KR20110039438A - 기재에 금속을 전해 증착하는 방법 - Google Patents

기재에 금속을 전해 증착하는 방법 Download PDF

Info

Publication number
KR20110039438A
KR20110039438A KR1020117000690A KR20117000690A KR20110039438A KR 20110039438 A KR20110039438 A KR 20110039438A KR 1020117000690 A KR1020117000690 A KR 1020117000690A KR 20117000690 A KR20117000690 A KR 20117000690A KR 20110039438 A KR20110039438 A KR 20110039438A
Authority
KR
South Korea
Prior art keywords
nickel
silica particles
nickel layer
metal
layer
Prior art date
Application number
KR1020117000690A
Other languages
English (en)
Korean (ko)
Inventor
헤르만-요제프 미데케
Original Assignee
아토테크더치랜드게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아토테크더치랜드게엠베하 filed Critical 아토테크더치랜드게엠베하
Publication of KR20110039438A publication Critical patent/KR20110039438A/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Battery Electrode And Active Subsutance (AREA)
KR1020117000690A 2008-07-15 2009-07-10 기재에 금속을 전해 증착하는 방법 KR20110039438A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08075637A EP2145986B1 (fr) 2008-07-15 2008-07-15 Solution et procédé pour le dépôt électrochimique d'un métal sur un substrat
EP08075637.2 2008-07-15

Publications (1)

Publication Number Publication Date
KR20110039438A true KR20110039438A (ko) 2011-04-18

Family

ID=40010705

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117000690A KR20110039438A (ko) 2008-07-15 2009-07-10 기재에 금속을 전해 증착하는 방법

Country Status (12)

Country Link
US (1) US20110132766A1 (fr)
EP (1) EP2145986B1 (fr)
JP (1) JP5674655B2 (fr)
KR (1) KR20110039438A (fr)
CN (1) CN102066622B (fr)
AT (1) ATE462025T1 (fr)
BR (1) BRPI0915785A2 (fr)
CA (1) CA2723827A1 (fr)
DE (1) DE602008000878D1 (fr)
ES (1) ES2339614T3 (fr)
PL (1) PL2145986T3 (fr)
WO (1) WO2010006800A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110155582A1 (en) 2009-11-18 2011-06-30 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
EP2551375A1 (fr) * 2011-07-26 2013-01-30 Atotech Deutschland GmbH Composition de bain pour placage autocatalytique de nickel
US8871077B2 (en) * 2011-10-14 2014-10-28 GM Global Technology Operations LLC Corrosion-resistant plating system
JP6024714B2 (ja) 2013-10-03 2016-11-16 トヨタ自動車株式会社 成膜用ニッケル溶液およびこれを用いた成膜方法
DE102014207778B3 (de) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht
US20170096732A1 (en) * 2014-06-23 2017-04-06 Hewlett-Packard Development Company, L.P. Multilayer coatings on substrates
BR112017008200A2 (pt) * 2014-10-24 2017-12-26 Basf Se partículas, método para depositar um metal a partir de um eletrólito, e, usos de um polímero e das partículas.
CN104790004A (zh) * 2015-03-11 2015-07-22 嘉兴敏惠汽车零部件有限公司 镀镍和\或铬部件及其制造方法
JP6524939B2 (ja) * 2016-02-26 2019-06-05 豊田合成株式会社 ニッケルめっき皮膜及びその製造方法
EP3456870A1 (fr) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH Bain et procédé de remplissage d'une tranchée ou d'un accès d'interconnexion verticale d'une pièce à usiner, de nickel ou d'un alliage de nickel
PL238262B1 (pl) * 2017-12-04 2021-08-02 Zakl Wyrobow Galanteryjnych Spolka Z Ograniczona Odpowiedzialnoscia Sposób elektrochemicznego wytwarzania wielowarstwowych powłok metalicznych, zwłaszcza niklowych, o zwiększonej odporności na korozję
CN108914173B (zh) * 2018-07-13 2021-03-23 中国科学院金属研究所 一种含有二氧化硅颗粒的铁镍复合镀层的制备方法
CN109183131B (zh) * 2018-07-16 2020-06-16 东南大学 一种SiO2基复合超疏水金属表面的制备方法
CN112899741B (zh) * 2021-01-21 2022-03-15 长春理工大学 在金属表面加工二氧化硅-镍复合疏水耐腐蚀涂层的方法
CN113436775B (zh) * 2021-06-23 2022-11-08 中国核动力研究设计院 一种无衬底超薄镍-63放射源的制备方法
CN115012008B (zh) * 2022-03-31 2023-09-19 九牧厨卫股份有限公司 一种提高附着力的环保复合涂镀层及其制备方法
CN118272877A (zh) * 2024-04-07 2024-07-02 深圳御矿新材料有限公司 高强度铝镁合金预镀镍带材及其生成工艺

