PL2145986T3 - Roztwór i sposób elektrochemicznego osadzania metalu na substracie - Google Patents

Roztwór i sposób elektrochemicznego osadzania metalu na substracie

Info

Publication number
PL2145986T3
PL2145986T3 PL08075637T PL08075637T PL2145986T3 PL 2145986 T3 PL2145986 T3 PL 2145986T3 PL 08075637 T PL08075637 T PL 08075637T PL 08075637 T PL08075637 T PL 08075637T PL 2145986 T3 PL2145986 T3 PL 2145986T3
Authority
PL
Poland
Prior art keywords
solution
metal
silica particles
substrate
quaternized
Prior art date
Application number
PL08075637T
Other languages
English (en)
Inventor
Hermann-Josef Middeke
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL2145986T3 publication Critical patent/PL2145986T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Battery Electrode And Active Subsutance (AREA)
PL08075637T 2008-07-15 2008-07-15 Roztwór i sposób elektrochemicznego osadzania metalu na substracie PL2145986T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08075637A EP2145986B1 (en) 2008-07-15 2008-07-15 Solution and method for electrochemically depositing a metal on a substrate

Publications (1)

Publication Number Publication Date
PL2145986T3 true PL2145986T3 (pl) 2010-09-30

Family

ID=40010705

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08075637T PL2145986T3 (pl) 2008-07-15 2008-07-15 Roztwór i sposób elektrochemicznego osadzania metalu na substracie

Country Status (12)

Country Link
US (1) US20110132766A1 (pl)
EP (1) EP2145986B1 (pl)
JP (1) JP5674655B2 (pl)
KR (1) KR20110039438A (pl)
CN (1) CN102066622B (pl)
AT (1) ATE462025T1 (pl)
BR (1) BRPI0915785A2 (pl)
CA (1) CA2723827A1 (pl)
DE (1) DE602008000878D1 (pl)
ES (1) ES2339614T3 (pl)
PL (1) PL2145986T3 (pl)
WO (1) WO2010006800A1 (pl)

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US20110155582A1 (en) 2009-11-18 2011-06-30 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
EP2551375A1 (en) * 2011-07-26 2013-01-30 Atotech Deutschland GmbH Electroless nickel plating bath composition
US8871077B2 (en) * 2011-10-14 2014-10-28 GM Global Technology Operations LLC Corrosion-resistant plating system
JP6024714B2 (ja) 2013-10-03 2016-11-16 トヨタ自動車株式会社 成膜用ニッケル溶液およびこれを用いた成膜方法
DE102014207778B3 (de) 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht
US20170096732A1 (en) * 2014-06-23 2017-04-06 Hewlett-Packard Development Company, L.P. Multilayer coatings on substrates
JP2017538860A (ja) * 2014-10-24 2017-12-28 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 固体粒子の表面荷電を改変するための、非両性の四級化可能な水溶性ポリマー
CN104790004A (zh) * 2015-03-11 2015-07-22 嘉兴敏惠汽车零部件有限公司 镀镍和\或铬部件及其制造方法
JP6524939B2 (ja) * 2016-02-26 2019-06-05 豊田合成株式会社 ニッケルめっき皮膜及びその製造方法
EP3456870A1 (en) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
PL238262B1 (pl) * 2017-12-04 2021-08-02 Zakl Wyrobow Galanteryjnych Spolka Z Ograniczona Odpowiedzialnoscia Sposób elektrochemicznego wytwarzania wielowarstwowych powłok metalicznych, zwłaszcza niklowych, o zwiększonej odporności na korozję
DE102018005348A1 (de) * 2018-07-05 2020-01-09 Dr.-Ing. Max Schlötter GmbH & Co KG Silberelektrolyt zur Abscheidung von Dispersions-Silberschichten und Kontaktoberflächen mit Dispersions-Silberschichten
CN108914173B (zh) * 2018-07-13 2021-03-23 中国科学院金属研究所 一种含有二氧化硅颗粒的铁镍复合镀层的制备方法
CN109183131B (zh) * 2018-07-16 2020-06-16 东南大学 一种SiO2基复合超疏水金属表面的制备方法
CN112899741B (zh) * 2021-01-21 2022-03-15 长春理工大学 在金属表面加工二氧化硅-镍复合疏水耐腐蚀涂层的方法
CN113436775B (zh) * 2021-06-23 2022-11-08 中国核动力研究设计院 一种无衬底超薄镍-63放射源的制备方法
CN115012008B (zh) * 2022-03-31 2023-09-19 九牧厨卫股份有限公司 一种提高附着力的环保复合涂镀层及其制备方法
CN118272877B (zh) * 2024-04-07 2024-10-15 深圳御矿新材料有限公司 高强度铝镁合金预镀镍带材及其生成工艺

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Also Published As

Publication number Publication date
ATE462025T1 (de) 2010-04-15
JP5674655B2 (ja) 2015-02-25
ES2339614T3 (es) 2010-05-21
EP2145986A1 (en) 2010-01-20
WO2010006800A1 (en) 2010-01-21
CN102066622B (zh) 2013-03-27
JP2011528063A (ja) 2011-11-10
CN102066622A (zh) 2011-05-18
EP2145986B1 (en) 2010-03-24
US20110132766A1 (en) 2011-06-09
DE602008000878D1 (de) 2010-05-06
KR20110039438A (ko) 2011-04-18
CA2723827A1 (en) 2010-01-21
BRPI0915785A2 (pt) 2015-11-10

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