KR20110004334A - 광반도체 봉지용 경화성 수지 조성물, 그의 경화물 및 이를 포함하는 광반도체 장치 - Google Patents

광반도체 봉지용 경화성 수지 조성물, 그의 경화물 및 이를 포함하는 광반도체 장치 Download PDF

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Publication number
KR20110004334A
KR20110004334A KR1020100065290A KR20100065290A KR20110004334A KR 20110004334 A KR20110004334 A KR 20110004334A KR 1020100065290 A KR1020100065290 A KR 1020100065290A KR 20100065290 A KR20100065290 A KR 20100065290A KR 20110004334 A KR20110004334 A KR 20110004334A
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KR
South Korea
Prior art keywords
resin composition
epoxy resin
curable resin
compound
hardening
Prior art date
Application number
KR1020100065290A
Other languages
English (en)
Korean (ko)
Inventor
요시히로 가와다
마사타카 나카니시
켄이치 구보키
나오후사 미야가와
치에 사사키
시즈카 아오키
즈이칸 스즈키
히로오 고야나기
Original Assignee
닛뽄 가야쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛뽄 가야쿠 가부시키가이샤 filed Critical 닛뽄 가야쿠 가부시키가이샤
Publication of KR20110004334A publication Critical patent/KR20110004334A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020100065290A 2009-07-07 2010-07-07 광반도체 봉지용 경화성 수지 조성물, 그의 경화물 및 이를 포함하는 광반도체 장치 KR20110004334A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009161089A JP5348764B2 (ja) 2009-07-07 2009-07-07 光半導体封止用硬化性樹脂組成物、及びその硬化物
JPJP-P-2009-161089 2009-07-07

Publications (1)

Publication Number Publication Date
KR20110004334A true KR20110004334A (ko) 2011-01-13

Family

ID=43434296

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100065290A KR20110004334A (ko) 2009-07-07 2010-07-07 광반도체 봉지용 경화성 수지 조성물, 그의 경화물 및 이를 포함하는 광반도체 장치

Country Status (4)

Country Link
JP (1) JP5348764B2 (zh)
KR (1) KR20110004334A (zh)
CN (1) CN101942073B (zh)
TW (1) TWI500650B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103304959A (zh) * 2012-03-13 2013-09-18 东莞市宝涵轻工科技有限公司 不黄变的白色环氧树脂电子灌封胶及制备方法
JP2014018109A (ja) * 2012-07-13 2014-02-03 Mitsubishi Plastics Inc 農業用多層フィルム
WO2014014025A1 (ja) * 2012-07-20 2014-01-23 日立化成株式会社 銀硫化防止材、銀硫化防止膜の形成方法、発光装置の製造方法及び発光装置
JP6162557B2 (ja) * 2012-09-21 2017-07-12 日本化薬株式会社 透明接着材料
CN102881838B (zh) * 2012-09-28 2016-08-10 京东方科技集团股份有限公司 发光器件的封装结构及封装方法、显示装置
JP6625983B2 (ja) 2013-12-20 2019-12-25 スリーエム イノベイティブ プロパティズ カンパニー 改善されたエッジ侵入を有する量子ドット物品
JP6331758B2 (ja) * 2014-06-25 2018-05-30 味の素株式会社 樹脂組成物
CN106471421B (zh) * 2014-07-03 2019-07-09 3M创新有限公司 具有减小的边缘侵入和改善的颜色稳定性的量子点制品
CN104559060A (zh) * 2014-12-31 2015-04-29 东莞市赛恩思实业有限公司 无卤阻燃led封装环氧树脂组合物及其制备方法
CN105199079B (zh) * 2015-10-30 2019-01-29 江苏华海诚科新材料有限公司 一种led支架用高强度白色反光环氧树脂组合物
CN105602503A (zh) * 2016-01-26 2016-05-25 陕西工业职业技术学院 一种室温储存型led固晶胶组合物及其制备方法
CN106634750A (zh) * 2016-12-11 2017-05-10 雷笑天 一种高韧性耐高温环氧胶黏剂的制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1682599A1 (en) * 2003-11-03 2006-07-26 Union Carbide Chemicals & Plastics Technology Corporation Tougher cycloaliphatic epoxide resins
JP2008081596A (ja) * 2006-09-27 2008-04-10 Mitsubishi Gas Chem Co Inc 透明樹脂組成物

Also Published As

Publication number Publication date
CN101942073B (zh) 2015-03-18
TW201111407A (en) 2011-04-01
TWI500650B (zh) 2015-09-21
JP5348764B2 (ja) 2013-11-20
JP2011016880A (ja) 2011-01-27
CN101942073A (zh) 2011-01-12

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