KR20100080819A - 광전 반도체 몸체 - Google Patents

광전 반도체 몸체 Download PDF

Info

Publication number
KR20100080819A
KR20100080819A KR1020107009324A KR20107009324A KR20100080819A KR 20100080819 A KR20100080819 A KR 20100080819A KR 1020107009324 A KR1020107009324 A KR 1020107009324A KR 20107009324 A KR20107009324 A KR 20107009324A KR 20100080819 A KR20100080819 A KR 20100080819A
Authority
KR
South Korea
Prior art keywords
layer
substrate
semiconductor
semiconductor body
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107009324A
Other languages
English (en)
Korean (ko)
Inventor
패트릭 로드
칼 잉글
마틴 슈트라스버그
루츠 호펠
매티아스 사바틸
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20100080819A publication Critical patent/KR20100080819A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/835Reflective materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/8215Bodies characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

Landscapes

  • Led Devices (AREA)
KR1020107009324A 2007-09-28 2008-08-27 광전 반도체 몸체 Ceased KR20100080819A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102007049772 2007-09-28
DE102007049772.7 2007-09-28
DE102008021403.5 2008-04-29
DE102008021403A DE102008021403A1 (de) 2007-09-28 2008-04-29 Optoelektronischer Halbleiterkörper und Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
KR20100080819A true KR20100080819A (ko) 2010-07-12

Family

ID=40384515

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107009324A Ceased KR20100080819A (ko) 2007-09-28 2008-08-27 광전 반도체 몸체

Country Status (8)

Country Link
US (1) US8362506B2 (https=)
EP (1) EP2193555B1 (https=)
JP (1) JP2010541216A (https=)
KR (1) KR20100080819A (https=)
CN (1) CN101796660B (https=)
DE (1) DE102008021403A1 (https=)
TW (1) TWI431802B (https=)
WO (1) WO2009039812A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8766287B2 (en) 2010-12-20 2014-07-01 Lg Innotek Co., Ltd. Light emitting device, light emitting device package, and lighting device with the same

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007022947B4 (de) 2007-04-26 2022-05-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
DE102008032318A1 (de) 2008-03-31 2009-10-01 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines solchen
DE102008039790B4 (de) * 2008-08-26 2022-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102009019524B4 (de) * 2009-04-30 2023-07-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper mit einem reflektierenden Schichtsystem
TWI487141B (zh) * 2009-07-15 2015-06-01 榮創能源科技股份有限公司 提高光萃取效率之半導體光電結構及其製造方法
KR100999779B1 (ko) * 2010-02-01 2010-12-08 엘지이노텍 주식회사 발광소자, 발광소자의 제조방법 및 발광소자 패키지
KR101038923B1 (ko) * 2010-02-02 2011-06-03 전북대학교산학협력단 개선된 발광 효율을 갖는 발광 다이오드 및 이의 제조방법
KR101692410B1 (ko) * 2010-07-26 2017-01-03 삼성전자 주식회사 발광소자 및 그 제조방법
US9070851B2 (en) * 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
DE102011114865B4 (de) 2011-07-29 2023-03-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102012217533A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements
JP6529223B2 (ja) * 2014-06-30 2019-06-12 晶元光電股▲ふん▼有限公司Epistar Corporation 光電部品
DE102015104144A1 (de) * 2015-03-19 2016-09-22 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines optoelektronischen Halbleiterkörpers
CN108139035B (zh) 2015-09-29 2020-07-10 昕诺飞控股有限公司 具有衍射耦出的光源
FR3059788B1 (fr) * 2016-12-02 2019-01-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optoelectronique a diode electroluminescente a extraction augmentee
US11355549B2 (en) 2017-12-29 2022-06-07 Lumileds Llc High density interconnect for segmented LEDs
JP6843916B2 (ja) * 2019-05-14 2021-03-17 晶元光電股▲ふん▼有限公司Epistar Corporation 光電部品
DE102019114315B4 (de) * 2019-05-28 2025-04-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anordnung und verfahren zur herstellung einer anordnung
JP7223046B2 (ja) * 2021-02-24 2023-02-15 晶元光電股▲ふん▼有限公司 光電部品

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6031243A (en) * 1996-10-16 2000-02-29 Geoff W. Taylor Grating coupled vertical cavity optoelectronic devices
JP4432180B2 (ja) * 1999-12-24 2010-03-17 豊田合成株式会社 Iii族窒化物系化合物半導体の製造方法、iii族窒化物系化合物半導体素子及びiii族窒化物系化合物半導体
US7053419B1 (en) * 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US7064355B2 (en) * 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US6791119B2 (en) * 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
JP4055503B2 (ja) * 2001-07-24 2008-03-05 日亜化学工業株式会社 半導体発光素子
TW558844B (en) 2002-05-15 2003-10-21 Opto Tech Corp Light emitting diode capable of increasing light emitting brightness
JP2004241130A (ja) * 2003-02-03 2004-08-26 Seiko Epson Corp 発光ディスプレイパネルおよびその製造方法
US20050285128A1 (en) * 2004-02-10 2005-12-29 California Institute Of Technology Surface plasmon light emitter structure and method of manufacture
KR100568297B1 (ko) * 2004-03-30 2006-04-05 삼성전기주식회사 질화물 반도체 발광 소자 및 그 제조 방법
TWI299914B (en) 2004-07-12 2008-08-11 Epistar Corp Light emitting diode with transparent electrically conductive layer and omni directional reflector
KR100576870B1 (ko) * 2004-08-11 2006-05-10 삼성전기주식회사 질화물 반도체 발광소자 및 제조방법
KR100682872B1 (ko) * 2004-12-08 2007-02-15 삼성전기주식회사 고효율 반도체 발광 소자 및 그 제조방법
KR100624449B1 (ko) * 2004-12-08 2006-09-18 삼성전기주식회사 요철 구조를 포함하는 발광 소자 및 그 제조 방법
KR100657941B1 (ko) * 2004-12-31 2006-12-14 삼성전기주식회사 요철 구조를 포함하는 발광 소자 및 그 제조 방법
SG130975A1 (en) 2005-09-29 2007-04-26 Tinggi Tech Private Ltd Fabrication of semiconductor devices for light emission
JP2007165726A (ja) * 2005-12-15 2007-06-28 Sony Corp 半導体発光ダイオード
KR20070063731A (ko) * 2005-12-15 2007-06-20 엘지전자 주식회사 나노 패턴이 형성된 기판의 제조방법 및 그 기판을 이용한발광소자
JP2007214276A (ja) * 2006-02-08 2007-08-23 Mitsubishi Chemicals Corp 発光素子
JP2007324579A (ja) * 2006-05-01 2007-12-13 Mitsubishi Chemicals Corp 集積型半導体発光装置およびその製造方法
WO2008144922A1 (en) * 2007-06-01 2008-12-04 Trojan Technologies Ultraviolet radiation light emitting diode device
US7956370B2 (en) * 2007-06-12 2011-06-07 Siphoton, Inc. Silicon based solid state lighting

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8766287B2 (en) 2010-12-20 2014-07-01 Lg Innotek Co., Ltd. Light emitting device, light emitting device package, and lighting device with the same

Also Published As

Publication number Publication date
TWI431802B (zh) 2014-03-21
JP2010541216A (ja) 2010-12-24
WO2009039812A1 (de) 2009-04-02
US8362506B2 (en) 2013-01-29
TW200917537A (en) 2009-04-16
EP2193555B1 (de) 2016-07-06
US20100230698A1 (en) 2010-09-16
CN101796660A (zh) 2010-08-04
DE102008021403A1 (de) 2009-04-02
CN101796660B (zh) 2012-05-30
EP2193555A1 (de) 2010-06-09

Similar Documents

Publication Publication Date Title
KR20100080819A (ko) 광전 반도체 몸체
EP3563419B1 (en) Optoelectronic device with light-emitting diodes and method of manfacturing the same
US8405103B2 (en) Photonic crystal light emitting device and manufacturing method of the same
US7994519B2 (en) Semiconductor chip and method for producing a semiconductor chip
US8053789B2 (en) Light emitting device and fabrication method thereof
US10964843B2 (en) Patterned Si substrate-based LED epitaxial wafer and preparation method therefor
KR101631599B1 (ko) 발광 소자 및 그 제조 방법
US8237180B2 (en) Light emitting element including center electrode and thin wire electrode extending from periphery of the center electrode
US20100117070A1 (en) Textured semiconductor light-emitting devices
JP2009543372A (ja) 発光結晶構造体
KR20110030542A (ko) 광전 소자 제조 방법 및 광전 소자
US20130193448A1 (en) Patterned substrate and stacked light emitting diode
US20100224897A1 (en) Semiconductor optoelectronic device and method for forming the same
US20230155061A1 (en) Semiconductor light-emitting element and method of producing the same
US20090173965A1 (en) Method of manufacturing nitride semiconductor light emitting device and nitride semiconductor light emitting device manufactured using the method
CN101601142B (zh) 半导体芯片和用于制造半导体芯片的方法
KR20100023820A (ko) 금속 기판 위에 높은 효율을 지닌 자외선 수직 발광 다이오드를 제작하는 방법
KR101645755B1 (ko) 광전 반도체 소자
JP2008198876A (ja) GaN系LED素子および発光装置
KR20170039491A (ko) 요철 구조를 갖는 도전성 산화물층을 포함하는 발광 소자
CN112670386A (zh) 一种发光二极管及其制造方法
TWI437731B (zh) 一種具有提升光取出率之半導體光電元件及其製造方法
KR101163788B1 (ko) 질화물 반도체 발광소자 및 그 제조방법
US20190363234A1 (en) Optoelectronic Semiconductor Component and Method for Producing an Optoelectronic Semiconductor Component
JP2005197506A (ja) 窒化ガリウム基iii−v族化合物半導体発光ダイオードとその製造方法

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20100428

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20130819

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20140729

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20150421

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20140729

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I