KR20110098624A - 고체 촬상 장치, 고체 촬상 장치의 구동 방법, 및, 전자 기기 - Google Patents
고체 촬상 장치, 고체 촬상 장치의 구동 방법, 및, 전자 기기 Download PDFInfo
- Publication number
- KR20110098624A KR20110098624A KR1020110013684A KR20110013684A KR20110098624A KR 20110098624 A KR20110098624 A KR 20110098624A KR 1020110013684 A KR1020110013684 A KR 1020110013684A KR 20110013684 A KR20110013684 A KR 20110013684A KR 20110098624 A KR20110098624 A KR 20110098624A
- Authority
- KR
- South Korea
- Prior art keywords
- charge
- unit
- pixel
- photodiode
- charge storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims description 32
- 238000003860 storage Methods 0.000 claims abstract description 204
- 238000012546 transfer Methods 0.000 claims description 192
- 238000009825 accumulation Methods 0.000 claims description 140
- 239000003990 capacitor Substances 0.000 claims description 134
- 230000005540 biological transmission Effects 0.000 claims description 33
- 238000009792 diffusion process Methods 0.000 claims description 18
- 238000007667 floating Methods 0.000 claims description 18
- 230000003321 amplification Effects 0.000 claims description 7
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 description 66
- 238000010586 diagram Methods 0.000 description 49
- 239000004065 semiconductor Substances 0.000 description 48
- 230000004048 modification Effects 0.000 description 45
- 238000012986 modification Methods 0.000 description 45
- 239000000758 substrate Substances 0.000 description 43
- 238000006243 chemical reaction Methods 0.000 description 22
- 229920006395 saturated elastomer Polymers 0.000 description 21
- 230000006870 function Effects 0.000 description 15
- 230000000694 effects Effects 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 239000002344 surface layer Substances 0.000 description 13
- 230000008878 coupling Effects 0.000 description 10
- 238000010168 coupling process Methods 0.000 description 10
- 238000005859 coupling reaction Methods 0.000 description 10
- 230000004044 response Effects 0.000 description 10
- 238000013500 data storage Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000005036 potential barrier Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000000470 constituent Substances 0.000 description 5
- 230000000875 corresponding effect Effects 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/59—Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2010-041413 | 2010-02-26 | ||
| JP2010041413 | 2010-02-26 | ||
| JP2010068506A JP5521682B2 (ja) | 2010-02-26 | 2010-03-24 | 固体撮像装置、固体撮像装置の駆動方法、及び、電子機器 |
| JPJP-P-2010-068506 | 2010-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20110098624A true KR20110098624A (ko) | 2011-09-01 |
Family
ID=43923617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110013684A Ceased KR20110098624A (ko) | 2010-02-26 | 2011-02-16 | 고체 촬상 장치, 고체 촬상 장치의 구동 방법, 및, 전자 기기 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8917341B2 (enExample) |
| EP (1) | EP2362642B1 (enExample) |
| JP (1) | JP5521682B2 (enExample) |
| KR (1) | KR20110098624A (enExample) |
| CN (1) | CN102170533B (enExample) |
| TW (1) | TWI529923B (enExample) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140136445A (ko) * | 2012-03-30 | 2014-11-28 | 소니 주식회사 | 고체 촬상 소자, 고체 촬상 소자의 구동 방법, 및 전자 기기 |
| KR20150139822A (ko) * | 2013-04-08 | 2015-12-14 | 소니 주식회사 | 고체 촬상 소자, 구동 방법 및 전자 기기 |
| KR20170138061A (ko) * | 2016-06-06 | 2017-12-14 | 캐논 가부시끼가이샤 | 결상 장치, 결상 시스템, 및 이동 물체 |
| KR20180113506A (ko) * | 2016-02-18 | 2018-10-16 | 소니 주식회사 | 고체 촬상 장치, 고체 촬상 장치의 구동 방법, 및, 전자 기기 |
| KR20190091357A (ko) * | 2016-12-22 | 2019-08-05 | 레이던 컴퍼니 | 이미징 애플리케이션을 위한 확장된 높은 동적 범위 직접 주입 회로 |
| KR20190114944A (ko) * | 2019-09-26 | 2019-10-10 | (주) 픽셀플러스 | 이미지 센싱 장치 |
| KR20200070225A (ko) * | 2017-10-12 | 2020-06-17 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 고체 촬상 소자 및 전자장치 |
| US10903257B2 (en) | 2011-12-12 | 2021-01-26 | Sony Semiconductor Solutions Corporation | Solid-state imaging device, driving method for solid-state imaging device, and electronic appliance |
| US11128823B2 (en) | 2016-03-31 | 2021-09-21 | Sony Corporation | Imaging apparatus, driving method, and electronic device |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5535685B2 (ja) * | 2010-02-26 | 2014-07-02 | パナソニック株式会社 | 固体撮像装置及び駆動方法 |
| JP5780025B2 (ja) * | 2011-07-11 | 2015-09-16 | ソニー株式会社 | 固体撮像装置、固体撮像装置の駆動方法、及び電子機器 |
| TWI505453B (zh) * | 2011-07-12 | 2015-10-21 | Sony Corp | 固態成像裝置,用於驅動其之方法,用於製造其之方法,及電子裝置 |
| TWI548073B (zh) | 2011-12-14 | 2016-09-01 | Sony Corp | Solid-state imaging devices and electronic equipment |
| JP2013162148A (ja) | 2012-02-01 | 2013-08-19 | Sony Corp | 個体撮像装置および駆動方法、並びに電子機器 |
| JP5970834B2 (ja) * | 2012-02-02 | 2016-08-17 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法、及び、電子機器 |
| US9490373B2 (en) * | 2012-02-02 | 2016-11-08 | Sony Corporation | Solid-state imaging device and electronic apparatus with improved storage portion |
| JP6007499B2 (ja) * | 2012-02-06 | 2016-10-12 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法、及び、電子機器 |
| CN102593139A (zh) * | 2012-02-28 | 2012-07-18 | 上海宏力半导体制造有限公司 | Cmos图像传感器 |
| JP2014112580A (ja) * | 2012-12-05 | 2014-06-19 | Sony Corp | 固体撮像素子および駆動方法 |
| KR20150016232A (ko) | 2012-05-25 | 2015-02-11 | 소니 주식회사 | 촬상 소자, 구동 방법 및 전자 장치 |
| JP2014060519A (ja) | 2012-09-14 | 2014-04-03 | Sony Corp | 固体撮像素子及びその制御方法、並びに電子機器 |
| KR102007279B1 (ko) * | 2013-02-08 | 2019-08-05 | 삼성전자주식회사 | 3차원 이미지 센서의 거리 픽셀, 이를 포함하는 3차원 이미지 센서 및 3차원 이미지 센서의 거리 픽셀의 구동 방법 |
| CN103491324B (zh) * | 2013-09-29 | 2016-04-20 | 长春长光辰芯光电技术有限公司 | 高速全局快门图像传感器像素及其像素信号的采样方法 |