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL123689C (fr) * 1962-05-30
GB1051685A (fr) * 1963-03-01
US3866289A (en) * 1969-10-06 1975-02-18 Oxy Metal Finishing Corp Micro-porous chromium on nickel-cobalt duplex composite plates
GB1282373A (en) * 1969-10-15 1972-07-19 A I C Approvvigionamenti Ind C Nickel-chromium electroplating
DE2236443C3 (de) * 1972-07-25 1978-05-24 Elektroschmelzwerk Kempten Gmbh, 8000 Muenchen Wäßriges Bad zur Herstellung von metallischen Überzügen, die nichtmetallische, feinverteilte Feststoffe eingelagert enthalten
US3825478A (en) * 1972-10-30 1974-07-23 Oxy Metal Finishing Corp Electrolyte and method for electrodepositing microporous chromium-nickel composite coatings
JPS534498B2 (fr) * 1973-06-23 1978-02-17
SU475874A1 (ru) 1973-07-24 1977-12-05 Ордена Трудового Красного Знамени Институт Химии И Химической Технологии Ан Литовской Сср Электролит дл нанесени никелевого покрыти с внедренными инертными частицами
US4222828A (en) * 1978-06-06 1980-09-16 Akzo N.V. Process for electro-codepositing inorganic particles and a metal on a surface
JPS61143597A (ja) 1984-12-15 1986-07-01 Okayama Pref Gov 亜鉛−シリカ複合めつき鋼材の製造方法
US4734350A (en) * 1986-12-29 1988-03-29 Xerox Corporation Positively charged developer compositions with modified charge enhancing additives containing amino alcohols
JPS63277797A (ja) * 1987-05-11 1988-11-15 Kobe Steel Ltd 複合めっき法
JPH01309997A (ja) * 1988-06-09 1989-12-14 Kanto Kasei Kogyo Kk 耐食性に優れた銅−ニッケル−クロム光沢電気めっき方法およびそれにより得られためっき皮膜
BE1002885A7 (fr) * 1989-03-03 1991-07-16 Centre Rech Metallurgique Produit en acier pourvu d'un revetement composite et procede de depot d'un tel revetement.
JP2741126B2 (ja) * 1991-12-16 1998-04-15 荏原ユージライト株式会社 ニッケル−クロムめっき製品
JPH05331693A (ja) * 1992-05-27 1993-12-14 Mitsubishi Heavy Ind Ltd 電気めっき鋼板及びその製造方法
US5332505A (en) * 1992-10-02 1994-07-26 Betz Laboratories, Inc. Method for inhibiting silica and silicate deposition
JPH06146070A (ja) * 1992-10-30 1994-05-27 Toyoda Gosei Co Ltd 装飾クロムめっき皮膜の形成方法
JPH07278845A (ja) * 1994-04-14 1995-10-24 Marui Kogyo Kk クロムめっき製品及びその製造方法
JPH10251870A (ja) * 1998-03-09 1998-09-22 Marui Kogyo Kk クロムめっき製品
JP2000313997A (ja) * 1999-04-26 2000-11-14 Osaka Gas Co Ltd 複合メッキ液および複合メッキ被膜の形成方法
DE10144250A1 (de) * 2001-08-31 2003-04-03 Fraunhofer Ges Forschung Verbesserte massenspektrometrische Analyse unter Verwendung von Nanopartikeln
DE10164309A1 (de) * 2001-12-28 2003-07-10 Fraunhofer Ges Forschung Verbesserte strukturiert-funktionale Bindematrices für Biomoleküle
CN1394988A (zh) * 2002-08-20 2003-02-05 中国科学院电子学研究所 单槽法镀多层镍工艺
CN100513650C (zh) * 2003-11-21 2009-07-15 关西工程有限会社 镀镍金属线材、经拉丝加工的金属线材、电镀装置及方法
US7435450B2 (en) * 2004-01-30 2008-10-14 Hewlett-Packard Development Company, L.P. Surface modification of silica in an aqueous environment
DE102004021092A1 (de) 2004-04-29 2005-11-24 Degussa Ag Verwendung einer kationischen Siliciumdioxid-Dispersion als Textilveredlungsmittel
CL2007000734A1 (es) * 2006-03-22 2008-05-02 Grace W R & Co Revestimiento de oxido inorganico transparente producido al preparar composicion de revestimiento que comprende particulas de oxido inorganico y polimero, aplicar composicion sobre sustrato, formar revestimiento y calentar el revestimiento para elimi
DE102007012578A1 (de) * 2006-09-01 2008-03-06 Bühler PARTEC GmbH Kationisch stabilisierte wässrige Silicadispersion, Verfahren zu deren Herstellung und deren Verwendung

Also Published As

Publication number Publication date
PL2145986T3 (pl) 2010-09-30
CN102066622A (zh) 2011-05-18
ES2339614T3 (es) 2010-05-21
JP2011528063A (ja) 2011-11-10
ATE462025T1 (de) 2010-04-15
CA2723827A1 (fr) 2010-01-21
CN102066622B (zh) 2013-03-27
EP2145986A1 (fr) 2010-01-20
EP2145986B1 (fr) 2010-03-24
WO2010006800A1 (fr) 2010-01-21
US20110132766A1 (en) 2011-06-09
BRPI0915785A2 (pt) 2015-11-10
DE602008000878D1 (de) 2010-05-06
JP5674655B2 (ja) 2015-02-25

Similar Documents

Publication Publication Date Title
JP5674655B2 (ja) 基材上に金属を電着する方法
Thiemig et al. Characterization of electrodeposited Ni–TiO2 nanocomposite coatings
CN101435094B (zh) 镀铜浴的配方
TWI550138B (zh) 用於製備暗鉻層之電鍍浴及方法
Kumar et al. Factor effecting electro-deposition process
US8025963B2 (en) Nanoporous filter
KR101242879B1 (ko) 폴리비닐암모늄 화합물, 이의 제조 방법, 상기 화합물을함유하는 산성 용액 및 구리 침착물의 전해 침착 방법
US20080302668A1 (en) Electrolyte and process for depositing a matt metal layer
CA1063966A (fr) Methode d'electrodeposition
TWI298089B (en) Acid plating bath and method for the electrolytic deposition of satin nickel deposits
WO2008157612A1 (fr) Codéposition de nanoparticules de cuivre dans le remplissage de trous d'interconnexion dans du silicium
TWI670398B (zh) 具有陽離子聚合物的鎳電鍍組合物及電鍍鎳的方法
CN111511962B (zh) 表面活化的聚合物
CN103741178B (zh) 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法
CN107787378A (zh) 在聚合物片材上镀覆青铜
CN111286767B (zh) 一种仿金电镀液电镀方法及仿金电镀液
Finke et al. An Electrochemical Bottom‐Up Approach to Producing Nanostructured Electrodes Based on Nanocolumnar ZnO Acting as a Self‐Assembled Template
RU2169798C1 (ru) Способ получения композиционных покрытий на основе цинка
JP5943370B2 (ja) 光沢アルミニウム材料の製造方法
CN208485955U (zh) 一种化学镀镍装置
TWI689628B (zh) 具有精胺酸與雙環氧化物之共聚物的鎳電鍍組合物及電鍍鎳之方法
Belhamel et al. Electrodeposition and morphology analysis of nickel nanoparticles from sulphate bath
Bund et al. Electrodeposition of Cu/Alumina and Ni/Alumina Nanocomposites
CN112251781A (zh) 一种无氰镀铜液及其制备方法以及无氰镀铜方法
JPH0575837B2 (fr)

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid