドバンスドペーパー株式会社 複合体シートおよびその製造方法
US5681883A (en) 1996-03-05 1997-10-28 Advanced Ceramics Corporation Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
US6160042A (en) * 1997-05-01 2000-12-12 Edison Polymer Innovation Corporation Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
EP1114843B1 (en) * 1999-12-16 2006-03-29 Edison Polymer Innovation Corporation Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method
US6162849A (en) 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
US6623791B2 (en) * 1999-07-30 2003-09-23 Ppg Industries Ohio, Inc. Coating compositions having improved adhesion, coated substrates and methods related thereto
US20070241303A1 (en) * 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
US7445797B2 (en) 2005-03-14 2008-11-04 Momentive Performance Materials Inc. Enhanced boron nitride composition and polymer-based compositions made therewith
US7976941B2 (en) * 1999-08-31 2011-07-12 Momentive Performance Materials Inc. Boron nitride particles of spherical geometry and process for making thereof
JP2001192500A (ja) * 2000-01-12 2001-07-17 Edison Polymer Innovation Corp 低粘度高熱伝導性ポリマー系窒化ホウ素組成物形成用表面処理窒化ホウ素及び該組成物の形成方法
US6764975B1 (en) * 2000-11-28 2004-07-20 Saint-Gobain Ceramics & Plastics, Inc. Method for making high thermal diffusivity boron nitride powders
US6652822B2 (en) * 2001-05-17 2003-11-25 The Regents Of The University Of California Spherical boron nitride particles and method for preparing them
US7026436B2 (en) 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US7470990B2 (en) * 2004-03-31 2008-12-30 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US20060127686A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device
JPWO2007018120A1 (ja) * 2005-08-05 2009-02-19 日立化成工業株式会社 接着フィルム及びこれを用いた半導体装置
US7524560B2 (en) * 2005-08-19 2009-04-28 Momentive Performance Materials Inc. Enhanced boron nitride composition and compositions made therewith
US20070205706A1 (en) * 2006-03-01 2007-09-06 General Electric Company Optical Substrate Comprising Boron Nitride Particles
US7829188B2 (en) * 2006-04-03 2010-11-09 E.I. Du Pont De Nemours And Company Filled epoxy compositions
US7658988B2 (en) * 2006-04-03 2010-02-09 E. I. Du Pont De Nemours And Company Printed circuits prepared from filled epoxy compositions
US20070259211A1 (en) * 2006-05-06 2007-11-08 Ning Wang Heat spread sheet with anisotropic thermal conductivity
US7527859B2 (en) * 2006-10-08 2009-05-05 Momentive Performance Materials Inc. Enhanced boron nitride composition and compositions made therewith
ATE503802T1 (de) * 2006-10-11 2011-04-15 Sumitomo Electric Industries Polyimidrohr, herstellungsverfahren dafür, verfahren zur herstellung eines polyimidlacks und fixierband
US20100051879A1 (en) 2006-11-22 2010-03-04 The Regents od the Univesity of California Functionalized Boron Nitride Nanotubes
US20090305043A1 (en) * 2008-06-06 2009-12-10 E. I. Du Point De Nemours And Company Boron nitride encapsulated in turbostratic carbon and process for making same
WO2009149445A1 (en) * 2008-06-06 2009-12-10 E. I. Du Pont De Nemours And Company Polymers containing hexagonal boron nitride particles coated with turbostratic carbon and process for preparing same
US8277936B2 (en) * 2008-12-22 2012-10-02 E I Du Pont De Nemours And Company Hexagonal boron nitride compositions characterized by interstitial ferromagnetic layers, process for preparing, and composites thereof with organic polymers
US8784980B2 (en) * 2009-05-13 2014-07-22 E I Du Pont De Nemours And Company Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
US8440292B2 (en) * 2009-05-13 2013-05-14 E I Du Pont De Nemours And Company Multi-layer article for flexible printed circuits
US8258346B2 (en) * 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160124516A (ko) 2015-04-20 2016-10-28 주식회사 엘지화학 질화붕소 분산액

Also Published As

Publication number Publication date
CN102421841B (zh) 2014-04-09
EP2430091A4 (en) 2013-03-06
US20100288968A1 (en) 2010-11-18
CN102421841A (zh) 2012-04-18
EP2430091B1 (en) 2015-02-25
US8288466B2 (en) 2012-10-16
WO2010132510A3 (en) 2011-03-17
JP2012526906A (ja) 2012-11-01
EP2430091A2 (en) 2012-03-21
WO2010132510A2 (en) 2010-11-18
JP5597699B2 (ja) 2014-10-01

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Patent event date: 20111212

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid