ES2339614T3 - Solucion y metodo para depositar electroquimicamente un metal sobre un sustrato. - Google Patents
Solucion y metodo para depositar electroquimicamente un metal sobre un sustrato. Download PDFInfo
- Publication number
- ES2339614T3 ES2339614T3 ES08075637T ES08075637T ES2339614T3 ES 2339614 T3 ES2339614 T3 ES 2339614T3 ES 08075637 T ES08075637 T ES 08075637T ES 08075637 T ES08075637 T ES 08075637T ES 2339614 T3 ES2339614 T3 ES 2339614T3
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- Spain
- Prior art keywords
- nickel
- layer
- silica particles
- solution
- silica
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 32
- 239000002184 metal Substances 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 title claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 156
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 8
- VUEDNLCYHKSELL-UHFFFAOYSA-N arsonium Chemical compound [AsH4+] VUEDNLCYHKSELL-UHFFFAOYSA-N 0.000 claims abstract description 7
- 125000000524 functional group Chemical group 0.000 claims abstract description 6
- 150000002500 ions Chemical class 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 330
- 229910052759 nickel Inorganic materials 0.000 claims description 166
- 238000005260 corrosion Methods 0.000 claims description 22
- 230000007797 corrosion Effects 0.000 claims description 22
- 239000000126 substance Substances 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 9
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 5
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 125000005496 phosphonium group Chemical group 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 3
- 239000003153 chemical reaction reagent Substances 0.000 claims description 3
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 3
- 238000000151 deposition Methods 0.000 abstract description 45
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 12
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 abstract description 3
- 239000011148 porous material Substances 0.000 description 57
- 239000000243 solution Substances 0.000 description 57
- 239000002245 particle Substances 0.000 description 46
- 239000000377 silicon dioxide Substances 0.000 description 45
- 230000008021 deposition Effects 0.000 description 39
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 33
- 239000003792 electrolyte Substances 0.000 description 31
- 239000000463 material Substances 0.000 description 22
- 238000004070 electrodeposition Methods 0.000 description 16
- 125000000217 alkyl group Chemical group 0.000 description 14
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 13
- 125000001072 heteroaryl group Chemical group 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 239000000654 additive Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 239000011651 chromium Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000009826 distribution Methods 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 229910000831 Steel Inorganic materials 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 229910052804 chromium Inorganic materials 0.000 description 9
- 150000002430 hydrocarbons Chemical group 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 8
- -1 amino organosilicon compound Chemical class 0.000 description 7
- 239000008151 electrolyte solution Substances 0.000 description 7
- 229940021013 electrolyte solution Drugs 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 7
- 229940081974 saccharin Drugs 0.000 description 7
- 235000019204 saccharin Nutrition 0.000 description 7
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 7
- 229910000077 silane Inorganic materials 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 6
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 6
- 239000004327 boric acid Substances 0.000 description 6
- 239000013065 commercial product Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 231100001010 corrosive Toxicity 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 5
- 238000013019 agitation Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 5
- 208000014451 palmoplantar keratoderma and congenital alopecia 2 Diseases 0.000 description 5
- 239000011541 reaction mixture Substances 0.000 description 5
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 4
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 229910008051 Si-OH Inorganic materials 0.000 description 3
- 229910006358 Si—OH Inorganic materials 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 3
- 150000002815 nickel Chemical class 0.000 description 3
- 239000012811 non-conductive material Substances 0.000 description 3
- 239000006259 organic additive Substances 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 238000009827 uniform distribution Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- 241000080590 Niso Species 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 2
- 230000004584 weight gain Effects 0.000 description 2
- 235000019786 weight gain Nutrition 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WXOMTJVVIMOXJL-BOBFKVMVSA-A O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)OS(=O)(=O)OC[C@H]1O[C@@H](O[C@]2(COS(=O)(=O)O[Al](O)O)O[C@H](OS(=O)(=O)O[Al](O)O)[C@@H](OS(=O)(=O)O[Al](O)O)[C@@H]2OS(=O)(=O)O[Al](O)O)[C@H](OS(=O)(=O)O[Al](O)O)[C@@H](OS(=O)(=O)O[Al](O)O)[C@@H]1OS(=O)(=O)O[Al](O)O Chemical compound O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)O.O[Al](O)OS(=O)(=O)OC[C@H]1O[C@@H](O[C@]2(COS(=O)(=O)O[Al](O)O)O[C@H](OS(=O)(=O)O[Al](O)O)[C@@H](OS(=O)(=O)O[Al](O)O)[C@@H]2OS(=O)(=O)O[Al](O)O)[C@H](OS(=O)(=O)O[Al](O)O)[C@@H](OS(=O)(=O)O[Al](O)O)[C@@H]1OS(=O)(=O)O[Al](O)O WXOMTJVVIMOXJL-BOBFKVMVSA-A 0.000 description 1
- 229910002054 SYLOID® 244 FP SILICA Inorganic materials 0.000 description 1
- 229910020175 SiOH Inorganic materials 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- IIWMSIPKUVXHOO-UHFFFAOYSA-N ethyl hexyl sulfate Chemical compound CCCCCCOS(=O)(=O)OCC IIWMSIPKUVXHOO-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 125000002541 furyl group Chemical group 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052914 metal silicate Inorganic materials 0.000 description 1
- CXIHYTLHIDQMGN-UHFFFAOYSA-L methanesulfonate;nickel(2+) Chemical compound [Ni+2].CS([O-])(=O)=O.CS([O-])(=O)=O CXIHYTLHIDQMGN-UHFFFAOYSA-L 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 150000002816 nickel compounds Chemical class 0.000 description 1
- HKFZDVPCCOOGEV-UHFFFAOYSA-N nickel(3+);borate Chemical compound [Ni+3].[O-]B([O-])[O-] HKFZDVPCCOOGEV-UHFFFAOYSA-N 0.000 description 1
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 1
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002892 organic cations Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical class OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 description 1
- UOCCVDMCNJYVIW-UHFFFAOYSA-N prop-2-yne-1-sulfonic acid Chemical class OS(=O)(=O)CC#C UOCCVDMCNJYVIW-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 125000003226 pyrazolyl group Chemical group 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 239000011686 zinc sulphate Substances 0.000 description 1
- 235000009529 zinc sulphate Nutrition 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/02—Electrophoretic coating characterised by the process with inorganic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrodes Of Semiconductors (AREA)
- Laminated Bodies (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08075637A EP2145986B1 (en) | 2008-07-15 | 2008-07-15 | Solution and method for electrochemically depositing a metal on a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2339614T3 true ES2339614T3 (es) | 2010-05-21 |
Family
ID=40010705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES08075637T Active ES2339614T3 (es) | 2008-07-15 | 2008-07-15 | Solucion y metodo para depositar electroquimicamente un metal sobre un sustrato. |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US20110132766A1 (pl) |
| EP (1) | EP2145986B1 (pl) |
| JP (1) | JP5674655B2 (pl) |
| KR (1) | KR20110039438A (pl) |
| CN (1) | CN102066622B (pl) |
| AT (1) | ATE462025T1 (pl) |
| BR (1) | BRPI0915785A2 (pl) |
| CA (1) | CA2723827A1 (pl) |
| DE (1) | DE602008000878D1 (pl) |
| ES (1) | ES2339614T3 (pl) |
| PL (1) | PL2145986T3 (pl) |
| WO (1) | WO2010006800A1 (pl) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110155582A1 (en) | 2009-11-18 | 2011-06-30 | Tremmel Robert A | Semi-Bright Nickel Plating Bath and Method of Using Same |
| EP2551375A1 (en) * | 2011-07-26 | 2013-01-30 | Atotech Deutschland GmbH | Electroless nickel plating bath composition |
| US8871077B2 (en) * | 2011-10-14 | 2014-10-28 | GM Global Technology Operations LLC | Corrosion-resistant plating system |
| JP6024714B2 (ja) * | 2013-10-03 | 2016-11-16 | トヨタ自動車株式会社 | 成膜用ニッケル溶液およびこれを用いた成膜方法 |
| DE102014207778B3 (de) * | 2014-04-25 | 2015-05-21 | Kiesow Dr. Brinkmann GmbH & Co. KG | Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht |
| CN106471158B (zh) * | 2014-06-23 | 2019-05-31 | 惠普发展公司有限责任合伙企业 | 制造多层涂层的方法以及涂覆的基材 |
| CN107075712A (zh) * | 2014-10-24 | 2017-08-18 | 巴斯夫欧洲公司 | 改变固体颗粒的表面电荷的非两性、可季化和水溶性聚合物 |
| CN104790004A (zh) * | 2015-03-11 | 2015-07-22 | 嘉兴敏惠汽车零部件有限公司 | 镀镍和\或铬部件及其制造方法 |
| JP6524939B2 (ja) * | 2016-02-26 | 2019-06-05 | 豊田合成株式会社 | ニッケルめっき皮膜及びその製造方法 |
| EP3456870A1 (en) * | 2017-09-13 | 2019-03-20 | ATOTECH Deutschland GmbH | A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy |
| PL238262B1 (pl) * | 2017-12-04 | 2021-08-02 | Zakl Wyrobow Galanteryjnych Spolka Z Ograniczona Odpowiedzialnoscia | Sposób elektrochemicznego wytwarzania wielowarstwowych powłok metalicznych, zwłaszcza niklowych, o zwiększonej odporności na korozję |
| DE102018005348B4 (de) * | 2018-07-05 | 2025-12-04 | Dr.-Ing. Max Schlötter GmbH & Co KG | Kontaktoberflächen mit Dispersions-Silberschichten |
| CN108914173B (zh) * | 2018-07-13 | 2021-03-23 | 中国科学院金属研究所 | 一种含有二氧化硅颗粒的铁镍复合镀层的制备方法 |
| CN109183131B (zh) * | 2018-07-16 | 2020-06-16 | 东南大学 | 一种SiO2基复合超疏水金属表面的制备方法 |
| CN112899741B (zh) * | 2021-01-21 | 2022-03-15 | 长春理工大学 | 在金属表面加工二氧化硅-镍复合疏水耐腐蚀涂层的方法 |
| CN113436775B (zh) * | 2021-06-23 | 2022-11-08 | 中国核动力研究设计院 | 一种无衬底超薄镍-63放射源的制备方法 |
| CN115012008B (zh) * | 2022-03-31 | 2023-09-19 | 九牧厨卫股份有限公司 | 一种提高附着力的环保复合涂镀层及其制备方法 |
| CN118272877B (zh) * | 2024-04-07 | 2024-10-15 | 深圳御矿新材料有限公司 | 高强度铝镁合金预镀镍带材及其生成工艺 |
| CN119530910A (zh) * | 2024-12-03 | 2025-02-28 | 崇辉半导体(江门)有限公司 | 一种电镀粗镍的工艺 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL123689C (pl) * | 1962-05-30 | |||
| GB1051685A (pl) * | 1963-03-01 | |||
| US3866289A (en) * | 1969-10-06 | 1975-02-18 | Oxy Metal Finishing Corp | Micro-porous chromium on nickel-cobalt duplex composite plates |
| GB1282373A (en) * | 1969-10-15 | 1972-07-19 | A I C Approvvigionamenti Ind C | Nickel-chromium electroplating |
| DE2236443C3 (de) * | 1972-07-25 | 1978-05-24 | Elektroschmelzwerk Kempten Gmbh, 8000 Muenchen | Wäßriges Bad zur Herstellung von metallischen Überzügen, die nichtmetallische, feinverteilte Feststoffe eingelagert enthalten |
| US3825478A (en) * | 1972-10-30 | 1974-07-23 | Oxy Metal Finishing Corp | Electrolyte and method for electrodepositing microporous chromium-nickel composite coatings |
| JPS534498B2 (pl) * | 1973-06-23 | 1978-02-17 | ||
| SU475874A1 (ru) | 1973-07-24 | 1977-12-05 | Ордена Трудового Красного Знамени Институт Химии И Химической Технологии Ан Литовской Сср | Электролит дл нанесени никелевого покрыти с внедренными инертными частицами |
| US4222828A (en) * | 1978-06-06 | 1980-09-16 | Akzo N.V. | Process for electro-codepositing inorganic particles and a metal on a surface |
| JPS61143597A (ja) | 1984-12-15 | 1986-07-01 | Okayama Pref Gov | 亜鉛−シリカ複合めつき鋼材の製造方法 |
| US4734350A (en) * | 1986-12-29 | 1988-03-29 | Xerox Corporation | Positively charged developer compositions with modified charge enhancing additives containing amino alcohols |
| JPS63277797A (ja) * | 1987-05-11 | 1988-11-15 | Kobe Steel Ltd | 複合めっき法 |
| JPH01309997A (ja) * | 1988-06-09 | 1989-12-14 | Kanto Kasei Kogyo Kk | 耐食性に優れた銅−ニッケル−クロム光沢電気めっき方法およびそれにより得られためっき皮膜 |
| BE1002885A7 (fr) * | 1989-03-03 | 1991-07-16 | Centre Rech Metallurgique | Produit en acier pourvu d'un revetement composite et procede de depot d'un tel revetement. |
| JP2741126B2 (ja) * | 1991-12-16 | 1998-04-15 | 荏原ユージライト株式会社 | ニッケル−クロムめっき製品 |
| JPH05331693A (ja) * | 1992-05-27 | 1993-12-14 | Mitsubishi Heavy Ind Ltd | 電気めっき鋼板及びその製造方法 |
| US5332505A (en) * | 1992-10-02 | 1994-07-26 | Betz Laboratories, Inc. | Method for inhibiting silica and silicate deposition |
| JPH06146070A (ja) * | 1992-10-30 | 1994-05-27 | Toyoda Gosei Co Ltd | 装飾クロムめっき皮膜の形成方法 |
| JPH07278845A (ja) * | 1994-04-14 | 1995-10-24 | Marui Kogyo Kk | クロムめっき製品及びその製造方法 |
| JPH10251870A (ja) * | 1998-03-09 | 1998-09-22 | Marui Kogyo Kk | クロムめっき製品 |
| JP2000313997A (ja) * | 1999-04-26 | 2000-11-14 | Osaka Gas Co Ltd | 複合メッキ液および複合メッキ被膜の形成方法 |
| DE10144250A1 (de) * | 2001-08-31 | 2003-04-03 | Fraunhofer Ges Forschung | Verbesserte massenspektrometrische Analyse unter Verwendung von Nanopartikeln |
| DE10164309A1 (de) * | 2001-12-28 | 2003-07-10 | Fraunhofer Ges Forschung | Verbesserte strukturiert-funktionale Bindematrices für Biomoleküle |
| CN1394988A (zh) * | 2002-08-20 | 2003-02-05 | 中国科学院电子学研究所 | 单槽法镀多层镍工艺 |
| CN100513650C (zh) * | 2003-11-21 | 2009-07-15 | 关西工程有限会社 | 镀镍金属线材、经拉丝加工的金属线材、电镀装置及方法 |
| US7435450B2 (en) * | 2004-01-30 | 2008-10-14 | Hewlett-Packard Development Company, L.P. | Surface modification of silica in an aqueous environment |
| DE102004021092A1 (de) | 2004-04-29 | 2005-11-24 | Degussa Ag | Verwendung einer kationischen Siliciumdioxid-Dispersion als Textilveredlungsmittel |
| CL2007000734A1 (es) * | 2006-03-22 | 2008-05-02 | Grace W R & Co | Revestimiento de oxido inorganico transparente producido al preparar composicion de revestimiento que comprende particulas de oxido inorganico y polimero, aplicar composicion sobre sustrato, formar revestimiento y calentar el revestimiento para elimi |
| DE102007012578A1 (de) * | 2006-09-01 | 2008-03-06 | Bühler PARTEC GmbH | Kationisch stabilisierte wässrige Silicadispersion, Verfahren zu deren Herstellung und deren Verwendung |
-
2008
- 2008-07-15 EP EP08075637A patent/EP2145986B1/en active Active
- 2008-07-15 DE DE602008000878T patent/DE602008000878D1/de active Active
- 2008-07-15 ES ES08075637T patent/ES2339614T3/es active Active
- 2008-07-15 PL PL08075637T patent/PL2145986T3/pl unknown
- 2008-07-15 AT AT08075637T patent/ATE462025T1/de active
-
2009
- 2009-07-10 WO PCT/EP2009/005192 patent/WO2010006800A1/en not_active Ceased
- 2009-07-10 JP JP2011517816A patent/JP5674655B2/ja not_active Expired - Fee Related
- 2009-07-10 CA CA2723827A patent/CA2723827A1/en not_active Abandoned
- 2009-07-10 KR KR1020117000690A patent/KR20110039438A/ko not_active Withdrawn
- 2009-07-10 CN CN2009801225315A patent/CN102066622B/zh active Active
- 2009-07-10 US US12/994,325 patent/US20110132766A1/en not_active Abandoned
- 2009-07-10 BR BRPI0915785A patent/BRPI0915785A2/pt not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP2145986A1 (en) | 2010-01-20 |
| CN102066622B (zh) | 2013-03-27 |
| DE602008000878D1 (de) | 2010-05-06 |
| WO2010006800A1 (en) | 2010-01-21 |
| JP5674655B2 (ja) | 2015-02-25 |
| CA2723827A1 (en) | 2010-01-21 |
| KR20110039438A (ko) | 2011-04-18 |
| BRPI0915785A2 (pt) | 2015-11-10 |
| US20110132766A1 (en) | 2011-06-09 |
| JP2011528063A (ja) | 2011-11-10 |
| PL2145986T3 (pl) | 2010-09-30 |
| ATE462025T1 (de) | 2010-04-15 |
| CN102066622A (zh) | 2011-05-18 |
| EP2145986B1 (en) | 2010-03-24 |
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