JP5597699B2 - ポリマーおよび表面改質六方晶窒化ホウ素粒子の複合体 - Google Patents

ポリマーおよび表面改質六方晶窒化ホウ素粒子の複合体 Download PDF

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JP5597699B2
JP5597699B2 JP2012510960A JP2012510960A JP5597699B2 JP 5597699 B2 JP5597699 B2 JP 5597699B2 JP 2012510960 A JP2012510960 A JP 2012510960A JP 2012510960 A JP2012510960 A JP 2012510960A JP 5597699 B2 JP5597699 B2 JP 5597699B2
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polymer
smhbn
boron nitride
film
hexagonal boron
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Japanese (ja)
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JP2012526906A (ja
JP2012526906A5 (enExample
Inventor
プイ−ヤン・リン
ゴヴィンダザミー・パラマジヴァン・ラジェンラン
ジョージ・エリアス・ザール
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/77—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by unit-cell parameters, atom positions or structure diagrams
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
JP2012510960A 2009-05-13 2010-05-12 ポリマーおよび表面改質六方晶窒化ホウ素粒子の複合体 Expired - Fee Related JP5597699B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/465,059 US8288466B2 (en) 2009-05-13 2009-05-13 Composite of a polymer and surface modified hexagonal boron nitride particles
US12/465,059 2009-05-13
PCT/US2010/034459 WO2010132510A2 (en) 2009-05-13 2010-05-12 Composite of a polymer and surface modified hexagonal boron nitride particles

Publications (3)

Publication Number Publication Date
JP2012526906A JP2012526906A (ja) 2012-11-01
JP2012526906A5 JP2012526906A5 (enExample) 2013-06-20
JP5597699B2 true JP5597699B2 (ja) 2014-10-01

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JP2012510960A Expired - Fee Related JP5597699B2 (ja) 2009-05-13 2010-05-12 ポリマーおよび表面改質六方晶窒化ホウ素粒子の複合体

Country Status (6)

Country Link
US (1) US8288466B2 (enExample)
EP (1) EP2430091B1 (enExample)
JP (1) JP5597699B2 (enExample)
KR (1) KR20120044935A (enExample)
CN (1) CN102421841B (enExample)
WO (1) WO2010132510A2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8258346B2 (en) * 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles
JP2012096432A (ja) 2010-11-01 2012-05-24 Sony Corp バリアフィルム及びその製造方法
WO2013090168A1 (en) 2011-12-16 2013-06-20 Ticona Llc Injection molding of polyarylene sulfide compositions
US9080036B2 (en) 2011-12-16 2015-07-14 Ticona Llc Nucleating system for polyarylene sulfide compositions
US8796392B2 (en) 2011-12-16 2014-08-05 Ticona Llc Low temperature injection molding of polyarylene sulfide compositions
JP6111263B2 (ja) 2011-12-16 2017-04-05 ティコナ・エルエルシー ポリアリーレンスルフィド用のホウ素含有成核剤
CN102786815B (zh) * 2012-08-15 2014-04-02 中国科学院上海硅酸盐研究所 氮化硼粉体表面改性的方法、改性氮化硼及聚合物复合材料
US9464214B2 (en) 2014-02-25 2016-10-11 The Boeing Company Thermally conductive flexible adhesive for aerospace applications
KR101924197B1 (ko) 2015-04-20 2018-11-30 주식회사 엘지화학 질화붕소 분산액
TWI708805B (zh) 2015-12-30 2020-11-01 美商聖高拜陶器塑膠公司 改質氮化物顆粒、寡聚物官能化氮化物顆粒、基於聚合物之複合材料及其形成方法
JP6721219B2 (ja) * 2016-03-14 2020-07-08 ナミックス株式会社 窒化ホウ素フィラ―、樹脂組成物、フィルム、窒化ホウ素フィラ―の製造方法
US10246623B2 (en) * 2016-09-21 2019-04-02 NAiEEL Technology Resin composition, article prepared by using the same, and method of preparing the same
KR101850244B1 (ko) * 2017-04-05 2018-06-07 한국과학기술원 Bnnp를 포함하는 나노 복합 재료 및 그의 제조 방법
CN109135267B (zh) * 2017-06-15 2021-04-27 中国科学院化学研究所 一种表面胺基化的氮化硼/尼龙复合材料及其制备方法和用途
JP6847219B2 (ja) * 2017-07-14 2021-03-24 富士フイルム株式会社 表面修飾無機窒化物、組成物、熱伝導材料、熱伝導層付きデバイス
US11484480B2 (en) * 2018-01-26 2022-11-01 Firmenich Sa Hair coloring composition comprising microcapsules
CN113228263B (zh) 2019-01-23 2025-02-14 富士胶片株式会社 组合物、导热片、带导热层的器件
EP3919540B1 (en) 2019-02-01 2025-07-23 FUJIFILM Corporation Composition for forming thermally conductive material, and thermally conductive material
EP4001340A4 (en) * 2019-07-17 2022-08-24 FUJIFILM Corporation COMPOSITION FOR THE PRODUCTION OF THERMAL CONDUCTIVE MATERIAL, THERMAL CONDUCTIVE MATERIAL AND SURFACE MODIFIED INORGANIC SUBSTANCE
CN119306916B (zh) * 2024-12-17 2025-03-14 河北铁科翼辰新材科技有限公司 可过滤低频振动的减振隔振聚氨酯弹性垫板及其制备方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2555515C2 (de) 1975-12-10 1990-04-19 Hoechst Ag, 6230 Frankfurt Verfahren zur Herstellung von einheitlichen 4-Aminobenzoldiazoniumsalzen
US4670325A (en) * 1983-04-29 1987-06-02 Ibm Corporation Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure
DE69115171T2 (de) 1990-08-27 1996-05-15 Du Pont Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
JPH07215705A (ja) 1994-02-07 1995-08-15 Shin Etsu Chem Co Ltd シリコーンゴム添加用窒化ほう素粉末およびシリコーンゴム製品
JP2732822B2 (ja) * 1995-12-28 1998-03-30 デュポン帝人アドバンスドペーパー株式会社 複合体シートおよびその製造方法
US5681883A (en) * 1996-03-05 1997-10-28 Advanced Ceramics Corporation Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
US6160042A (en) * 1997-05-01 2000-12-12 Edison Polymer Innovation Corporation Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
EP1114843B1 (en) * 1999-12-16 2006-03-29 Edison Polymer Innovation Corporation Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method
US6162849A (en) 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
US6623791B2 (en) * 1999-07-30 2003-09-23 Ppg Industries Ohio, Inc. Coating compositions having improved adhesion, coated substrates and methods related thereto
US20070241303A1 (en) * 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
US7445797B2 (en) 2005-03-14 2008-11-04 Momentive Performance Materials Inc. Enhanced boron nitride composition and polymer-based compositions made therewith
US7976941B2 (en) * 1999-08-31 2011-07-12 Momentive Performance Materials Inc. Boron nitride particles of spherical geometry and process for making thereof
JP2001192500A (ja) * 2000-01-12 2001-07-17 Edison Polymer Innovation Corp 低粘度高熱伝導性ポリマー系窒化ホウ素組成物形成用表面処理窒化ホウ素及び該組成物の形成方法
US6764975B1 (en) * 2000-11-28 2004-07-20 Saint-Gobain Ceramics & Plastics, Inc. Method for making high thermal diffusivity boron nitride powders
US6652822B2 (en) * 2001-05-17 2003-11-25 The Regents Of The University Of California Spherical boron nitride particles and method for preparing them
US7026436B2 (en) 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US7470990B2 (en) * 2004-03-31 2008-12-30 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US20060127686A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device
JPWO2007018120A1 (ja) * 2005-08-05 2009-02-19 日立化成工業株式会社 接着フィルム及びこれを用いた半導体装置
US7524560B2 (en) * 2005-08-19 2009-04-28 Momentive Performance Materials Inc. Enhanced boron nitride composition and compositions made therewith
US20070205706A1 (en) * 2006-03-01 2007-09-06 General Electric Company Optical Substrate Comprising Boron Nitride Particles
US7829188B2 (en) * 2006-04-03 2010-11-09 E.I. Du Pont De Nemours And Company Filled epoxy compositions
US7658988B2 (en) * 2006-04-03 2010-02-09 E. I. Du Pont De Nemours And Company Printed circuits prepared from filled epoxy compositions
US20070259211A1 (en) * 2006-05-06 2007-11-08 Ning Wang Heat spread sheet with anisotropic thermal conductivity
US7527859B2 (en) * 2006-10-08 2009-05-05 Momentive Performance Materials Inc. Enhanced boron nitride composition and compositions made therewith
EP2072581B1 (en) * 2006-10-11 2011-03-30 Sumitomo Electric Industries, Ltd. Polyimide tube, method for production thereof, method for production of polyimide varnish, and fixing belt
JP2010510168A (ja) 2006-11-22 2010-04-02 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 官能化窒化ホウ素ナノチューブ
US8039527B2 (en) * 2008-06-06 2011-10-18 E.I. Du Pont De Nemours And Company Polymers containing hexagonal boron nitride particles coated with turbostratic carbon and process for preparing same
US20090305043A1 (en) * 2008-06-06 2009-12-10 E. I. Du Point De Nemours And Company Boron nitride encapsulated in turbostratic carbon and process for making same
US8277936B2 (en) * 2008-12-22 2012-10-02 E I Du Pont De Nemours And Company Hexagonal boron nitride compositions characterized by interstitial ferromagnetic layers, process for preparing, and composites thereof with organic polymers
US8440292B2 (en) * 2009-05-13 2013-05-14 E I Du Pont De Nemours And Company Multi-layer article for flexible printed circuits
US8258346B2 (en) * 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles
US8784980B2 (en) * 2009-05-13 2014-07-22 E I Du Pont De Nemours And Company Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles

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Publication number Publication date
CN102421841B (zh) 2014-04-09
US20100288968A1 (en) 2010-11-18
EP2430091A2 (en) 2012-03-21
EP2430091A4 (en) 2013-03-06
WO2010132510A2 (en) 2010-11-18
CN102421841A (zh) 2012-04-18
JP2012526906A (ja) 2012-11-01
KR20120044935A (ko) 2012-05-08
WO2010132510A3 (en) 2011-03-17
EP2430091B1 (en) 2015-02-25
US8288466B2 (en) 2012-10-16

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