| JP6376785B2 (ja) * | 2014-03-14 | 2018-08-22 | キヤノン株式会社 | 撮像装置、および、撮像システム |
| KR102253003B1 (ko) | 2014-07-11 | 2021-05-17 | 삼성전자주식회사 | 이미지 센서의 픽셀 어레이 및 이미지 센서 |
| JP6395482B2 (ja) * | 2014-07-11 | 2018-09-26 | キヤノン株式会社 | 光電変換装置、および、撮像システム |
| JP6406912B2 (ja) * | 2014-07-24 | 2018-10-17 | キヤノン株式会社 | 撮像装置並びにその駆動方法 |
| JP6425448B2 (ja) | 2014-07-31 | 2018-11-21 | キヤノン株式会社 | 光電変換装置、および、撮像システム |
| CN104394338A (zh) * | 2014-12-03 | 2015-03-04 | 北京思比科微电子技术股份有限公司 | 扩展动态范围的三晶体管图像传感器像素结构 |
| US9502457B2 (en) * | 2015-01-29 | 2016-11-22 | Semiconductor Components Industries, Llc | Global shutter image sensor pixels having centralized charge storage regions |
| JP6537838B2 (ja) * | 2015-01-30 | 2019-07-03 | ルネサスエレクトロニクス株式会社 | 撮像素子 |
| JP6808495B2 (ja) | 2015-02-13 | 2021-01-06 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子、駆動方法、および電子機器 |
| JP6520293B2 (ja) * | 2015-03-26 | 2019-05-29 | セイコーエプソン株式会社 | 撮像回路装置及び電子機器 |
| US10805561B2 (en) | 2015-07-27 | 2020-10-13 | Sony Corporation | Solid-state image pickup device and control method therefor, and electronic apparatus |
| TWI704811B (zh) | 2015-07-27 | 2020-09-11 | 日商新力股份有限公司 | 固體攝像裝置及其控制方法、以及電子機器 |
| JP2017135693A (ja) * | 2016-01-21 | 2017-08-03 | パナソニックIpマネジメント株式会社 | 撮像装置 |
| US10687003B2 (en) | 2016-08-04 | 2020-06-16 | Omnivision Technologies, Inc. | Linear-logarithmic image sensor |
| CN106791461B (zh) * | 2016-11-25 | 2019-10-18 | 维沃移动通信有限公司 | 一种曝光控制方法、曝光控制电路及移动终端 |
| CN108234856A (zh) * | 2016-12-14 | 2018-06-29 | 天津三星电子有限公司 | 一种图像的亮度信息的采集方法及图像获取装置 |
| US10440298B2 (en) * | 2016-12-23 | 2019-10-08 | Bae Systems Information And Electronic Systems Integration Inc. | Extended dynamic range cis pixel achieving ultra-low noise |
| KR102651415B1 (ko) * | 2017-02-20 | 2024-03-28 | 에스케이하이닉스 주식회사 | 이미지 센서 및 그 동작방법 |
| JP6784609B2 (ja) * | 2017-02-24 | 2020-11-11 | キヤノン株式会社 | 光電変換装置、撮像システム及び移動体 |
| JP6929114B2 (ja) * | 2017-04-24 | 2021-09-01 | キヤノン株式会社 | 光電変換装置及び撮像システム |
| CN107247190B (zh) * | 2017-05-24 | 2019-09-10 | 欧常春 | 一种利用电荷缩放技术的电容检测电路 |
| US11082649B2 (en) * | 2017-06-02 | 2021-08-03 | Sony Semiconductor Solutions Corporation | Solid-state imaging device with pixels having an in-pixel capacitance |
| JPWO2019065866A1 (ja) | 2017-09-29 | 2020-10-15 | 株式会社ニコン | 撮像素子 |
| JP7100439B2 (ja) * | 2017-10-20 | 2022-07-13 | ブリルニクス シンガポール プライベート リミテッド | 固体撮像装置、固体撮像装置の駆動方法、および電子機器 |
| JP6987603B2 (ja) * | 2017-10-26 | 2022-01-05 | ブリルニクス シンガポール プライベート リミテッド | 固体撮像装置、固体撮像装置の駆動方法、および電子機器 |
| JP7181887B2 (ja) * | 2017-10-27 | 2022-12-01 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像方法 |
| JP7018293B2 (ja) * | 2017-11-06 | 2022-02-10 | ブリルニクス シンガポール プライベート リミテッド | 固体撮像装置、固体撮像装置の駆動方法、および電子機器 |
| US11658193B2 (en) | 2018-01-23 | 2023-05-23 | Samsung Electronics Co., Ltd. | Image sensor |
| US10714517B2 (en) * | 2018-01-23 | 2020-07-14 | Samsung Electronics Co., Ltd. | Image sensor |
| KR102551483B1 (ko) | 2018-08-14 | 2023-07-04 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
| JP2020047734A (ja) | 2018-09-18 | 2020-03-26 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
| JP2020047826A (ja) * | 2018-09-20 | 2020-03-26 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置および電子機器 |
| KR102624610B1 (ko) | 2018-10-04 | 2024-01-15 | 삼성전자주식회사 | 이미지 센서 |
| JP7237622B2 (ja) * | 2019-02-05 | 2023-03-13 | キヤノン株式会社 | 光電変換装置 |
| JP2021010075A (ja) * | 2019-06-28 | 2021-01-28 | キヤノン株式会社 | 光電変換装置、光電変換システム、および移動体 |
| US11543498B2 (en) * | 2019-07-25 | 2023-01-03 | Omnivision Technologies, Inc. | Tri-gate charge transfer block structure in time of flight pixel |
| EP4042671A4 (en) * | 2019-11-21 | 2022-10-19 | Huawei Technologies Co., Ltd. | IMAGING ELEMENT, IMAGING SENSOR, CAMERA SYSTEM AND DEVICE WITH THE CAMERA SYSTEM |
| US11348956B2 (en) * | 2019-12-17 | 2022-05-31 | Omnivision Technologies, Inc. | Multi-gate lateral overflow integration capacitor sensor |
| KR20210156467A (ko) | 2020-06-18 | 2021-12-27 | 삼성전자주식회사 | 이미지 센서 |
| US12382197B2 (en) | 2020-11-12 | 2025-08-05 | Sony Semiconductor Solutions Corporation | Solid-state imaging element, electronic device, and control method of solid-state imaging element |
| US12484324B2 (en) | 2020-12-08 | 2025-11-25 | Sony Semiconductor Solutions Corporation | Solid-state imaging element, imaging device, and method of controlling solid-state imaging element |
| KR20220098587A (ko) | 2021-01-04 | 2022-07-12 | 삼성전자주식회사 | 이미지 센서, 픽셀 및 픽셀의 동작 방법 |
| US11330207B1 (en) * | 2021-02-26 | 2022-05-10 | Caeleste Cvba | High dynamic range in direct injection |
| KR20240021163A (ko) * | 2021-06-15 | 2024-02-16 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 촬상 소자, 전자 기기 |
| CN120982112A (zh) * | 2023-04-13 | 2025-11-18 | 索尼半导体解决方案公司 | 光检测装置和电子设备 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3874135B2 (ja) | 1997-12-05 | 2007-01-31 | 株式会社ニコン | 固体撮像素子 |
| US6243134B1 (en) * | 1998-02-27 | 2001-06-05 | Intel Corporation | Method to reduce reset noise in photodiode based CMOS image sensors |
| JP3592107B2 (ja) * | 1998-11-27 | 2004-11-24 | キヤノン株式会社 | 固体撮像装置およびカメラ |
| US6204524B1 (en) * | 1999-07-14 | 2001-03-20 | Micron Technology, Inc. | CMOS imager with storage capacitor |
| US20030076431A1 (en) | 2001-10-24 | 2003-04-24 | Krymski Alexander I. | Image sensor with pixels having multiple capacitive storage elements |
| US6888122B2 (en) * | 2002-08-29 | 2005-05-03 | Micron Technology, Inc. | High dynamic range cascaded integration pixel cell and method of operation |
| JP2005005573A (ja) * | 2003-06-13 | 2005-01-06 | Fujitsu Ltd | 撮像装置 |
| EP1732134B1 (en) * | 2004-02-27 | 2012-10-24 | National University Corporation Tohoku Unversity | Solid-state imagine device, line sensor, optical sensor, and method for operating solid-state imaging device |
| JP4317115B2 (ja) * | 2004-04-12 | 2009-08-19 | 国立大学法人東北大学 | 固体撮像装置、光センサおよび固体撮像装置の動作方法 |
| US7605117B2 (en) | 2004-04-16 | 2009-10-20 | Honeywell International Inc. | Methods of replacing refrigerant |
| JP4497366B2 (ja) * | 2005-02-04 | 2010-07-07 | 国立大学法人東北大学 | 光センサおよび固体撮像装置 |
| JP5066704B2 (ja) * | 2005-02-04 | 2012-11-07 | 国立大学法人東北大学 | 固体撮像装置、および固体撮像装置の動作方法 |
| JP4273124B2 (ja) * | 2005-02-04 | 2009-06-03 | キヤノン株式会社 | 撮像装置及び撮像システム |
| JP4459098B2 (ja) * | 2005-03-18 | 2010-04-28 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| KR101257526B1 (ko) * | 2005-04-07 | 2013-04-23 | 고쿠리츠다이가쿠호진 도호쿠다이가쿠 | 광 센서, 고체 촬상 장치, 및 고체 촬상 장치의 동작 방법 |
| US7238926B2 (en) * | 2005-06-01 | 2007-07-03 | Eastman Kodak Company | Shared amplifier pixel with matched coupling capacitances |
| US7427736B2 (en) * | 2006-03-23 | 2008-09-23 | Micron Technology, Inc. | Method and apparatus for providing a rolling double reset timing for global storage in image sensors |
| JP2008028678A (ja) * | 2006-07-20 | 2008-02-07 | Pentax Corp | 撮像素子 |
| JP5153378B2 (ja) * | 2008-02-15 | 2013-02-27 | キヤノン株式会社 | 固体撮像装置及びその駆動方法 |
| JP5568880B2 (ja) * | 2008-04-03 | 2014-08-13 | ソニー株式会社 | 固体撮像装置、固体撮像装置の駆動方法および電子機器 |
| JP4316002B1 (ja) | 2008-12-11 | 2009-08-19 | 株式会社メイクソフトウェア | 写真撮影遊戯機、写真撮影遊戯方法及び写真撮影遊戯プログラム |
| JP2010217410A (ja) * | 2009-03-16 | 2010-09-30 | Fujifilm Corp | 複眼撮像装置 |
| WO2011096340A1 (ja) * | 2010-02-05 | 2011-08-11 | 国立大学法人静岡大学 | 固体撮像装置、画素信号を読み出す方法、画素 |
-
2010
- 2010-03-24 JP JP2010068506A patent/JP5521682B2/ja not_active Expired - Fee Related
-
2011
- 2011-02-01 TW TW100104021A patent/TWI529923B/zh not_active IP Right Cessation
- 2011-02-15 US US13/027,351 patent/US8917341B2/en active Active
- 2011-02-16 KR KR1020110013684A patent/KR20110098624A/ko not_active Ceased
- 2011-02-17 EP EP11154881.4A patent/EP2362642B1/en not_active Not-in-force
- 2011-02-18 CN CN201110040519.9A patent/CN102170533B/zh not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10903257B2 (en) | 2011-12-12 | 2021-01-26 | Sony Semiconductor Solutions Corporation | Solid-state imaging device, driving method for solid-state imaging device, and electronic appliance |
| KR20140136445A (ko) * | 2012-03-30 | 2014-11-28 | 소니 주식회사 | 고체 촬상 소자, 고체 촬상 소자의 구동 방법, 및 전자 기기 |
| KR20150139822A (ko) * | 2013-04-08 | 2015-12-14 | 소니 주식회사 | 고체 촬상 소자, 구동 방법 및 전자 기기 |
| KR20180113506A (ko) * | 2016-02-18 | 2018-10-16 | 소니 주식회사 | 고체 촬상 장치, 고체 촬상 장치의 구동 방법, 및, 전자 기기 |
| US11128823B2 (en) | 2016-03-31 | 2021-09-21 | Sony Corporation | Imaging apparatus, driving method, and electronic device |
| US11818487B2 (en) | 2016-03-31 | 2023-11-14 | Sony Group Corporation | Imaging apparatus, driving method, and electronic device |
| KR20170138061A (ko) * | 2016-06-06 | 2017-12-14 | 캐논 가부시끼가이샤 | 결상 장치, 결상 시스템, 및 이동 물체 |
| KR20190091357A (ko) * | 2016-12-22 | 2019-08-05 | 레이던 컴퍼니 | 이미징 애플리케이션을 위한 확장된 높은 동적 범위 직접 주입 회로 |
| KR20200070225A (ko) * | 2017-10-12 | 2020-06-17 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 고체 촬상 소자 및 전자장치 |
| US11818481B2 (en) | 2017-10-12 | 2023-11-14 | Sony Semiconductor Solutions Corporation | Solid-state image sensor and electronic device |
| US12207008B2 (en) | 2017-10-12 | 2025-01-21 | Sony Semiconductor Solutions Corporation | Solid-state image sensor and electronic device |
| KR20190114944A (ko) * | 2019-09-26 | 2019-10-10 | (주) 픽셀플러스 | 이미지 센싱 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI529923B (zh) | 2016-04-11 |
| TW201143067A (en) | 2011-12-01 |
| CN102170533A (zh) | 2011-08-31 |
| US20110211103A1 (en) | 2011-09-01 |
| US8917341B2 (en) | 2014-12-23 |
| EP2362642B1 (en) | 2017-03-29 |
| JP2011199816A (ja) | 2011-10-06 |
| JP5521682B2 (ja) | 2014-06-18 |
| EP2362642A1 (en) | 2011-08-31 |
| CN102170533B (zh) | 2015-03-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20110098624A (ko) | 고체 촬상 장치, 고체 촬상 장치의 구동 방법, 및, 전자 기기 | |
| JP5369779B2 (ja) | 固体撮像装置、固体撮像装置の駆動方法および電子機器 | |
| JP5970834B2 (ja) | 固体撮像装置、固体撮像装置の製造方法、及び、電子機器 | |
| KR101836039B1 (ko) | 고체 촬상 센서, 고체 촬상 센서의 구동 방법, 촬상 장치 및 전자 기기 | |
| CN103247642B (zh) | 固态成像装置及其制造方法和电子设备 | |
| US9025064B2 (en) | Solid-state imaging device, imaging device, and signal readout method | |
| JP6007499B2 (ja) | 固体撮像装置、固体撮像装置の製造方法、及び、電子機器 | |
| JP5251736B2 (ja) | 固体撮像装置、固体撮像装置の駆動方法および電子機器 | |
| JP5358136B2 (ja) | 固体撮像装置 | |
| KR101951496B1 (ko) | 고체 촬상 장치, 그의 구동 방법, 그의 제조 방법 및 전자 기기 | |
| JP2013021533A (ja) | 固体撮像装置、固体撮像装置の駆動方法、及び、電子機器 | |
| JP5257176B2 (ja) | 固体撮像装置、固体撮像装置の駆動方法および電子機器 | |
| JP6045156B2 (ja) | 固体撮像装置 | |
| JP2011199816A5 (enExample) | ||
| JP2013207321A (ja) | 固体撮像装置、及び、電子機器 | |
| KR20100087633A (ko) | 고체 촬상 장치, 고체 촬상 장치의 구동 방법 및 전자 기기 | |
| JP2013162148A (ja) | 個体撮像装置および駆動方法、並びに電子機器 | |
| JP5402993B2 (ja) | 固体撮像装置、固体撮像装置の駆動方法および電子機器 | |
| WO2022102404A1 (ja) | 固体撮像素子、電子機器および固体撮像素子の制御方法 | |
| JP2010278795A (ja) | 固体撮像装置、固体撮像装置の駆動方法および電子機器 | |
| JP2014033106A (ja) | 固体撮像装置および撮像装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20110216 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20150223 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20110216 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20160114 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20160602 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20160114 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
Patent event date: 20160809 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |